JP6996153B2 - Manufacturing method of semiconductor devices and molding dies for semiconductor devices - Google Patents

Description

The present invention relates to a method for manufacturing a semiconductor device and a molding die for the semiconductor device.

Conventionally, as a method of resin-sealing (mold sealing) a semiconductor part, a semiconductor part placed in a concave portion (cavity) of a mold is press-fitted while heating a softened resin material to flow and transfer into the cavity. A transfer molding (transfer molding) method is known. Transfer molding is suitable for molding thermosetting resin because the mold is fastened with high pressure and the resin is allowed to flow inside the mold with high pressure. The size of the mold used for transfer molding is due to the size of the molded product, the number of molded products that can be molded with one mold, and the performance and mechanism of the molding device to which the mold is attached. ,It is determined. In addition, when there are restrictions in determining the dimensions of the mold in this way, there are generally restrictions on the direction in which the mold is attached and the direction in which the resin material is press-fitted into the mold, and the shape of the molded product is free. The degree is low.

As a conventional mold, a mold having a center block connected to a pot, cavity blocks arranged on the left and right sides of the center block, a hot plate supporting these parts, and an eject mechanism for taking out a molded product (upper mold). A mold for transfer molding consisting of a mold (lower mold) located below the upper mold and a mold for transfer molding has been proposed (for example, Patent Document 1 below (page 2, lower left column, line 14). -See page 3, upper left column, line 11).). In Patent Document 1 below, a cavity block (mold) is directly attached to the hot plate of the transfer molding apparatus via a clamp mechanism, and the cavity block is interlocked with an eject pin provided on the hot plate side. A dedicated eject mechanism is built in.

Further, as another conventional mold, a mold for injection molding, in which a mold constituent member (individual mold) is mounted in a recess of a mold mounting member (main body mold), has been proposed. (For example, see Patent Document 2 below (page 2, lower right column, lines 3 to 11, FIG. 3).) FIG. 39 is a plan view showing another example of the structure of the conventional mold. FIG. 39 is FIG. 3 (c) of Patent Document 2 below. In the following Patent Document 2, four individual molds 241 (rectangular portions of thick wires) are fitted into the recesses of the main body mold 243, and resin sealing is performed in the cavity 244 of each individual mold 241. The individual mold 241 is provided with a hydraulic extrusion pin hole 242 continuous with the cavity 244, and a molded product inside the cavity 244 is taken out by inserting a pin (not shown) into the hydraulic extrusion pin hole 242.

Further, as another conventional mold, a mold for injection molding, in which individual molds are fitted into the main body mold on the fixed side and the main body mold on the movable side, has been proposed (a mold). For example, see Patent Document 3 below (paragraphs 0015 to 0019, FIG. 1). FIG. 40 is a cross-sectional view showing another example of the structure of a conventional mold. FIG. 40 is FIG. 1 of Patent Document 3 below. In Patent Document 3 below, a cavity (recess) 253a is provided in the individual mold 253 (the rectangular portion of the thick line) fitted in the main body mold 251 on the fixed side fixed to the fixing plate 255. A core (convex portion) 254a is provided on the individual mold 254 (rectangular portion of the thick line) fitted in the main body mold 252 on the movable side. The individual molds 253 and 254 are screwed to the main body molds 251,252, respectively.

Japanese Unexamined Patent Publication No. 3-244515 Japanese Unexamined Patent Publication No. 62-028219 Japanese Unexamined Patent Publication No. 2004-05557

However, in the conventional transfer molding, when the semiconductor module is resin-sealed, bubbles (voids) remain inside the resin material depending on the resin flow direction and the arrangement of parts, and insulation defects occur due to the remaining bubbles and the like. Therefore, there is a demand for a mold that can change the direction of resin flow according to the shape of the semiconductor component. Further, in the conventional transfer molding, there are restrictions on the molding apparatus, and only a molding apparatus having a structure having a pair of molds having mold surfaces facing each other in the vertical direction is used. Therefore, as described above, insulation failure occurs due to air bubbles remaining inside the resin material.

In injection molding as in Patent Documents 2 and 3, there are few restrictions on the molding device, and there is also a horizontal molding device having a pair of molds whose mold surfaces face each other in the horizontal direction (direction orthogonal to the vertical direction). .. However, compared to transfer molding, the mold is compacted at a low pressure and the resin is allowed to flow inside the mold at a low pressure, so that it is suitable for molding thermoplastic resin, but for molding thermosetting resin. Is not suitable. Further, even if the nesting technique generally used in the molding apparatus for injection is applied to the conventional transfer molding, the insulation defect generated by the bubbles remaining inside the resin material is not eliminated.

In order to solve the problems caused by the above-mentioned prior art, the present invention is a method for manufacturing a semiconductor device using a mold capable of optimizing the flow direction of a resin according to the shape of a semiconductor component, and a molding die for the semiconductor device. The purpose is to provide.

In order to solve the above-mentioned problems and achieve the object of the present invention, the molding die for a semiconductor device according to the present invention has the following features. The individual mold is composed of two first mold plates that are overlapped with each other with the mold surfaces facing each other. A first cavity and a first path portion are provided between the mold surfaces of the two first mold plates. A semiconductor component is attached to the inside of the first cavity. The first path portion is connected to the first cavity and supplies resin to the first cavity when the semiconductor component is resin-sealed. The main body mold is composed of two second mold plates that are overlapped with each other with the mold surfaces facing each other. A resin supply portion, a second cavity, and a second path portion are provided between the mold surfaces of the two second mold plates. The resin supply unit supplies the resin to the first cavity. The individual mold is attached to the inside of the second cavity. The second path portion is connected to the resin supply portion and the second cavity, and supplies the resin from the resin supply portion to the second cavity. The individual mold and the main body mold move the individual mold toward a surface having the second path portion inside the second cavity when the individual mold is pushed into the second cavity. Further, it has a moving mechanism for fixing the individual mold to a surface having the second path portion inside the second cavity. The moving mechanism is provided on a surface of the individual mold and the main body mold that is orthogonal to and faces the direction in which the individual mold is pushed into the second cavity.

Further, in the above-described invention, the molding die for a semiconductor device according to the present invention has a protrusion provided on one surface and a groove provided on the opposite surface and can be fitted to the protrusion. It is characterized by having.

Further, in the molding die for a semiconductor device according to the present invention, in the above-described invention, the main body die is placed between the second path portion and the first path portion of the individual mold. It has a gate that connects the path portion and the first path portion and adjusts the inflow rate of the resin flowing from the second path portion to the first path portion.

Further, in the molding die for a semiconductor device according to the present invention, in the above-mentioned invention, the main body die further has an extrusion mechanism for extruding the individual die attached to the second cavity from the second cavity. It is characterized by that.

Further, in the molding die for the semiconductor device according to the present invention, in the above-mentioned invention, the extrusion mechanism moves so as to project from the main body die side to the individual die side, and at least the individual die. It is an eject pin that comes into contact with a part of the mold and pushes out the individual mold from the second cavity.

Further, in order to solve the above-mentioned problems and achieve the object of the present invention, the molding die for the semiconductor device according to the present invention has the following features. The individual mold is composed of two first mold plates that are overlapped with each other with the mold surfaces facing each other. A first cavity and a first path portion are provided between the mold surfaces of the two first mold plates. A semiconductor component is attached to the inside of the first cavity. The first path portion is connected to the first cavity and supplies resin to the first cavity when the semiconductor component is resin-sealed. The main body mold is composed of two second mold plates that are overlapped with each other with the mold surfaces facing each other. A resin supply portion, a second cavity, and a second path portion are provided between the mold surfaces of the two second mold plates. The resin supply unit supplies the resin to the first cavity. The individual mold is attached to the inside of the second cavity. The second path portion is connected to the resin supply portion and the second cavity, and supplies the resin from the resin supply portion to the second cavity. The mold surface of the individual mold and the mold surface of the main body mold face different directions. The main body mold further has an extrusion mechanism for pushing out the individual mold attached to the second cavity from the second cavity.

Further, the molding die for a semiconductor device according to the present invention is characterized in that, in the above-described invention, the mold surface of the individual mold and the mold surface of the main body mold are orthogonal to each other.

Further, in the molding die for a semiconductor device according to the present invention, in the above-mentioned invention, the individual die is the opposite of the first path portion to the first cavity on the mold surface of the first mold plate. It further has a resin accommodating portion provided on the side and accommodating the resin overflowing from the first cavity. The individual mold is characterized in that, when the individual mold is attached to the second cavity of the main body mold, the resin accommodating portion is located above the first cavity.

Further, in order to solve the above-mentioned problems and achieve the object of the present invention, the method for manufacturing a semiconductor device according to the present invention has the following features. First, a semiconductor component is attached to one of the first molds of an individual mold having two first molds, and the mold surfaces of the two first molds are overlapped with each other so as to face each other. Perform the mounting process. Next, the individual mold is attached to one of the second molds of the main body mold having two second molds, and the mold surfaces of the two second molds are stacked in a state of facing each other. Perform the second mounting process to match. Next, the resin is supplied to the individual mold from a resin supply unit provided on the mold surface of the second mold and supplying the resin to the individual mold, and the semiconductor component is sealed with the resin. Perform the sealing step. Next, a first take-out step of taking out the individual mold from the main body mold is performed. Next, a second take-out step of taking out the semiconductor component from the individual mold is performed. In the first mounting step, the semiconductor component is mounted inside the first cavity provided on the mold surface of the first mold plate of one of the individual molds, and the mold surfaces of the two first mold plates are mounted. By superimposing the semiconductor parts so as to face each other, the semiconductor component is fixed inside the first cavity and a first path portion connected to the first cavity is formed. In the second mounting step, the individual mold is mounted inside the second cavity provided on the mold surface of one of the main body molds, and the molds of the two second mold plates are used. A second path portion that pushes the individual mold into the second cavity by superimposing the surfaces facing each other and connects the resin supply portion and the first cavity via the first path portion. Form. The individual mold is pushed into the second cavity by a moving mechanism provided on a surface of the individual mold and the main body mold, which is orthogonal to and faces the direction in which the individual mold is pushed into the second cavity. The mold is moved toward a surface having the second path portion inside the second cavity, and the individual mold is fixed to the surface having the second path portion inside the second cavity. In the sealing step, the resin is supplied from the resin supply section to the first cavity via the second path section and the first path section. In the first taking-out step, the individual mold is taken out from the main body mold by pushing out the individual mold from the second cavity by an extrusion mechanism attached to the second cavity.

Further, in the above-described invention, the method for manufacturing a semiconductor device according to the present invention is such that in the first extraction step, the semiconductor device is moved so as to project from the main body mold side to the individual mold side, and at least the individual molds are manufactured. It is characterized in that the individual mold is extruded from the second cavity by an eject pin in contact with a part thereof. Further, the method for manufacturing a semiconductor device according to the present invention is characterized in that, in the above-described invention, a heating step of heating the individual mold is further included before the second take-out step.

