JP2009166382A - Metal mold device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metal mold device by which positioning of a substrate is surely performed regardless of variety, maintenance is saved, and high quality of molded product can be maintained. <P>SOLUTION: The metal mold device is characterized in that a second substrate guide block 10 is oscillated coordinating with a mold-closing motion to press the edge of the substrate 5, and the opposite edge thereof is pushed to a first substrate guide block 9. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a mold apparatus that positions and clamps a substrate placed on an insert block by a substrate guide piece disposed oppositely.

In the resin sealing device, the work is loaded into a mold mold opened and positioned, and then clamped and resin-sealed. As the workpiece, a resin substrate or a lead frame is used, and is held together with the sealing resin in the carry-in device and carried into the mold. The workpiece is placed with a guide hole aligned with a guide pin protruding from the mold, and aligned with the mold cavity (see Patent Documents 1 and 2).
Japanese Utility Model Publication No. 04-79614 Japanese Patent Application Laid-Open No. 07-40388

However, the guide pins provided in the mold need to be replaced to match the pin positions when the workpiece type changes.
In addition, when the workpiece is an organic substrate, unlike the lead frame, the outer shape accuracy is not ensured and there is a case where there is no positioning hole for inserting the guide pin.
Further, when the organic substrate is carried into the mold and preheated, the substrate is likely to be stretched or warped, and a gap is generated between the positioning pins and blocks, causing the substrate to be displaced. Due to this positional deviation of the substrate, resin leakage to the side surface of the substrate occurs, production is stopped for maintenance, and the apparatus operating rate is reduced. Further, defective products are generated due to the misalignment of the molded product, and the molding quality deteriorates.

  An object of the present invention is to solve the above-described problems of the prior art and to provide a mold apparatus capable of saving maintenance and maintaining high molding quality by reliably positioning a substrate regardless of the type.

In order to achieve the above object, the present invention comprises the following arrangement.
That is, an insert block on which a substrate is placed in alignment with the cavity recess, a pot insert provided with a pot provided adjacent to the insert block and loaded with sealing resin to be supplied to the cavity recess, A chase block including a first substrate guide piece serving as a positioning reference along the substrate placement portion of the insert block, a second substrate guide piece that pushes the substrate end face to the opposite side across the substrate, and a mold In accordance with the mold closing operation of the mold, an operating mechanism is provided that swings the second board guide piece to push the board end face and presses the opposite end face of the board against the first board guide piece. Features.
The actuating mechanism includes a movable plate having an ejector pin provided below the chase block, and a first position where the second substrate guide piece is separated from the end surface of the substrate when the movable plate is moved up and down. The substrate is swung between a second position where the substrate is pressed against the first substrate guide piece while being in contact with the substrate end surface.
In addition, a piece movable member is erected on the movable plate so as to come into contact with the second substrate guide piece, and the piece movable member abuts on the second substrate guide piece in accordance with the vertical movement of the movable plate. The second substrate guide piece is swung between the first position and the second position by moving up and down in contact.
The actuating mechanism includes an ejector movable member connected to the movable plate, and when the movable plate is moved up and down through the ejector movable member, the second substrate guide piece is moved to the first position and the second position. It is characterized by rocking between.
The movable plate moves to a position where the tip of the ejector pin protrudes from the substrate mounting portion when the mold is opened, and the tip of the ejector pin faces the substrate mounting portion when the mold is closed. It is characterized by retracting into the insert block so as to be one or lower.
In addition, when the tip of the ejector pin is retracted from the substrate mounting portion and the substrate is abutted against the first substrate guide piece and positioned, the substrate is placed on the substrate mounting portion by the suction hole provided in the insert block. It is characterized by being fixed by adsorption.
In the mold open state, the first and second substrate guide pieces are urged by the elastic member so that the tip ends protrude from the mold clamping surface, and the first and second substrates are accompanied by the mold closing operation. The guide piece is pushed down to the mold clamping surface against the biasing of the elastic member.

If the mold apparatus is used, the second substrate guide piece is swung in accordance with the mold closing operation to push the substrate end surface and press the opposite end surface of the substrate against the first substrate guide piece. It is possible to reliably position the substrate whose outer shape accuracy is not secured to the mold. Therefore, the sealing resin can be prevented from wrapping around the side surface of the substrate, maintenance can be saved, and the apparatus operating rate can be improved. In addition, since the substrate can be reliably positioned, the sealing resin can be heat-cured at an accurate position, and the molded product can be prevented from being displaced and high molding quality can be maintained.
Further, when the movable plate is moved up and down, the second substrate guide piece is pressed against the first substrate guide piece while the second substrate guide piece is in contact with the first position separated from the end surface of the substrate and the substrate end surface. Since the position of the ejector pin supporting the substrate is vertically moved and the positioning operation is performed by the first and second substrate guide pieces, the substrate can be positioned efficiently according to the mold opening / closing operation. Can be done.