Further, the method for manufacturing a semiconductor device according to the present invention is characterized in that, in the above-mentioned invention, the heating step is performed after the first mounting step.

Further, the method for manufacturing a semiconductor device according to the present invention is characterized in that, in the above-described invention, the heating step is performed by the heat transferred from the heated main body mold in the second mounting step.

Further, in the method for manufacturing a semiconductor device according to the present invention, the individual mold is rotated after the first mounting step and before the second mounting step, and the semiconductor component inside the individual mold is used. It is characterized by further including a rotation step of changing the direction of the above with respect to the gravity direction to a direction different from that at the time of the first mounting step.

Further, the method for manufacturing a semiconductor device according to the present invention is characterized in that, in the above-described invention, the individual mold is rotated by 180 ° about an axis orthogonal to the direction of gravity in the rotation step.

Further, the method for manufacturing a semiconductor device according to the present invention is characterized in that, in the above-described invention, the individual mold is rotated by 90 ° about an axis orthogonal to the direction of gravity in the rotation step.

Further, in the above-described invention, the method for manufacturing a semiconductor device according to the present invention is the inside of the first cavity provided on the mold surface of the first mold plate of one of the individual molds in the first mounting step. The semiconductor component is attached to the above-mentioned semiconductor parts, and the mold surfaces of the two first mold plates are overlapped with each other so as to face each other. In the second mounting step, the individual mold is mounted inside the second cavity provided on the mold surface of one of the main body molds, and the molds of the two second mold plates are used. Overlap with the faces facing each other. In the sealing step, the resin is supplied from the resin supply unit to the first cavity, and the semiconductor component is sealed with the resin. In the first taking-out step, the individual mold is taken out from the second cavity of the main body mold. In the second extraction step, the semiconductor component is extracted from the first cavity of the individual mold.

Further, in the method for manufacturing a semiconductor device according to the present invention, in the above-described invention, in the second mounting step, the first path portion and the second path portion are located at the same height as the first cavity. The individual mold is attached to the inside of the second cavity of the main body mold.

Further, in the method for manufacturing a semiconductor device according to the present invention, in the above-described invention, in the second mounting step, the first path portion and the second path portion are located above the first cavity. It is characterized in that the individual mold is attached to the inside of the second cavity of the main body mold.

Further, in the method for manufacturing a semiconductor device according to the present invention, in the above-described invention, in the second mounting step, the first path portion and the second path portion are located below the first cavity. It is characterized in that the individual mold is attached to the inside of the second cavity of the main body mold.

According to the above-mentioned invention, the orientation of the semiconductor component can be freely changed in the main body mold by changing the orientation of the individual mold in various ways when the individual mold is attached to the main body mold.

According to the method for manufacturing a semiconductor device and the molding die for the semiconductor device according to the present invention, the semiconductor component is resin-sealed using an individual die capable of optimizing the flow direction of the resin according to the shape of the semiconductor component. It has the effect of being able to do it.

It is a perspective view which shows typically the structure of the main part of the molding die for the semiconductor device which concerns on Embodiment 1. FIG. It is a top view schematically showing the layout of the mold plate of the main body mold of FIG. 1 as seen from the mold surface side. It is a perspective view which shows typically the structure of the individual mold arranged in the main body mold of FIG. FIG. 3 is a plan view schematically showing a layout of the mold plate of the individual mold of FIG. 3 as viewed from the mold surface side. It is sectional drawing which shows the cross-sectional structure in the cutting line A1-A3 of FIG. It is sectional drawing which shows another example of the cross-sectional structure in the cutting line A1-A3 of FIG. It is sectional drawing which shows another example of the cross-sectional structure in the cutting line A1-A3 of FIG. It is sectional drawing which shows another example of the cross-sectional structure in the cutting line A1-A3 of FIG. It is a flowchart which shows the outline of the manufacturing method of the semiconductor device which concerns on Embodiment 1. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is a top view which shows the state of another example in the process of manufacturing the semiconductor device which concerns on Embodiment 1. FIG. It is a top view which shows the state of another example in the process of manufacturing the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state of another example in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state of another example in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state of another example in the manufacturing process of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 2. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 3. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 3. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 3. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 3. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 4. FIG. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 4. FIG. It is a top view which shows the plane shape of each part in the cutting line B1-B2 of FIG. 29A. It is sectional drawing which shows the state in the manufacturing process of the semiconductor device which concerns on Embodiment 4. FIG. It is a perspective view which shows the structure of the mold of the comparative example. FIG. 31 is a plan view showing a layout of the mold plate on the fixed side of the mold of FIG. 31 as viewed from the mold surface side. It is sectional drawing which shows the cross-sectional structure in the cutting line AA-AA'in FIG. 32. It is a flowchart which shows the outline of the manufacturing method of the semiconductor device of the comparative example. It is sectional drawing which shows the state in the process of manufacturing of the semiconductor device of the comparative example. It is sectional drawing which shows the state in the process of manufacturing of the semiconductor device of the comparative example. It is sectional drawing which shows the state in the process of manufacturing of the semiconductor device of the comparative example. It is sectional drawing which shows the state in the process of manufacturing of the semiconductor device of the comparative example. It is a top view which shows another example of the structure of the mold of the comparative example. It is sectional drawing which shows another example of the structure of the mold of the comparative example.

Hereinafter, a method for manufacturing a semiconductor device according to the present invention and a preferred embodiment of a molding die for the semiconductor device will be described in detail with reference to the accompanying drawings. In the following description of the embodiment and the accompanying drawings, the same reference numerals are given to the same configurations, and duplicate description will be omitted.

(Embodiment 1)
The structure of the molding die for the semiconductor device according to the first embodiment will be described. FIG. 1 is a perspective view schematically showing the structure of a main part of a molding die for a semiconductor device according to the first embodiment. FIG. 1 shows a mold (hereinafter referred to as a main body mold) 10 attached to a molding apparatus (not shown) when a semiconductor component is resin-sealed by a transfer molding method. FIG. 2 is a plan view schematically showing the layout of the mold plate of the main body mold of FIG. 1 as viewed from the mold surface side.

FIG. 3 is a perspective view schematically showing the structure of the individual molds arranged in the main body mold of FIG. 2. FIG. 4 is a plan view schematically showing the layout of the mold plate of the individual mold of FIG. 3 as viewed from the mold surface side. FIG. 5 is a cross-sectional view showing a cross-sectional structure of the cutting lines A1-A3 of FIG. 6 to 8 are cross-sectional views showing another example of the cross-sectional structure in the cutting lines A1-A3 of FIG. FIGS. 5 to 8 show a state in which the main body mold 10 is closed, and a state in which the semiconductor module (semiconductor component) 220 and the resin material piece are not arranged inside the main body mold 10.

The main body mold 10 shown in FIG. 1 is composed of two (two) mold plates 1 and 2. The main body mold 10 has a cavity (recessed portion 11, which will be described later, which will be described later) in which the mold surfaces (main surfaces) 1a and 2a of the mold plates 1 and 2 are overlapped with each other so that the individual molds 20 can be arranged inside. The cavity formed by 15) is formed. Further, the main body mold 10 is closed with the individual molds 20 sandwiched between the mold plates 1 and 2, and is hung on the mold plates 1 and 2 in a direction in which the mold surfaces 1a and 2a of the mold plates 1 and 2 are pressed against each other. It is held in the molding apparatus in a state of being tightened (molded) by the pressure (molding force) 3. The pressure (molding force) 3 for mold-clamping the main body mold 10 is determined by the dimensions of the molded product and the number of molded products that can be processed in one molding.

Parts other than the mold plates 1 and 2 of the main body mold 10 are omitted from the illustration for, for example, positioning of the main body mold 10 when opening and closing, mounting of the main body mold 10 on a molding apparatus (not shown), and the like. Consists of common mold-based components. One of the two mold plates 1 and 2 constituting the main body mold 10 is fixed to the fixed plate of the molding apparatus, and the other mold plate 2 is attached to the movable plate of the molding apparatus. By moving the mold plate 2 on the movable side, the main body mold 10 is opened and closed.

The metal material of the mold plates 1 and 2 of the main body mold 10 has a large heat capacity (product of the specific heat and density of the metal material), and is made of iron (Fe) such as steel, which has high hardness and excellent wear resistance. It is an alloy. Specifically, the metal material of the mold plates 1 and 2 of the main body mold 10 may be, for example, SKD11 (steel for cold mold) in which molybdenum, chromium, vanadium or the like is added to carbon tool steel. .. The mold plates 1 and 2 of the main body mold 10 may be subjected to, for example, quenching treatment for extending the life of the mold.

The mold surface 1a of the mold plate 1 on the fixed side is provided with a recess 11, a cal 12, a runner 13, and a gate 14 (not shown in FIG. 1, see FIGS. 2, 5 to 8). The recess 11, the cal 12, the runner 13 and the gate 14, and the recess 15 and the pot 16 described later form a cavity when the mold plates 1 and 2 of the main body mold 10 are overlapped. Of the recesses 11, 15, cal 12, runner 13 and gate 14 and pot 16 forming these cavities, cal 12, runner 13 and gate 14 and pot 16 are shown in white. The recesses 11 are provided as many as the number of molded products (here, four) that can be processed by one molding by the main body mold 10.

That is, one or more recesses 11 are provided. An individual mold 20 is fitted inside each recess 11. FIGS. 2 and 5 to 8 show a state in which the individual mold 20 is fitted into the recess 11 (the recesses 11 and 15 in FIGS. 5 and 8 and the recess 15 in FIG. 7). The depth d1 of the recess 11 is shallower than, for example, the length (height) x 11 of the individual mold 20 when fitted into the recess 11 in the direction orthogonal to the mold surface 1a of the mold plate 1 (FIGS. 5 and 5). 8). The bottom surface of the recess 11 is provided with a pin hole 11a that penetrates from the bottom surface of the recess 11 to the outside of the main body mold 10. An eject pin (not shown) for pushing out the individual mold 20 fitted in the recess 11 from the recess 11 is inserted into the pin hole 11a.

The cal 12 is a groove for arranging a thermosetting resin material piece used for resin encapsulation of a semiconductor component, and serves as a resin supply unit for supplying the softened resin to the cavity 31 described later of the individual mold 20. The cal 12 has, for example, a substantially columnar shape on which a substantially columnar resin material piece can be arranged. The runner 13 is a groove that serves as a flow path for the resin material that flows from the cal 12 to the cavity 31 described later of the individual mold 20 when the resin material piece arranged in the cal 12 is softened. It is formed so as to connect to the recess 11.

The cal 12 and the cavity 31 may be connected via the runner 13, and the cal 12 and the runner 13 may be provided on the fixed side template 1 (see FIGS. 5 and 7), and the movable side. It may be provided on the template 2 of the above (see FIGS. 6 and 8). The gate 14 is formed between the runner 13 of the main body mold 10 and the runner 32 described later of the individual mold 20, respectively. The main body of the gate 14 is a state in which the individual mold 20 is fitted into the recess 11 of the main body mold 10 and the main body mold 10 is closed (that is, a state in which the mold surfaces 1a and 2a of the mold plates 1 and 2 are in contact with each other). It is arranged at a position where the runner 13 of the mold 10 and the runner 32 of the individual mold 20 are connected. The runner 13 of the main body mold 10 and the runner 32 of the individual mold 20 are in a state where the individual mold 20 is fitted into the recess 11 of the main body mold 10 and the main body mold 10 is closed, and there is no gap through the gate 14. Continuous. The gate 14 is, for example, a groove shallower than the runner 13 of the main body mold 10, and has a function of adjusting the inflow speed of the resin material flowing from the runner 13 of the main body mold 10 to the runner 32 of the individual mold 20.

The movable mold plate 2 faces the recess 11 of the fixed side mold plate 1 in a state where the main body mold 10 is closed (that is, a state in which the mold surfaces 1a and 2a of the mold plates 1 and 2 are in contact with each other). A recess 15 is provided at the position (see FIGS. 5 and 8). When the main body mold 10 is closed, the individual mold 20 is fitted into a substantially rectangular parallelepiped cavity formed by the recess 11 of the mold plate 1 on the fixed side and the recess 15 of the mold plate 2 on the movable side. That is, the remaining portion of the individual mold 20 other than the portion fitted in the recess 11 is fitted in the recess 15 of the mold plate 2 on the movable side.

The cavities formed by the recesses 11 and 15 of the mold plates 1 and 2 can accommodate the individual mold 20. Considering the clearance for fitting the individual mold 20 into the recesses 11 and 15 (the distance to be secured between the side wall of the recesses 11 and 15 and the individual mold 20), the recesses 11 of the mold plates 1 and 2 The plane dimension of the cavity formed by 15, for example, is equal to or larger than the plane outer diameter dimension of the individual mold 20. The dimensions in the height (depth) direction of the cavities formed by the recesses 11 and 15 of the mold plates 1 and 2 have substantially the same dimensions as, for example, the outer diameter dimensions in the thickness direction of the individual mold 20.

For example, among the dimensions of the three sides of the substantially rectangular parallelepiped cavity formed by the recesses 11 and 15 of the mold plates 1 and 2, the dimension x1 in the depth direction corresponds to the individual mold 20 fitted in the cavity. It is substantially the same as the dimension x11 of one side in the depth direction (x1≈x11). Of the dimensions of the three sides of the substantially rectangular parallelepiped cavity formed by the recesses 11 and 15 of the mold plates 1 and 2, the dimensions x2 and x3 of the two sides in the plane direction are the dimensions of the individual mold 20 fitted into the cavity. The dimensions of the two corresponding sides in the plane direction are x12, x13 or more (x2 ≧ x12, x3 ≧ x13).

Specifically, for example, when the width x2 and the depth x3 of the bottom surfaces of the recesses 11 and 15, the total sum of the depth d1 of the recess 11 and the depth d2 of the recess 15 is the recesses 11 and 15 of the templates 1 and 2. The height of the formed cavity x 1. The sum of the depth d1 of the recess 11 and the depth d2 of the recess 15 is substantially the same as the length x11 in the direction orthogonal to the mold surfaces 21a and 22a of the individual mold 20 (x1 = x11 = d1 + d2).

The concave portion 15 may not be provided on the movable side template 2 (see FIG. 6). In this case, the external dimensions of the recess 11 of the fixed-side mold plate 1 are substantially the same as the outer diameter dimensions of the individual mold 20, and the entire individual mold 20 is fitted inside the recess 11 of the fixed-side mold plate 1. Is done. Further, the entire individual mold 20 may be fitted inside the recess 15 of the movable mold plate 2 without providing the recess 11 in the mold plate 1 on the fixed side (see FIG. 7). In this case, the external dimension of the concave portion 15 of the mold plate 2 on the movable side is substantially the same as the outer diameter dimension of the individual mold 20. The method of taking out the individual mold 20 of FIG. 7 will be described with reference to the third and fourth embodiments.

Further, on the movable side mold plate 2, a pot (heating chamber) 16 is formed at a position facing the cal 12 of the fixed side mold plate 1 with the main body mold 10 closed. The pot 16 is, for example, a cylindrical through hole that penetrates from the mold surface (one main surface) 2a of the mold plate 2 to the other main surface. The pot 16 is connected to the cal 12 of the mold plate 1 on the fixed side with the main body mold 10 closed. The pot 16 has a function of heating and softening (or liquefying) the resin material piece arranged in the cal 12 of the template 1.

Inside the pot 16, a blanger (not shown) arranged on the cal 12 of the template 1 and applying pressure to the resin material piece is arranged. The blanger has a function of pushing the softened resin material piece from the cal 12 into the cavity 31 of the individual mold 20 and causing it to flow. The template 1 on the fixed side may be formed by joining a metal member on which the recess 11 is formed and a metal member (cal block) on which the cal 12 is formed. The template 2 on the movable side may be formed by joining a metal member (center block) forming the pot 16 and a metal member surrounding the center block.

The individual mold 20 is composed of two (two) mold plates 21 and 22 (FIG. 3), and forms a substantially rectangular parallelepiped shape when the two mold plates 21 and 22 are overlapped. In the individual mold 20, a cavity in which semiconductor parts can be placed is formed by superimposing the mold surfaces (main surfaces) 21a and 22a of the mold plates 21 and 22 in a state of facing each other. The individual mold 20 can be arranged in any direction inside a substantially rectangular parallelepiped cavity formed by the recesses 11 and 15 (or only one of the recesses 11 and 15) of the mold plates 1 and 2 of the main body mold 10. (See FIGS. 5 to 8). The individual molds 20 may be arranged so that, for example, the mold surfaces 21a and 22a of the mold plates 21 and 22 are parallel to the mold surfaces 1a and 2a of the mold plates 1 and 2 of the main body mold 10. Figures 5 and 8). In this case, the direction in which the resin material is supplied from the runner 13 of the main body mold 10 to the cavity 31 of the individual mold 20 is a direction parallel to the mold surface 1a of the mold plate 1 on the fixed side of the main body mold 10 (hereinafter,). , Horizontal direction).

Alternatively, the individual molds 20 may be arranged so that, for example, the mold surfaces 21a and 22a are orthogonal to the mold surfaces 1a and 2a of the mold plates 1 and 2 of the main body mold 10 (FIGS. 6 and 7). .. As shown in FIG. 6, when the cavity 31 of the individual mold 20 is located inside the recess 11 of the mold plate 1 on the fixed side of the main body mold 10, the runner 13 of the main body mold 10 to the cavity 31 of the individual mold 20 The direction in which the resin material is supplied to is from the upper side to the lower side. As shown in FIG. 7, when the cavity 31 of the individual mold 20 is located inside the recess 15 of the mold plate 2 on the movable side of the main body mold 10, the cavity 31 of the individual mold 20 is located from the runner 13 of the main body mold 10. The direction in which the resin material is supplied to is from the lower side to the upper side.

The metal material of the mold plates 21 and 22 of the individual mold 20 is, for example, the same as the metal material of the mold plates 1 and 2 of the main body mold 10. For example, in order to extend the mold life of the individual mold 20, the mold plates 21 and 22 of the individual mold 20 may be quenched. Further, the individual mold 20 and the cavity 31 of the individual mold 20 are filled by, for example, nitriding the inner walls of the mold surfaces 21a and 22a of the individual mold 20 and the recesses 11 and 15 of the mold plates 21 and 22. The releasability of the resin material may be enhanced.

A cavity 31, a runner 32, and a resin reservoir 33 are formed on the mold surface (main surface) 21a of one of the mold plates 21 and 22 of the individual mold 20 (see FIG. 4). The cavity 31 is a recess for arranging a semiconductor component to be resin-sealed. A semiconductor component to be resin-sealed is attached to the inside of the cavity 31. The runner 32 is a groove that serves as a flow path for the resin material that flows from the runner 13 of the fixed-side template 1 to the cavity 31, and is connected to the runner 13 of the fixed-side template 1. The resin reservoir 33 is a groove serving as a resin accommodating portion for accommodating the resin material overflowing from the cavity 31. The resin reservoir 33 is arranged, for example, on the side opposite to the runner 13 of the template 1 on the fixed side with respect to the cavity 31.

A groove 22b is provided on the mold surface 22a of the other mold plate 22 of the mold plates 21 and 22 of the individual mold 20 (see FIGS. 5 to 7 and 11). Instead of the groove 22b on the mold surface 22a of the mold plate 22, the groove 21b may be provided on the bottom surface of the cavity 31 of the mold plate 21 (see FIGS. 8 and 22). These grooves 21b and 22b are holes for inserting the external connection terminal 225 when the semiconductor module 220 described later is attached to the individual mold 20 (see FIGS. 10, 11, 22 and 23). Further, the individual mold 20 and the main body mold 10 have a slide mechanism (movement mechanism (not shown): FIGS. 5 to 8) for moving (sliding) the individual mold 20 to a predetermined position when the main body mold 10 is clamped. 11 to 13, 16 to 20 are also provided (not shown). The structure of the slide mechanism will be described later. In FIGS. 5 to 8, the mold plates 21 and 22 of the individual mold 20 are shown by hatching thinner than the mold plates 1 and 2 of the main body mold 10. Further, the cavity 31, the runner 32, and the resin reservoir 33, which become cavities when the mold plates 21 and 22 of the individual molds 20 are overlapped with each other, are shown in white.

Next, regarding the method for manufacturing a semiconductor device (method for sealing a resin of a semiconductor component) according to the first embodiment, a general configuration having an external connection terminal 225 protruding in a direction orthogonal to the main surface of the laminated substrate 221. A case where the semiconductor module (semiconductor component) 220 is resin-sealed will be described as an example. FIG. 9 is a flowchart showing an outline of a method for manufacturing a semiconductor device according to the first embodiment. FIG. 9 shows one cycle of resin encapsulation of the semiconductor module 220. FIGS. 10, 11A to 11C, 12, 13, 14A, 14B, 16 to 21 are cross-sectional views showing a state in which the semiconductor device according to the first embodiment is in the process of being manufactured. 15A and 15B are plan views showing a state of another example in the process of manufacturing the semiconductor device according to the first embodiment. FIG. 15C is a cross-sectional view showing a state of another example in the process of manufacturing the semiconductor device according to the first embodiment.