Further, the piece movable member is moved up and down in a state where it abuts on the second substrate guide piece in accordance with the up and down movement of the movable plate, so that the second substrate guide piece is moved between the first position and the second position. Since it is swung, when the ejector pin is operated, it is possible to position the substrate by swinging the second substrate guide piece only by moving the movable plate up and down, and a drive mechanism for the second substrate guide piece is separately provided. There is no need to provide it, and the configuration can be simplified.
Further, since the tip of the ejector pin protrudes from the substrate mounting portion to support the substrate when the mold is opened, it is easy to deliver and take out the substrate to the insert block.

  Hereinafter, a preferred embodiment of a mold apparatus according to the present invention will be described in detail with reference to the accompanying drawings. In the following embodiments, a transfer mold type mold apparatus will be described in which an organic substrate is used as a substrate, a cavity recess is formed on the upper mold side, and a pot is formed on the lower mold side.

In FIG. 6, the upper mold 1 is a movable mold in which a cavity recess 2, a cull 3, and a runner gate (not shown) are formed. The upper mold 1 and the lower mold 4 constitute a mold.
In FIG. 1, a lower mold 4 is a fixed mold and has the following configuration. An insert block 6 on which the substrate 5 is placed in alignment with the cavity recess 2 (see FIG. 6), a seal provided adjacent to one side of the insert block 6 and supplied to the cavity recess 2 (see FIG. 6) A pot insert 7 provided with a pot 7 a in which resin is loaded is supported by the chase block 8. The pot insert 7 is provided at the center of the mold, and the insert blocks 6 are provided on both sides thereof. A plunger 19 is provided in the pot 7a so as to be movable up and down.

  The chase block 8 includes two first substrate guide pieces 9 serving as a reference for positioning on the center side of the substrate mounting portion 6 a of the insert block 6, and the opposite end surface of the substrate 5 by pressing the substrate end surface. A combination with one second substrate guide piece 10 that presses against the first substrate guide piece 9 is provided for each opposing end face of the substrate 5 (see FIG. 7A). The second substrate guide piece 10 is swung in accordance with the mold closing operation by the operating mechanism. As will be described later, the substrate end surface is pushed and the opposite end surface of the substrate 5 is moved to the first substrate. Press against the guide piece 9.

  Below the chase block 8, there is provided a movable plate 12 having a plurality of ejector pins 11 erected. The ejector pins 11 pass through the chase block 8 and the insert block 6 and are provided so that the tip protrudes from the substrate mounting portion 6a. When the die is opened, the tip of the ejector pin 11 protrudes from the substrate platform 6a to support the lower surface of the substrate 5, and into the insert block 6 to a position where it is flush with the substrate platform 6a when the mold is closed. evacuate. Note that the ejector pin 11 may be retracted so as to be lower than a position flush with the substrate platform 6a. The movable plate 12 moves up and down by an ejector movable member 17 and the like which will be described later.

  The first substrate guide piece 9 is supported at the lower end side thereof by the chase block 8 via a first coil spring (an example of an elastic member) 13. The second substrate guide piece 10 is formed in an inverted T shape by a flat bottom portion 10b and a columnar guide portion 10c erected from the center portion of the bottom portion 10b. The second substrate guide piece 10 is supported at one end side of the bottom portion 10b by a piece movable pin (an example of a piece movable member) 14 and a second coil spring (an example of an elastic member) 15 and at the other end side a third portion. A coil spring (an example of an elastic member) 16 is supported. The second coil spring 15 is supported by the movable plate 12. The piece movable pin 14 is erected on the movable plate 12, and the tip portion enters the chase block 8. The distal end portion of the piece movable pin 14 is urged by the second coil spring 15 while being in contact with one end side of the bottom portion 10b of the second substrate guide piece 10, and pushes one end side of the bottom portion 10b. . The chase block 8 is provided with a guide ring 8 b that guides the vertical movement of the piece movable pin 14. The third coil spring 16 is provided in the chase block 8 and pushes the other end side of the bottom 10 b of the second substrate guide piece 10. The second substrate guide piece 10 swings around a pair of swinging shafts 10a respectively provided at the center portions of the opposing side surfaces of the bottom portion 10b. In the chase block 8, a pair of shaft guides 8 a are vertically provided on both sides of the second substrate guide piece 10. Each oscillating shaft 10a is inserted into a long hole of the shaft guide 8a and supported so as to be movable up and down along the long hole.