The semiconductor module 220 shown in FIG. 10 includes a semiconductor chip 224, an external connection terminal 225, and a laminated substrate 221. Further, the semiconductor module 220 has a configuration in which a semiconductor chip 224 is mounted on a conductive plate 223a on one main surface of a laminated substrate 221 and one end of an external connection terminal 225 is joined to the conductive plate 223a. It has become. In FIG. 10, for example, a circuit board 226 facing the laminated substrate 221 with the semiconductor chip 224 interposed therebetween is arranged, and the conductor layers (not shown) of the semiconductor chip 224 and the circuit board 226 are electrically connected to each other by a terminal pin 227. A semiconductor module 220 having a connected pin structure is shown.

This semiconductor module 220 is an example of a semiconductor component to be resin-sealed, and the circuit board 226 and the terminal pin 227 may not be provided. In the case of a semiconductor module 220 having a pin structure, the other end of the external connection terminal 225 penetrates the circuit board 226 and is from the main surface of the circuit board 226 opposite to the main surface of the laminated board 221 side. It stands out. The laminated substrate 221 is formed by forming conductive plates 223a and 223b on both sides of the ceramic substrate 222, respectively.

After assembling the semiconductor module 220 having the external connection terminal 225 protruding in the direction orthogonal to the main surface of the laminated substrate 221, the semiconductor module 220 is resin-sealed. Here, the individual mold is formed in the cavity formed by the recesses 11 and 15 of the main body mold 10 so that the cavity 31 of the individual mold 20 is located inside the recess 11 of the mold plate 1 on the fixed side of the main body mold 10. A case where 20 is arranged and the resin material is laterally supplied from the runner 13 of the main body mold 10 to the cavity 31 of the individual mold 20 (that is, the configuration of FIG. 5) will be described as an example.

First, as shown in FIG. 11A, the mold surface 22a of the mold plate 22 of the individual mold 20 is on the upper side (opposite to the gravity direction G), and the groove 22b is the other side of the external connection terminal 225 of the semiconductor module 220. The semiconductor module 220 is fixed to the template 22 by inserting the end portion of the above. Next, the mold plates 21 and 22 of the individual mold 20 are overlapped with each other so that the mold surfaces 21a and 22a face each other, and the mold plate 21 of the individual mold 20 is put on the semiconductor module 220 to cover the individual mold. The semiconductor module 220 is attached to the inside of the cavity 31 of the mold plate 21 of the mold 20 (step S1). The direction of the downward arrow indicated by reference numeral 41 is the direction of the pressure 41 applied to the semiconductor module 220 when the external connection terminal 225 is inserted into the groove 22b of the mold plate 22 of the individual mold 20. The direction of the downward arrow indicated by the reference numeral 42 is the moving direction of the template 21 when the template 21 of the individual mold 20 is placed on the semiconductor module 220.

By performing the step S1, as shown in FIG. 11B, the semiconductor module 220 has the external connection terminal 225 fixed to the template 22 with respect to the main surface of the laminated substrate 221 on which the semiconductor chip 224 is mounted. The conductive plate 223b on the opposite main surface is attached to the inside of the cavity 31 in a state of being in contact with and fixed to the bottom surface of the cavity 31. Therefore, the semiconductor module 220 is mounted so that the laminated substrate 221 is located on the upper side of the cavity 31 with the main surface of the laminated substrate 221 (the surface on which the semiconductor chip 224 and the external connection terminal 225 are mounted) facing down. It becomes a state.

Next, as shown in FIGS. 11B and 11C, the individual mold 20 is placed around an axis orthogonal to the gravity direction G (an axis parallel to the mold surfaces 21a and 22a of the mold plates 21 and 22 of the individual mold 20). The individual mold 20 is turned upside down by rotating it 180 ° (step S2). That is, in the step S1, the individual mold 20 in which the template 22 on which the groove 22b is formed is located below the other template 21 (on the G side in the gravity direction) is moved to the step S2. By turning it upside down in the above, the template 22 in which the groove 22b is formed is positioned above the other template 21. FIG. 11B shows the state of the individual mold 20 before the rotation R, and FIG. 11C shows the state of the individual mold 20 after the rotation R.

By performing the step S2, as shown in FIG. 11C, the individual mold 20 is in a state where the mold plate 22 in which the groove 22b is formed is positioned above the other mold plate 21, and the subsequent steps are performed. It is transported to the manufacturing equipment used in. By doing so, in steps S3 and S4 described later, the semiconductor module 220 is attached so that the main surface of the laminated substrate 221 is on the upper side and the laminated substrate 221 is located on the lower side of the cavity 31. The step S2 may be performed after the step S1 and before the step S4 described later.

Next, as shown in FIG. 12, the semiconductor module 220 is held by holding the individual mold 20 to which the semiconductor module 220 is attached in a constant temperature bath 43 heated at a temperature of, for example, 130 ° C. or higher and 180 ° C. or lower for a predetermined time. Is preheated (step S3). As described above, since the individual mold 20 is made of a metal material having a large heat capacity, only the individual mold 20 may be heated in the constant temperature bath 43 before the semiconductor module 220 is attached to the individual mold 20. The steps S1 to S3 are steps performed outside the molding apparatus using only the individual mold 20.

Next, as shown in FIG. 13, the recess 11 of the mold plate 1 on the fixed side of the main body mold 10 so that the surface of the individual mold 20 on the runner 32 side and the gate surface 14a of the main body mold 10 face each other. The individual mold 20 is fitted into the mold. As a result, the runner 13 and the gate 14 of the main body mold 10 and the runner 32 of the individual mold 20 become a continuous groove. The direction of the arrow indicated by reference numeral 44 is the direction of the pressure 44 applied to the individual mold 20 when the individual mold 20 is fitted into the recess 11 of the mold plate 1 on the fixed side of the main body mold 10. Further, as shown in FIG. 14A, the movable mold plate 2 of the main body mold 10 is moved so that the mold surface 2a of the movable mold plate 2 comes into contact with the mold surface 1a of the fixed side mold plate 1. By letting it close, the main body mold 10 is closed. At this time, the individual mold 20 is fitted into the recess 15 of the mold plate 2 on the movable side. The direction of the downward arrow indicated by the reference numeral 45 is the direction of the pressure 45 applied to the movable mold plate 2 when the recess 15 of the movable mold plate 2 of the main body mold 10 is fitted into the individual mold 20.

Then, by molding the main body mold 10, the mold surfaces 1a and 2a of the mold plates 1 and 2 are brought into contact with each other, and the individual mold 20 is placed in the cavity formed by the recesses 11 and 15 of the main body mold 10. Attach (step S4). In the steps S3 and S4, for example, the mold plate 21 of the individual mold 20 is arranged with the mold surface 21a on the upper side (the side opposite to the gravity direction G), and the mold plate 22 of the individual mold 20 is the mold. The individual mold 20 may be fitted into the recess 11 of the mold plate 1 on the fixed side of the main body mold 10 so that the surface 22a is on the lower side (G side in the gravity direction) and is arranged on the mold plate 21. preferable. By changing the vertical positions of the mold plates 21 and 22 of the individual mold 20 in the process of step S2, the individual mold 20 is placed in the main body mold 10 in the same state as when being transported from the previous step in the process of step S3. By lowering from above the recess 11 of the fixed-side mold plate 1 into the inside of the recess 11, the individual mold 20 is fitted into the recess 11 of the fixed-side mold plate 1 of the main body mold 10 in the above-mentioned suitable arrangement. be able to. As a result, the laminated substrate 221 is located in the space below the inside of the cavity 31 of the individual mold 20 inside the recess 11 of the mold plate 1 on the fixed side of the main body mold 10 via the individual mold 20. The semiconductor module 220 can be attached to the.

Further, in the step S4, the pressure 45 applied to the movable mold plate 2 when the recess 15 of the movable mold plate 2 of the main body mold 10 is fitted into the individual mold 20, and the main body mold 10 Due to the mold clamping force 3 (see FIG. 1), the slide mechanism 60a functions between the main body mold 10 and the individual mold 20. By this slide mechanism 60a, the individual mold 20 is moved (slides) inside the recess 11 of the mold plate 1 on the fixed side of the main body mold 10 in a direction parallel to the bottom surface of the recess 11 (hereinafter referred to as a lateral direction) 46. ) Can be made. The slide mechanism 60a of FIG. 14A is shown enlarged in FIG. 14B. Specifically, as shown in FIG. 14B, the slide mechanism 60a is provided on the main body mold 10 and the individual mold 20 at the contact surface between the main body mold 10 and the individual mold 20, and can be fitted to each other. It is composed of a protrusion 61 and a notch (groove) 62. 14A and 14B show a state in which the protrusion 61 of the slide mechanism 60a and the notch 62 are being fitted.

The protrusion 61 of the slide mechanism 60a is provided on the bottom surface 15d of the recess 15 of the mold plate 2 on the movable side of the main body mold 10. The protrusion 61 has a concave portion 15 because the side surface (hereinafter referred to as an inclined surface) 61a facing the gate surface 14a (see FIG. 14A) of the main body mold 10 is inclined with respect to the bottom surface 15d of the concave portion 15. It has a substantially trapezoidal cross-sectional shape in which the width becomes narrower so that the inclined surface 61a is separated from the gate surface 14a of the main body mold 10 as the distance from the bottom surface 15d (that is, the height increases). That is, the inclined surface 61a of the protrusion 61 faces the gate surface 14a (see FIG. 14A) of the main body mold 10. The gate surface 14a of the main body mold 10 is a side wall of the cavity formed by the recesses 11 and 15 of the main body mold 10 on the gate 14 side. The other side surfaces of the protrusion 61 except for the side surface (inclined surface 61a) facing the gate surface 14a of the main body mold 10 have an inclination so as to narrow the width of the protrusion 61 with respect to the bottom surface 15d of the recess 15. It may be perpendicular to the bottom surface 15d of the recess 15.

The notch 62 of the slide mechanism 60a is a surface of the mold plate 22 of the individual mold 20 that contacts the bottom surface 15d of the recess 15 of the mold plate 2 on the movable side (that is, the main surface opposite to the mold surface 22a: the following. 22c (which is the upper surface of the individual mold 20) is provided so as to face the protrusion 61. The notch 62 has an inclined side surface (hereinafter referred to as an inclined surface) 62a facing the gate surface 14a of the main body mold 10 with respect to the upper surface 22c of the individual mold 20, so that the upper surface 22c of the individual mold 20 is inclined. It has a substantially trapezoidal cross-sectional shape in which the width becomes narrower so that the inclined surface 62a is separated from the gate surface 14a of the main body mold 10 as the distance from the main body mold 10 increases (that is, the deeper the depth).

That is, the inclined surface 62a of the notch 62 faces the gate surface 14a (see FIG. 14A) of the main body mold 10. The other side surfaces of the notch 62 except for the side surface (inclined surface 62a) facing the gate surface 14a of the main body mold 10 have an inclination so as to narrow the width of the notch 62 with respect to the upper surface 22c of the individual mold 20. It may be perpendicular to the upper surface 22c of the individual mold 20. The notch 62 may have substantially the same dimensions and substantially the same trapezoidal cross-sectional shape as the protrusion 61. The notch 62 may have an inclined surface 62a facing the inclined surface 61a of the protrusion 61 on the side surface of the main body mold 10 facing the gate surface 14a, and may have a size and shape in which the protrusion 61 can be fitted.

At the stage of fitting the individual mold 20 to the main body mold 10, there is a gap between the main body mold 10 and the individual mold 20 in order to consider the clearance for fitting the individual mold 20 to the recesses 11 and 15. There is. By providing the slide mechanism 60a having such a configuration, the pressure 45 applied to the movable mold plate 2 when the recess 15 of the movable mold plate 2 of the main body mold 10 is fitted into the individual mold 20 and the pressure 45 applied to the movable mold plate 2 and The protrusion 61 of the bottom surface 15d of the recess 15 of the movable side of the mold 10 of the main body mold 10 is pushed into the notch 62 of the individual mold 20 by the mold tightening force 3 (see FIG. 1) of the main body mold 10. As a result, the inclined surface 61a of the protrusion 61 and the inclined side wall (hereinafter referred to as the inclined surface) 62a of the notch 62 come into contact with each other, the individual mold 20 moves in the lateral direction 46, and the gate of the main body mold 10 It is strongly pressed against the surface 14a. Therefore, after the main body mold 10 is clamped, there is no gap between the gate surface 14a of the main body mold 10 and the individual mold 20. Therefore, it is possible to prevent the resin material from flowing between the gate surface 14a of the main body mold 10 and the individual mold 20 at the time of resin sealing described later.

FIG. 14A shows a case where the slide mechanism 60a is provided at a position of the recess 15 of the mold plate 2 on the movable side of the main body mold 10 at a position away from the gate surface 14a. It can be arranged at any position on the bottom surface 15d of the recess 15 of the mold plate 2 on the movable side of the mold 10. Further, the slide mechanism 60a may be arranged in a straight line extending along one side of the substantially rectangular upper surface 22c of the individual mold 20 when viewed from the upper surface 22c side of the individual mold 20 (FIG. 15A). reference). In this case, the length of the slide mechanism 60a may be substantially the same as one side of the upper surface 22c of the individual mold 20, or substantially half the length of one side of the upper surface 22c of the individual mold 20. There may be.

Further, notches 62 (see FIG. 15B) of the slide mechanism 60a are arranged in the vicinity corresponding to the four vertices of the substantially rectangular upper surface 22c of the individual mold 20 when viewed from the upper surface 22c side of the individual mold 20. A plurality of slide mechanisms 60a may be arranged in the above, and the individual molds 20 may be fixed to the gate surface 14a of the main body mold 10 by combining the plurality of slide mechanisms 60a. 15A and 15B show only the layout of the notch 62 of the slide mechanism 60a, and the layout of the protrusion 61 is omitted. However, the protrusion 61 has the same layout as the notch 62 on the movable side of the main body mold 10. It is arranged on the bottom surface 15d of the recess 15 of the template 2.

Further, instead of the slide mechanism 60a described above, the mold surface 1a of the fixed side mold plate 1 and the lower surface of the individual mold 20 (the mold of the fixed side mold plate 1 of the mold plate 21 of the individual mold 20). A slide mechanism (not shown) having the same function as the slide mechanism 60a may be provided between the surface 1a and the contact surface with the bottom surface of the recess 11. A slide mechanism between the mold surface 1a of the mold plate 1 on the fixed side and the lower surface of the individual mold 20 and the slide mechanism 60a described above may be provided together.

Further, as shown in FIG. 15C, the protrusion 61'of the slide mechanism 60a'is provided on the upper surface 22c of the individual mold 20, and the notch 62'is provided on the bottom surface 15d of the recess 15 of the mold plate 2 on the movable side of the main body mold 10. It may be provided in. In this case, both the protrusion 61'and the notch 62'have inclined side surfaces (inclined surfaces) 61a'and 62a' opposite to the side surface of the main body mold 10 facing the gate surface 14a. The protrusion 61'has a substantially trapezoidal cross-sectional shape in which the width becomes narrower so that the inclined surface 61a'approaches the gate surface 14a of the main body mold 10 as the distance from the upper surface 22c of the individual mold 20 increases (that is, the higher the height). Have. The notch 62'is provided so as to face the protrusion 61'. The notch 62'has a substantially trapezoidal cross-sectional shape in which the width becomes narrower so that the inclined surface 62a'approaches the gate surface 14a of the main body mold 10 as the distance from the bottom surface 15d of the recess 15 increases (that is, the deeper the depth). By providing the protrusion 61'and the notch 62'in this way, even when the main body mold 10 has the notch 62'and the individual mold 20 has the protrusion 61', the individual mold 20 has the protrusion 61'in the lateral direction 46. And is strongly pressed against the gate surface 14a of the main body mold 10.

Further, the temperature of the main body mold 10 is always maintained at, for example, about 130 ° C. to 180 ° C. For example, in the manufacturing method of the comparative example described later, before the semiconductor module 220 is resin-sealed, the semiconductor module 220 is left attached to the molding apparatus (mold 200) for a predetermined time in order to heat the semiconductor module 220. It is necessary (see step S102 in FIG. 34). On the other hand, in the present invention, the semiconductor module 220 is already heated inside the individual mold 20 at the stage of performing the step S4. Therefore, unlike the manufacturing method of the comparative example, it is not necessary to leave the semiconductor module 220 attached to the molding apparatus. Therefore, the time (cycle time) required for one cycle of processing in the molding apparatus can be shortened.

Next, for example, a substantially columnar resin material piece is arranged on the cal 12 of the template 1 on the fixed side. This resin material piece is heated and softened by the pot 16 of the template 2 on the movable side. Then, as shown in FIG. 16, pressure is applied to the softened resin material 47 by the blanger 4 mounted inside the pot 16 of the movable mold plate 2, and the resin material 47 is used in the main body mold 10. It is flowed from the cal 12 to the runner 13 and the gate 14, and is press-fitted into the inside of the cavity 31 from the runner 32 of the individual mold 20. As a result, the semiconductor module 220 inside the cavity 31 of the individual mold 20 is covered with the resin material 47, and the semiconductor module 220 is resin-sealed (step S5).

In the step S5, the resin material 47 heated and softened by the pot 16 of the mold plate 2 on the movable side advances along the flow paths (runners 13 and 32) formed inside the main body mold 10 and the individual mold 20. Hardening progresses each time. Therefore, it is preferable that the main body mold 10 is held at a temperature at which the resin material 47 is cured inside the cavity 31 of the individual mold 20. The resin material 47 overflowing from the cavity 31 of the individual mold 20 and the bubbles (voids) 47a generated inside the resin material 47 when the resin material 47 flows are housed in the resin reservoir 33 adjacent to the cavity 31. Reference numeral 47c is an air reservoir in which bubbles 47a that have moved to the resin reservoir 33 are accumulated.

Further, here, an example in which the softened resin material 47 is flowed in the direction 47b orthogonal to the gravity direction G is shown in the same manner as in the manufacturing method (see FIGS. 36 to 38) of the comparative example described later. Bubbles 47a generated in the resin material 47 when the resin material 47 flows move to the upper space inside the cavity 31 of the individual mold 20 due to buoyancy. Therefore, in the manufacturing method of the comparative example, bubbles 47a tend to remain on the surface of the semiconductor chip 224 located in the upper space inside the cavity 31 of the individual mold 20 and on the conductive plate 223a on which the semiconductor chip 224 is mounted. .. These cause insulation defects in the semiconductor module 220. On the other hand, in the present invention, as described above, the semiconductor module 220 is arranged so that the laminated substrate 221 is located in the space below the inside of the cavity 31 of the individual mold 20. Therefore, even if the bubbles 47a remain inside the resin material 47 inside the cavity 31 of the individual mold 20, the bubbles 47a are formed on the surface of the semiconductor chip 224 or on the conductive plate 223a on which the semiconductor chip 224 is mounted. It does not remain. Therefore, it is possible to prevent the insulation failure of the semiconductor module 220.

Next, as shown in FIG. 17, the main body mold 10 is opened (mold opening) by moving the mold plate 2 on the movable side of the main body mold 10. The direction of the upward arrow indicated by reference numeral 48 is the moving direction of the mold plate 2 on the movable side of the main body mold 10. Next, as shown in FIG. 18, the individual mold 20 is pushed up by the eject pin 49 inserted into the pin hole 11a of the mold plate 1 on the fixed side of the main body mold 10, and the mold on the fixed side of the main body mold 10 is pushed up. The individual mold 20 is taken out from the recess 11 of the plate 1 (step S6). The direction of the upward arrow indicated by reference numeral 50 is the moving direction of the eject pin 49. Next, the residue (residual resin) of the resin material 47 adhering to the main body mold 10 is cleaned (step S7). The steps S4 to S7 are steps performed by the molding apparatus.

Next, as shown in FIG. 19, the individual mold 20 is inserted into, for example, a heating chamber 51, and the resin material 47 is primarily cured at a temperature of, for example, 130 ° C. or higher and 180 ° C. (step S8). In the manufacturing method of the comparative example (see FIG. 34), the resin material 231 was primarily cured before the semiconductor module 220 was taken out from the molding apparatus (mold 200) (see step S104 of FIG. 34), but in the present invention. Takes out the semiconductor module 220 (individual mold 20) from the molding apparatus (main body mold 10) and then first cures the resin material 47. Therefore, the cycle time of the processing in the molding apparatus can be shortened as compared with the manufacturing method of the comparative example. Further, for example, the step S7 (cleaning of the molding apparatus) and the step S8 (primary curing of the resin material 47) can be performed in parallel. Therefore, the time required for the line work in which one cycle of the processing in the molding apparatus is continuously performed can be shortened as compared with the manufacturing method of the comparative example. The step S8 may be performed as needed and can be omitted.

Next, as shown in FIG. 20, by opening (mold opening) the individual mold 20, the mold plate 22 of the individual mold 20 is removed from the molded product (semiconductor module 220 resin-sealed with the resin material 47). .. For example, the molded product is extruded from the resin material 47 side by an eject pin inserted into a pin hole (not shown) provided in the mold plate 22 of the individual mold 20, and is externally connected from the groove 22b of the mold plate 22 of the individual mold 20. By removing the terminal 225, the mold plate 22 of the individual mold 20 may be removed from the molded product. The direction of the upward arrow indicated by reference numeral 52 is the moving direction of the mold plate 22 of the individual mold 20.