  The first substrate guide piece 9 is always urged upward by the first coil spring 13 and the second substrate guide piece 10 is always urged upward by the second and third coil springs 15 and 16. When the upper die 1 which is a movable die is closed, the first and second substrate guide pieces 9, 10 resist the urging force of the first to third coil springs 13, 15, 16 and the clamping surface of the mold And the mold is closed with the insert block 6. The “mold clamping surface” in the present embodiment is a surface where the upper mold 1 and the pot insert 7 of the lower mold 4 abut in a closed state, and the upper surface of the pot insert 7 and the lower surface of the upper mold 1 are The abutment surface that abuts.

The operating mechanism includes the movable plate 12, the piece movable pin 14, the ejector movable member 17 linked to the side surface portion of the movable plate 12, and the movable rod 18 linked to the lower surface portion of the ejector movable member 17.
The ejector movable member 17 moves up and down by the power transmitted through the movable rod 18 from an actuator (spring, solenoid, cylinder, motor, etc.) (not shown). When the movable plate 12 is moved downward through the ejector movable member 17, the columnar guide portion 10c of the second substrate guide piece 10 is moved from the first position where the columnar guide portion 10c is separated from the end surface of the substrate 5 around the swing shaft 10a. Oscillates to a second position where the first substrate guide piece 9 is pressed against the first substrate guide piece 9. For example, in FIG. 7A, the second substrate guide piece 10 provided on the right end side of the substrate 5 is abutted against two first substrate guide pieces 9 provided on the left end side facing each other. Positioned. Similarly, the second substrate guide piece 10 provided on the lower end side of the substrate 5 is abutted against the two first substrate guide pieces 9 provided on the opposite upper end side and positioned.
As a result, as shown in the figure, the two adjacent sides of the substrate 5 are respectively brought into contact with the specified positions on the mold side defined by the first substrate guide piece 9, and the positioning of the substrate 5 is completed. . The tip of the ejector pin 11 is retracted from the substrate platform 6a, and the substrate 5 is sucked and fixed by suction with a suction device (not shown) through the suction hole 6b while being placed on the substrate platform 6a. In addition, by taking the timing of the vertical movement of the ejector pins 11 that support the substrate 5 and the positioning operation by the first and second substrate guide pieces 9, 10, the substrate 5 can be positioned efficiently in accordance with the mold opening / closing operation. The

Next, an example of the mold opening / closing operation of the mold apparatus will be described with reference to FIGS.
In FIG. 1, when the mold is opened, the movable plate 12 moves to a position where it has moved upward. For this reason, the tip of the ejector pin 11 protrudes from the substrate mounting portion 6a, and delivery and removal of the substrate 5 to and from the insert block 6 is facilitated. The first substrate guide piece 9 is supported by being biased by the first coil spring 13 and protruding upward from the insert block 6 and the pot insert 7. Further, since the second substrate guide piece 10 has one end of the bottom 10b pushed up by the piece movable pin 14, the swing shaft 10a is pressed against the upper end of the shaft guide 8a, and the second substrate guide piece 10 rotates clockwise around the swing shaft 10a. The third coil spring 16 is pushed and shrunk and rotated by a predetermined amount in the direction.

  When the ejector pin 11 is in the ejected state, the substrate 5 is transported and set to the substrate platform 6a by a loader (not shown), and the sealing resin is put into the pot 7a. The substrate 5 is supported by ejector pins 11 protruding from the substrate mounting portion 6a.

  Next, in FIG. 2, the operating mechanism is operated by an actuator (not shown) to move the ejector movable member 17 and the movable rod 18 downward by a predetermined amount as indicated by the arrows in the figure. At this time, since the movable plate 12 also moves downward, the ejector pins 11 that support the substrate 5 are also retracted into the insert block 6. Further, since the movable movable pin 14 moves downward in the second substrate guide piece 10, the bottom part 10b is pushed back to the third coil spring 16, and the columnar guide part 10c rotates counterclockwise around the swing shaft 10a. Rotate a certain amount in the direction. At this time, the tip end portion of the columnar guide portion 10 c approaches the end surface of the substrate 5.