Next, as shown in FIG. 21, the molded product is taken out from the cavity 31 of the mold plate 21 of the individual mold 20 (step S9). The direction of the upward arrow indicated by reference numeral 53 is the moving direction of the molded product. The other end of the external connection terminal 225 is not resin-sealed because it is inserted into the groove 22b of the mold plate 22 of the individual mold 20 in the step (resin sealing) of step S5. As a result, the semiconductor module 220 can be made conductive with the outside through the other end of the external connection terminal 225.

Further, the main surface of the laminated substrate 221 opposite to the main surface on which the semiconductor chip 224 and the external connection terminal 225 are mounted is on the bottom surface of the cavity 31 of the mold plate 21 of the individual mold 20 in the step S5. Since it is in contact, it is not sealed with resin. As a result, the semiconductor module 220 can dissipate heat generated by the semiconductor chip from the back surface of the laminated substrate 221. The steps S8 and S9 are steps performed outside the molding apparatus using only the individual mold 20. This completes one cycle of resin encapsulation of the semiconductor module 220. By repeating these steps S1 to S9, the resin sealing of the semiconductor module 220 is continuously performed.

Further, by applying the method for manufacturing a semiconductor device according to the first embodiment, for example, when the cavity 31 of the individual mold 20 is arranged in the recess 15 of the mold plate 2 on the movable side of the main body mold 10 (that is,). Also in the configuration of FIG. 8), the semiconductor module 220 can be resin-sealed. Also in this case, the semiconductor module 220 is placed so that the laminated substrate 221 is located in the space below the inside of the cavity 31 of the individual mold 20 inside the recess 15 of the mold plate 2 on the movable side of the main body mold 10. It is preferable to be arranged.

Specifically, for example, the method for manufacturing a semiconductor device according to the first embodiment when the individual mold 20 of FIG. 8 is used is the step S1 in the method for manufacturing a semiconductor device according to the above-described first embodiment. It is the same as the case where the individual mold 20 of FIG. 5 is used, except that the vertical positions of the mold plates 21 and 22 of the individual mold 20 in the step S4 are different. Specifically, when the individual mold 20 shown in FIG. 8 is used, the steps S1 and S4 may be performed as follows. 22 and 23 are cross-sectional views showing a state of another example in the process of manufacturing the semiconductor device according to the first embodiment. In the step S1, as shown in FIG. 22, the mold surface 21a of the mold plate 21 of the individual mold 20 is on the upper side, and the semiconductor module 220 is externally connected to the groove 21b at the bottom of the cavity 31 of the mold plate 21. The semiconductor module 220 is attached to the inside of the cavity 31 by inserting the other end of the terminal 225.

Next, the mold plates 21 and 22 of the individual mold 20 are overlapped with each other so that the mold surfaces 21a and 22a face each other, and the mold plate 22 of the individual mold 20 is put on the semiconductor module 220. As a result, in the semiconductor module 220, the external connection terminal 225 is fixed to the bottom surface of the cavity 31 of the template 21, and the conductivity of the main surface of the laminated substrate 221 opposite to the main surface on which the semiconductor chip 224 is mounted. The plate 223b is attached to the inside of the cavity 31 in a state where the plate 223b is in contact with and fixed to the mold surface 22a of the mold plate 22. The direction of the downward arrow indicated by reference numeral 41'is the direction of the pressure 41'applied to the semiconductor module 220 when the external connection terminal 225 is inserted into the groove 21b at the bottom of the cavity 31 of the mold plate 21 of the individual mold 20. .. The direction of the downward arrow indicated by the reference numeral 42'is the moving direction of the template 22 when the template 22 of the individual mold 20 is placed on the semiconductor module 220.

In the steps up to this point, as in the case of using the individual mold 20 of FIG. 5, the semiconductor module 220 has the main surface (the surface on which the semiconductor chip 224 and the external connection terminal 225 are mounted) of the laminated substrate 221 on the lower side. Then, the laminated substrate 221 is attached so as to be located on the upper side of the cavity 31. Therefore, as in the case of using the individual mold 20 of FIG. 5, the individual mold 20 is rotated in the step S2, and the mold plates 21 and 22 are turned upside down, and the subsequent steps are manufactured. The individual mold 20 can be transported to the device.

In the step S4, as shown in FIG. 23, the surface of the individual mold 20 on the runner 32 side and the gate surface 14a of the main body mold 10 are formed in the same manner as in the case of using the individual mold 20 of FIG. The individual mold 20 is fitted into the recess 11 of the mold plate 1 on the fixed side of the main body mold 10 so as to face each other. Similar to the case where the individual mold 20 of FIG. 5 is used, since the vertical positions of the mold plates 21 and 22 of the individual mold 20 are changed in the step S2, the individual mold 20 has a cavity 31. The individual mold 20 is fitted into the recess 11 of the mold plate 1 on the fixed side of the main body mold 10 so that the mold plate 22 is located on the lower side of the mold plate 21.

Therefore, the semiconductor module 220 is mounted so that the laminated substrate 221 is located on the lower side of the cavity 31 with the main surface of the laminated substrate 221 facing up, as in the case of using the individual mold 20 of FIG. Become a state. The direction of the arrow indicated by the reference numeral 44'is the direction of the pressure 44'applied to the individual mold 20 when the individual mold 20 is fitted into the recess 11 of the mold plate 1 on the fixed side of the main body mold 10. After that, as in the case of using the individual mold 20 of FIG. 5, the mold plate 2 on the movable side of the main body mold 10 is moved to close the main body mold 10, and then the main body mold 10 is clamped. good.

As described above, according to the first embodiment, the cavity for attaching the semiconductor component is provided in the individual mold, the main body mold is provided with the cavity (recess) for attaching the individual mold, and the individual mold is provided with resin. The configuration is such that only the cal and runner to be supplied are provided. As a result, the orientation of the semiconductor parts inside the main body mold can be freely designed by changing the orientation of attaching the individual molds to the main body mold in various ways. Further, by variously changing the positions of the individual molds inside the main body mold, the positions of the runner of the main body mold and the cavity of the individual mold can be freely designed. This makes it possible to freely design the injection direction of the resin to be injected from the runner of the main body mold into the cavity of the individual mold.

Further, at the stage of fitting the individual molds to the main body molds, there is a gap due to the clearance between the main body molds and the individual molds. If the resin is sealed in such a state, the resin may flow into the gap between the main body mold and the individual mold, and the individual mold may not be taken out. On the other hand, according to the first embodiment, by having the slide mechanism, there is no gap between the gate surface of the main body mold and the individual molds after the main body mold is fastened. Therefore, it is possible to prevent the resin material from flowing between the main body mold and the individual mold at the time of resin sealing. Therefore, individual molds can be attached and detached for each cycle of resin molding. Therefore, the individual mold having the semiconductor parts mounted in the optimum orientation can be attached to the molding mold in the optimum orientation.

Further, according to the first embodiment, the pretreatment (preheating of the semiconductor component, etc.) and the posttreatment (primary curing of the semiconductor component, etc.) performed on the semiconductor component are performed in a state where the individual mold is removed from the molding apparatus. Can be done at. Therefore, the time (cycle time) required for one cycle of processing in the molding apparatus can be shortened. Further, according to the first embodiment, by preparing a plurality of individual molds having the same configuration, while performing the post-processing with one individual mold, in parallel with the post-processing with the individual mold. , It can be processed in the molding apparatus by using other individual molds. Therefore, the cycle time in the processing in the molding apparatus can be further shortened. Further, according to the first embodiment, since an individual mold can be prepared for each semiconductor component, the individual mold can be optimized according to the shape of the semiconductor component. Further, according to the first embodiment, since the configuration of the main body mold is not changed, it is not necessary to change the setup in the molding apparatus due to the mold change.

(Embodiment 2)
Next, as a method for manufacturing the semiconductor device according to the second embodiment, the main body mold 10 is arranged so that the mold surfaces 21a and 22a are orthogonal to the mold surfaces 1a and 2a of the mold plates 1 and 2 of the main body mold 10. The individual mold 20 is arranged only in the recess 11 of the mold plate 1 on the fixed side, and the resin material 47 is supplied from the runner 13 of the main body mold 10 to the cavity 31 of the individual mold 20 in the direction from the upper side to the lower side. The resin sealing method of the semiconductor component in the case will be described. The main body mold 10 of the second embodiment corresponds to FIG. 6 of the first embodiment, and the mold plate 2 on the movable side does not have a recess 15. FIG. 24 is a cross-sectional view showing a state in the middle of manufacturing the semiconductor device according to the second embodiment.

The method for manufacturing the semiconductor device according to the second embodiment is the rotation angle of the individual mold 20 in the step S2 (step of rotating the individual mold 20) and the main body in the step S4 (mounting of the individual mold 20). The method for manufacturing a semiconductor device according to the first embodiment (FIG. 1) except that the mounting direction of the individual mold 20 to the mold 10 and the flow direction 54 of the resin material 47 in the step (resin sealing) of step S5 are different. 9) is the same. Further, in the second embodiment, since the mounting direction of the individual mold 20 to the main body mold 10 is different, the arrangement of each part of the individual mold 20 is different from that of the individual mold 20 of the first embodiment as described later. Slightly different. The configuration of the semiconductor module 220 (see FIG. 10) is the same as that of the first embodiment.

Specifically, first, the steps of steps S1 to S3 are sequentially performed in the same manner as in the first embodiment. At this time, in the step S2, the individual mold 20 is rotated by 90 ° about an axis orthogonal to the gravity direction G. That is, in the first embodiment, after the step S2, one of the molds 21 and 22 of the individual mold 20 is located below the other mold (G side in the gravity direction). (For example, the template 22 is below the template 21: see FIG. 11B). On the other hand, in the second embodiment, the mold surfaces 21a and 22a of the mold plates 21 and 22 are rotated by 90 ° about the axis orthogonal to the gravity direction G in the step S2. Is horizontal to the direction of gravity G, and both the mold plates 21 and 22 are located at the same height. By doing so, the individual mold 20 is conveyed to the subsequent steps in a state where the main surface of the laminated substrate 221 of the semiconductor module 220 is horizontal with respect to the gravity direction G (see FIG. 24).

As shown in FIG. 24, in the step S4, the main body mold 10 is fixed so that the mold surfaces 21a and 22a are orthogonal to the mold surfaces 1a and 2a of the mold plates 1 and 2 of the main body mold 10. The individual mold 20 is arranged in the recess 11 of the mold plate 1 on the side. Also in this case, as in the first embodiment (see FIGS. 13 to 15), a slide mechanism (not shown) is provided between the movable mold plate 2 of the main body mold 10 and the individual mold 20. , The individual mold 20 can be fitted so as to be pressed against the gate surface 14a of the main body mold 10. As for the method of taking out the individual mold 20, the individual mold 20 may be pushed up by an eject pin (not shown) as in the first embodiment.

The individual mold 20 of the second embodiment is different from the individual mold 20 of the first embodiment (see FIG. 12) in the following two points. The first difference is that the resin reservoir 33 and the runner 32 are formed on the side surfaces of the mold plates 21 and 22 of the individual mold 20 facing the mold surface 22a of the mold plate 2 on the movable side of the main body mold 10, respectively. It is a point that has been done. The second difference is that the main body faces the main surface opposite to the mold surface 22a on the side of the mold plate 22 of the individual mold 20 and the gate surface 14a of the main body mold 10. The point is that the individual mold 20 is fitted into the recess 11 of the mold plate 1 on the fixed side of the mold 10. That is, the individual metal is formed in the recess 11 of the mold plate 1 on the fixed side of the main body mold 10 so that the conductive plate 223a on which the semiconductor chip 224 is mounted and the gate surface 14a of the main body mold 10 of the laminated substrate 221 face each other. The mold 20 is fitted.

Further, the main surface of the laminated substrate 221 may be perpendicular to the mold surfaces 1a and 2a of the mold plates 1 and 2 of the main body mold 10, and for example, the semiconductor chip 224 of the laminated substrate 221 is not mounted. The individual mold 20 may be fitted into the recess 11 of the mold plate 1 on the fixed side of the main body mold 10 so that the conductive plate 223b and the gate surface 14a of the main body mold 10 face each other. In this case, the runner 32 is on the side surface of the mold plate 21 of the individual mold 20 (the mold plate in contact with the gate surface 14a of the main body mold 10) facing the mold surface 22a of the mold plate 2 on the movable side of the main body mold 10. Is formed. Further, a resin reservoir 33 is formed on the side surface of the mold plate 22 of the individual mold 20 facing the mold surface 22a of the mold plate 2 on the movable side of the main body mold 10.

By attaching the individual mold 20 to the main body mold 10 as described above, in the step S5, in the flow direction 54 from the upper side to the lower side from the runner 13 of the main body mold 10 to the cavity 31 of the individual mold 20. The resin material 47 is supplied. Therefore, gravity facilitates filling of the resin material 47 into the cavity 31 of the individual mold 20. Further, the bubbles 47a generated in the resin material 47 when the resin material 47 flows move to the upper space inside the cavity 31 of the individual mold 20 due to buoyancy. Therefore, similarly to the first embodiment, it is possible to prevent bubbles 47a from remaining on the surface of the semiconductor chip 224 of the laminated substrate 221 and the conductive plate 223a on which the semiconductor chip 224 is mounted. Further, since the main surface of the laminated substrate 221 is located substantially parallel to the flow direction 54 of the resin material 47, the flow of the resin material 47 on the laminated substrate 221 and between the laminated substrate 221 and the circuit board 226 is not easily obstructed. ..

As described above, according to the second embodiment, the same effect as that of the first embodiment can be obtained even when the flow direction of the resin material into the cavity to which the semiconductor component is attached is different. Further, according to the second embodiment, the mold surface of the individual mold and the mold surface of the main body mold are oriented in different directions, so that the laminated substrate and the circuit board of the semiconductor component are parallel to the gravity. It is arranged in various directions, and the flow of resin and bubbles can be made smoother.

(Embodiment 3)
Next, as a method for manufacturing the semiconductor device according to the third embodiment, the main body mold 10 is arranged so that the mold surfaces 21a and 22a are orthogonal to the mold surfaces 1a and 2a of the mold plates 1 and 2 of the main body mold 10. The individual mold 20 is arranged only in the recess 15 of the mold plate 2 on the movable side, and the resin material 47 is supplied from the runner 13 of the main body mold 10 to the cavity 31 of the individual mold 20 in the flow direction 74 from the lower side to the upper side. A resin sealing method for semiconductor parts will be described. The main body mold 10 of the third embodiment corresponds to FIG. 7 of the first embodiment, and the mold plate 1 on the fixed side does not have a recess 11. 25, 26A, 26B, and 27 are cross-sectional views showing a state in the middle of manufacturing the semiconductor device according to the third embodiment.

The method for manufacturing the semiconductor device according to the third embodiment is a step of rotating the individual mold 20, a step of step S4 (attachment of the individual mold 20), and a step of step S5 (resin sealing) of the resin material 47. The flow direction 74 and the process of step S6 (taking out the individual mold 5) are different from the method for manufacturing the semiconductor device according to the first embodiment (see FIG. 9). The configuration of the individual mold 20 is the same as that of the first embodiment except that the positions where the slide mechanisms 60b and 60c are provided are different as described later. The configuration of the semiconductor module 220 (see FIG. 10) is the same as that of the first embodiment.

Specifically, first, the steps of steps S1 to S3 are sequentially performed in the same manner as in the first embodiment. At this time, in the step S2, the individual mold 20 is rotated by 90 ° about an axis orthogonal to the gravity direction G, as in the second embodiment. As a result, as in the second embodiment, the individual mold 20 is conveyed to the subsequent steps in a state where the main surface of the laminated substrate 221 of the semiconductor module 220 is horizontal with respect to the gravity direction G (FIG. 25). reference).

Next, as shown in FIG. 25, in the step S4, the individual mold 20 is fitted into the recess 15 of the mold plate 2 on the movable side of the main body mold 10 with the runner 32 facing down. At this time, the individual mold 20 is fixed to the inside of the recess 15 by turning on the electromagnetic force of the electromagnet 18 embedded in the bottom surface of the recess 15 of the mold plate 2 on the movable side of the main body mold 10. The direction of the upward arrow indicated by reference numeral 71 is the moving direction of the individual mold 20 when the individual mold 20 is fitted into the recess 15 of the mold plate 2 on the movable side of the main body mold 10.

In the third embodiment, as in the second embodiment, the main surface of the laminated substrate 221 is the main body mold inside the recess 15 of the mold plate 2 on the movable side of the main body mold 10 via the individual mold 20. The semiconductor module 220 is attached so as to be perpendicular to the mold surfaces 1a and 2a of the mold plates 1 and 10 of 10. The resin reservoir 33 is located above the cavity 31 and the runner 32 is located below the cavity 31 with the individual mold 20 attached to the recess 15 of the mold plate 2 on the movable side of the main body mold 10. ..

A slide mechanism 60b is provided between the bottom surface of the recess 15 of the mold plate 2 on the movable side of the main body mold 10 and the side surface of the mold plate 22 of the individual mold 20 facing the bottom surface of the recess 15. ing. The protrusion 63 of the slide mechanism 60b is provided on the bottom surface of the recess 15 of the mold plate 2 on the movable side of the main body mold 10. The notch 64 of the slide mechanism 60b is a side surface of the mold plate 22 of the individual mold 20 that contacts the bottom surface of the recess 15 of the mold plate 2 on the movable side of the main body mold 10 (hereinafter, the mold plate 22 of the individual mold 20). It is provided on the upper side surface) so as to face the protrusion 63. The configuration of the protrusion 63 and the notch 64 of the slide mechanism 60b is the same as that of the slide mechanism of the first embodiment (see FIGS. 14A and 14B). When the individual mold 20 is fitted into the recess 15 of the mold plate 2 on the movable side of the main body mold 10, the protrusion 63 constituting the slide mechanism 60b is pushed into the notch 64.

Next, as shown in FIG. 26A, the movable side mold plate 2 of the main body mold 10 is moved so that the mold surface 2a of the movable side mold plate 2 becomes the mold surface 1a of the fixed side mold plate 1. By contacting them, the main body mold 10 is closed. Between the mold surface 1a of the fixed side mold plate 1 of the main body mold 10 and the side surface of the mold plate 22 of the individual mold 20 facing the fixed side mold plate 1 of the main body mold 10 A slide mechanism 60c is provided. Like the slide mechanism 60b, the slide mechanism 60c is composed of a protrusion 65 and a notch 66 that can be fitted to each other. FIG. 26B shows an enlarged state in the process of fitting the protrusion 65 and the notch 66 of the slide mechanism 60c of FIG. 26A.

As shown in FIG. 26B, the protrusion 65 of the slide mechanism 60c is provided on the mold surface 1a of the mold plate 1 on the fixed side of the main body mold 10. In the protrusion 65, the side surface (inclined surface) 65a facing the gate surface 14a (see FIG. 24) of the main body mold 10 is inclined with respect to the mold surface 1a of the mold plate 1 on the fixed side of the main body mold 10. As a result, the width becomes narrower as the distance from the mold surface 1a of the mold plate 1 on the fixed side of the main body mold 10 (that is, the higher the height), the more the inclined surface 65a separates from the gate surface 14a of the main body mold 10. It has a trapezoidal cross-sectional shape. That is, the inclined surface 65a of the protrusion 65 faces the gate surface 14b (see FIG. 26A) of the main body mold 10. The gate surface 14a of the main body mold 10 is a side wall on the gate 14 side of the recess 15 of the mold plate 2 on the movable side of the main body mold 10. The gate 14 of the mold plate 1 on the fixed side of the main body mold 10 extends to a position facing the runner 32 of the individual mold 20 in a direction orthogonal to the mold surface 1a of the mold plate 1 on the fixed side, for example. ing.

The notch 66 of the slide mechanism 60c is a surface of the mold plate 22 of the individual mold 20 that contacts the mold surface 1a of the mold plate 1 on the fixed side of the main body mold 10 (hereinafter, the mold plate 22 of the individual mold 20). The 22d (which is the lower side surface) is provided so as to face the protrusion 65. The notch 66 has an individual mold 20 because the side surface (inclined surface) 66a facing the gate surface 14a of the main body mold 10 is inclined with respect to the lower side surface 22d of the mold plate 22 of the individual mold 20. It has a substantially trapezoidal cross-sectional shape in which the width becomes narrower so that the inclined surface 66a separates from the gate surface 14a of the main body mold 10 as the distance from the lower side surface 22d of the template 22 increases (that is, the deeper the depth). That is, the notch 66 has substantially the same dimensions as the protrusion 65 and has substantially the same substantially trapezoidal cross-sectional shape as in the first embodiment. By providing the slide mechanism 60c having such a configuration, the pressure 72 applied from the movable side mold plate 2 of the main body mold 10 to the fixed side mold plate 1 when the main body mold 10 is closed, and the main body mold 10 The protrusion 65 of the mold surface 1a of the mold plate 1 on the fixed side of the main body mold 10 is pushed into the notch 66 of the individual mold 20 by the mold tightening force 3 (see FIG. 1).