  In FIG. 3, when the movable plate 12 further moves down and moves to the down position, the tip of the ejector pin 11 is retracted into the insert block 6 so as to be flush with the substrate mounting portion 6a. In this case, the bottom surface of the substrate 5 is in close contact with the substrate platform 6a. On the other hand, the second substrate guide piece 10 further rotates counterclockwise around the swing shaft 10a by the bias of the third coil spring 16 because the piece movable pin 14 moves further downward, and the substrate 5 Then, the end surface is pushed and abutted against the first substrate guide piece 9 for positioning. As described above, when the ejector pin 11 is moved (retracted), the second substrate guide piece 10 can be swung to position the substrate 5 only by moving the movable plate 12 up and down. Next, after the placement and positioning of the substrate 5 is completed, the substrate 5 is sucked and held while being positioned by being sucked from the suction hole 6b.

  Next, in FIG. 4, the upper mold 1 is moved down to start the mold closing operation. At this time, the first and second substrate guide pieces 9, 10 are biased by the first to third coil springs 13, 15, 16 and are in a state in which the tip ends protrude from the insert block 6. In other words, the first and second substrate guide pieces 9, 10 are in a state in which the leading ends protrude from the mold clamping surface corresponding to the upper surface of the pot insert 7.

  In FIG. 5, when the upper die 1 further moves down, the first and second substrate guide pieces 9, 10 are lowered by the parting surface while being pushed down against the bias of each coil spring. At this time, the second substrate guide piece 10 pushes and shrinks the third coil spring 16 and also pushes and shrinks the second coil spring 15 via the piece movable pin 14, while the swinging shaft 10a is longer than the shaft guide 8a. Descends along the hole.

Next, FIG. 6 shows a state in which the mold closing operation is completed when the parting surface of the upper mold 1 abuts against the parting surface of the pot insert 7 of the lower mold 4.
The first and second substrate guide pieces 9 and 10 are pressed in an upright posture in which the coil springs 13, 15, and 16 are compressed by the upper mold 1 to protrude from the substrate mounting portion 6 a by the thickness of the substrate 5. . The substrate 5 is clamped at the periphery by the upper mold 1 and the insert block 6. In this state, the plunger 19 is operated to fill the melted sealing resin into the cavity recess 2 through the cull 3 and the runner gate, and heat curing is performed. In this case, the sealing resin can be heated and cured at an accurate position on the substrate 5 by positioning using the first and second substrate guide pieces 9 and 10.

  When the upper mold 1 is opened after heat curing, the first and second substrate guide pieces 9, 10 are again urged by the first to third coil springs 13, 15, 16 as in FIG. The amount of protrusion from the block 6 increases and the tip protrudes from the mold clamping surface. And the adsorption | suction to the board | substrate mounting part 6a of the board | substrate 5 is cancelled | released. Subsequently, as shown in FIG. 1, when the movable rod 18 and the ejector movable member 17 are moved up, the piece movable pin 14 is moved up along with the movement of the movable plate 12, and the second substrate guide piece 10 is swung. It rotates in the clockwise direction opposite to the mold closing operation around the moving shaft 10a and is separated from the substrate end. Further, the ejector pin 11 pushes up the substrate 5 from the substrate platform 6a by the upward movement of the movable plate 12.

  Thus, in accordance with the mold closing operation, the second substrate guide piece 10 is swung to push the substrate end surface and press the opposite end surface of the substrate 5 against the first substrate guide piece 9. Positioning of the substrate 5 whose accuracy is not ensured to the mold can be ensured. Therefore, the sealing resin can be prevented from wrapping around the side surface of the substrate, maintenance can be saved, and the apparatus operating rate can be improved. Further, since the positioning of the substrate 5 can be performed reliably, the sealing resin can be heat-cured at an accurate position, and the molded product can be prevented from being displaced and high molding quality can be maintained.

In the above-described embodiment, in FIG. 7A, a combination of two first substrate guide pieces 9 and one second substrate guide piece 10 is provided around the substrate 5 for each of the opposing end surfaces. ing. However, the present invention is not limited to the above embodiment. For example, as shown in FIG. 7B, a plurality of combinations (two sets in the figure) of the first substrate guide piece 9 and the second substrate guide piece 10 are provided for each facing end surface of the substrate 5. You can also. Furthermore, the combination of the two sets of the first substrate guide piece 9 and the second substrate guide piece 10 may be provided only on one end face facing each other.
Further, as shown in FIG. 7C, a combination of the first substrate guide piece 9 and the second substrate guide piece 10 can be provided for each end face facing the substrate 5 one by one. In this case, it is preferable that at least one of the first substrate guide piece 9 and the second substrate guide piece 10 is formed wide along the end surface of the substrate 5 as shown in FIG. Thus, the substrate 5 can be positioned without tilting. Further, both the substrate guide pieces 9, 10 may be formed wide.
The mold may be a mold in which a cavity insert is provided in a lower mold and a substrate is placed on the cavity insert.
The number of ejector pins 11 is preferably three or more in order to support the substrate 5, but may be one or two as long as it has an area or shape that can support the substrate 5.

It is principal part cross-sectional explanatory drawing of the lower mold | die which opened the type | mold. It is principal part cross-sectional explanatory drawing of the lower mold | die which opened the type | mold. It is principal part cross-sectional explanatory drawing of the lower mold | type which shows board | substrate positioning operation | movement. It is principal part sectional explanatory drawing of the lower mold | type which shows board | substrate adsorption | suction operation | movement. It is principal part cross-sectional explanatory drawing of the lower mold | type which shows a mold closing operation | movement. It is principal part cross-sectional explanatory drawing of a mold mold for mold closing operation completion. It is arrangement | positioning explanatory drawing of the 1st, 2nd board | substrate guide piece.

Explanation of symbols

1 Upper mold
2 cavity recess
3 Cal
4 Lower mold
5 Substrate
6 Insert block
6a Substrate placing part
6b Suction hole
7 Pot insert
7a pot
8 Chase block
8a Shaft guide
8b Guide ring
9 First board guide piece
10 Second board guide piece
10a Oscillating shaft
10b Bottom part 10c Columnar guide part 11 Ejector pin
12 Movable plate
13 First coil spring
14 piece movable pin
15 Second coil spring
16 Third coil spring
17 Ejector movable member
18 Movable rod
19 Plunger

Claims (7)

An insert block on which the substrate is placed in alignment with the cavity recess;
A pot insert provided with a pot provided with a sealing resin provided adjacent to the insert block and supplied to the cavity recess;
A first substrate guide piece serving as a positioning reference along the substrate placement portion of the insert block, and a chase block provided with a second substrate guide piece that pushes the substrate end face to the opposite side across the substrate;
In accordance with the mold closing operation of the mold, the second substrate guide piece is swung to push the substrate end face, and the working mechanism that presses the opposite end face of the substrate against the first substrate guide piece. Mold device.   The actuating mechanism includes a movable plate having an ejector pin erected below the chase block, and a first position where the second substrate guide piece is separated from the end surface of the substrate and the substrate end surface when the movable plate is moved up and down 2. The mold apparatus according to claim 1, wherein the mold apparatus is swung between a second position where the substrate is pressed against the first substrate guide piece while being in contact with the first substrate guide piece.   A piece movable member is erected on the movable plate so as to come into contact with the second substrate guide piece, and the piece movable member is brought into contact with the second substrate guide piece in accordance with the vertical movement of the movable plate. The mold apparatus according to claim 2, wherein the second substrate guide piece is swung between the first position and the second position by moving up and down in a state.   The actuating mechanism includes an ejector movable member linked to the movable plate, and the second substrate guide piece is moved between the first position and the second position when the movable plate is moved up and down through the ejector movable member. The mold apparatus according to claim 2, wherein the mold apparatus is rocked by the mold.   When the mold is opened, the movable plate moves to an upward movement position where the tip of the ejector pin protrudes from the substrate mounting portion. When the mold is closed, the tip of the ejector pin is flush with the substrate mounting portion. The mold apparatus according to claim 2, wherein the mold apparatus is retracted into the insert block so as to be lower than that.   When the tip of the ejector pin is retracted from the substrate mounting portion and the substrate is abutted against the first substrate guide piece and positioned, the substrate is sucked and fixed to the substrate mounting portion from the suction hole provided in the insert block. The mold apparatus according to claim 2 to be performed.   In the mold open state, the first and second substrate guide pieces are urged by the elastic member so that the tip ends protrude from the mold clamping surface, and the first and second substrate guide pieces are accompanied by the mold closing operation. The mold apparatus according to claim 1, wherein the mold apparatus is pushed down to the mold clamp surface against the bias of the elastic member.

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