Next, as in the first embodiment, the main body mold 10 is molded. At this time, the electromagnetic force of the electromagnet 18 is turned off at the final stage of mold clamping of the main body mold 10. By turning off the electromagnetic force of the electromagnet 18, when the main body mold 10 is clamped, the individual mold 20 is strongly pressed against the gate surface 14b of the main body mold 10 by the slide mechanisms 60b and 60c as in the first embodiment. .. Reference numeral 73 indicates that the individual mold 20 moves when the inclined surface 65a of the protrusion 65 of the slide mechanism 60c and the inclined surface 66a of the notch 66 come into contact with each other during mold clamping of the main body mold 10 (see FIG. 26B). Direction (horizontal direction). Only one of the slide mechanisms 60b and 60c may be provided.

By attaching the individual mold 20 to the main body mold 10, in the step S5, as shown in FIG. 27, the flow from the lower side to the upper side from the runner 13 of the main body mold 10 to the cavity 31 of the individual mold 20. The resin material 47 is supplied in the direction 74. Therefore, the bubbles 47a generated in the resin material 47 when the resin material 47 flows easily move to the space above the individual mold 20 (that is, the resin reservoir 33) due to gravity. Further, since the main surface of the laminated substrate 221 is located substantially parallel to the flow direction 74 of the resin material 47, the flow of the resin material 47 on the laminated substrate 221 and between the laminated substrate 221 and the circuit board 226 is not easily obstructed. ..

In the step S6, the electromagnetic force of the electromagnet 18 is turned off when the mold 2 on the movable side is moved to open the main body mold 10. As a result, the main body mold 10 can be opened with the individual mold 20 left on the mold surface 1a of the mold plate 1 on the fixed side of the main body mold 10, and the movable side of the main body mold 10 can be opened. The individual mold 20 can be easily taken out from the inside of the recess 15 of the template 2. The main body mold 10 may be opened by moving the mold plate 2 on the movable side while the electromagnetic force of the electromagnet 18 is turned on. In this case, after the main body mold 10 is opened, the electromagnetic force of the electromagnet 18 may be turned off, and the individual mold 20 may be taken out from the inside of the recess 15 of the mold plate 2 on the movable side.

As described above, according to the third embodiment, the same effect as that of the first and second embodiments can be obtained even when the flow direction of the resin material into the cavity to which the semiconductor component is attached is different. ..

(Embodiment 4)
Next, a method of manufacturing the semiconductor device according to the fourth embodiment will be described. 28, 29A, and 30 are cross-sectional views showing a state in the middle of manufacturing the semiconductor device according to the fourth embodiment. FIG. 29B is a plan view showing the plan shape of each part in the cutting lines B1-B2 of FIG. 29A. In the method for manufacturing a semiconductor device according to the fourth embodiment, the step S4 (attachment of the individual mold 20) and the step S6 (removal of the individual mold 5) are the semiconductor devices according to the third embodiment. (See FIG. 9). Moreover, since the steps S4 and S6 are different from the method for manufacturing the semiconductor device according to the third embodiment, the following two configurations of the main body mold 10 are different from the main body mold 10 of the third embodiment.

The first difference is that the width x2 of the bottom surface of the recess 15 of the mold plate 2 on the movable side of the main body mold 10 is the length of the surface of the individual mold 20 facing the bottom surface of the recess 15 (individual mold). This is a point wider than the length x11) in the direction orthogonal to the mold surfaces 21a and 22a of the mold 20. As a result, inside the recess 15 of the mold plate 2 on the movable side of the main body mold 10, a space (hereinafter referred to as a second space) 15b in which the individual mold 20 is arranged for resin-sealing the semiconductor module 220 is used. A space (hereinafter referred to as a first space) 15a for inserting and removing the individual mold 20 is provided in the recess 15 in succession to the above.

The second difference is that a support portion 15c that protrudes so as to be orthogonal to the gate surface 14b of the main body mold 10 is provided on the opening side of the recess 15 of the mold plate 2 on the movable side of the main body mold 10. It is a point. The support portion 15c contacts a part of the individual mold 20 arranged in the second space 15b of the recess 15 of the mold plate 2 on the movable side of the main body mold 10 to support the individual mold 20, and the recess 15 It has a function of preventing the individual mold 20 from falling from the inside of the. When the semiconductor module 220 is resin-sealed, a second surface surrounded by the gate surface 14b of the main body mold 10, the bottom surface 15d of the recess 15 of the movable side mold plate 2 of the main body mold 10, and the support portion 15c. The individual mold 20 is fitted into the space 15b (see FIGS. 29A and 29B).

By providing the first and second spaces 15a and 15b in the recesses 15 of the mold plate 2 on the movable side of the main body mold 10 in this way, in the step S4, first, as shown in FIG. 28, the main body mold 10 The individual mold 20 is pushed into the first space 15a of the recess 15 of the mold plate 2 on the movable side of the above. The direction of the upward arrow indicated by reference numeral 81 is the moving direction of the individual mold 20 when the individual mold 20 is pushed into the first space 15a of the recess 15 of the mold plate 2 on the movable side of the main body mold 10.

Next, as shown in FIGS. 29A and 29B, the individual mold 20 is fitted into the second space 15b of the recess 15 of the mold plate 2 on the movable side of the main body mold 10. At this time, the lateral pressure 82 applied to the individual mold 20 when the individual mold 20 is fitted into the second space 15b of the recess 15 of the concave portion 15 of the mold plate 2 on the movable side of the main body mold 10 causes the main body mold 10 to be formed. The protrusion 65 of the mold surface 1a of the mold plate 1 on the fixed side is pushed into the notch 66 of the individual mold 20. As a result, the individual mold 20 is strongly pressed against the gate surface 14b of the main body mold 10.

The configuration of the individual mold 20 faces the mold surface 1a of the mold plate 1 on the fixed side of the main body mold 10 and the mold plate 1 of the mold plate 22 of the individual mold 20 on the fixed side of the main body mold 10. It is the same as the individual mold 20 of the third embodiment except that the slide mechanism 60c is provided only between the side surface and the side surface. Although not shown, in the step S6, after the main body mold 10 is opened, the individual mold 20 is pulled out from the second space 15b to the first space 15a. Then, the individual mold 20 may be taken out from the first space 15a to the outside of the recess 15.

As described above, according to the fourth embodiment, the flow direction of the resin material into the cavity to which the semiconductor component is attached even when the method of attaching the individual mold to the main body mold 10 is changed. Can obtain the same effect as that of the third embodiment.

(Comparative example)
Next, the structure of the mold of the comparative example will be described. FIG. 31 is a perspective view showing the structure of the mold of the comparative example. FIG. 32 is a plan view showing a layout of the mold plate on the fixed side of the mold of FIG. 31 as viewed from the mold surface side. FIG. 33 is a cross-sectional view showing a cross-sectional structure at the cutting line AA-AA'of FIG. 32. FIG. 33 shows a state in which the mold 200 is closed. As shown in FIG. 31, the mold 200 of the comparative example has a cavity (cavity 211 described later) in which semiconductor parts for resin sealing can be arranged inside with the mold surfaces (main surfaces) 201a and 202a facing each other. ) Is formed of two (two) mold plates 201 and 202. One of the two templates 201, 202 is attached to the fixed plate of the molding apparatus, and the other template 202 is attached to the movable plate of the forming apparatus.

A cavity 211, a cal 212, a runner 213, a gate 214, and a resin reservoir 215 are formed on the mold surface 201a of the mold plate 201 on the fixed side (not shown in FIG. 31, see FIG. 32). The cavity 211 is a recess for arranging a semiconductor component to be resin-sealed. The cal 212 is a groove for arranging a resin material piece used for resin encapsulation of a semiconductor component. The runner 213 is a groove that serves as a flow path for the resin material that flows from the cal 212 to the cavity 211, and is formed so as to connect the cal 212 and all (here, four) cavities 211. The gate 214 is formed between the runner 213 and the cavity 211, and has a function of adjusting the speed of the resin material flowing into the cavity 211. The resin reservoir 215 is a groove that flows into the cavity 211 and accommodates the resin material that overflows from the cavity 211.

The movable mold plate 202 has a pot at a position facing the cal 212 of the mold plate 201 when the mold 200 is closed (that is, when the mold surfaces 201a, 202a of the mold plates 201, 202 come into contact with each other). (Heating chamber) 216 is formed. The pot 216 of the template 202 is a through hole penetrating from the mold surface 202a of the template 202 to the other main surface. Inside the pot 216 of the template 202, a blanger (not shown) that applies pressure to the resin material piece arranged in the cal 212 of the template 201 to press the softened resin material piece from the cal 212 into the cavity 211. ) Is placed. The pressure (mold tightening force) 203 for tightening (molding) the mold 200 so that the mold 200 is maintained in the closed state when the semiconductor component is sealed with resin depends on the size of the molded product and 1 according to the mold 200. It is determined by the number of molded products that can be processed in one molding.

In the mold 200 of this comparative example, for example, when the movable mold plate 202 is arranged on the fixed side mold plate 201, the direction of the mold tightening force 203 is orthogonal to the mold surfaces 201a, 202a of the mold plates 201, 202. It becomes the vertical direction (the direction parallel to the direction of gravity). In this case, the method of attaching the semiconductor component arranged in the cavity 211 of the template 201 on the fixed side and the direction 233 (see FIG. 37) in which the resin material 231 flows into the cavity 211 are restricted.

A resin sealing method for semiconductor parts using the mold 200 of the comparative example will be described by taking as an example a case where a semiconductor module (semiconductor part) 220 having a general configuration is resin-sealed. FIG. 34 is a flowchart showing an outline of a method for manufacturing a semiconductor device of a comparative example. FIG. 34 shows one cycle of resin encapsulation of the semiconductor module 220 using the mold 200 of the comparative example. 35 to 38 are cross-sectional views showing a state in which the semiconductor device of the comparative example is in the process of being manufactured. FIGS. 35 to 38 show a state in which the semiconductor module 220 using the mold 200 of the comparative example is in the process of being sealed with resin.

As shown in FIG. 35, a general semiconductor module 220 includes a semiconductor chip 224, an external connection terminal 225, and a laminated substrate 221. One end of the external connection terminal 225 is bonded to the conductive plate 223a on which the semiconductor chip 224 is mounted on the laminated substrate 221. Further, the external connection terminal 225 is arranged so as to be perpendicular to the main surface of the laminated board 221. The laminated substrate 221 is formed by forming conductive plates 223a and 223b on both sides of the ceramic substrate 222, respectively. Further, the semiconductor module 220 shown in FIG. 35 includes a circuit board 226 and terminal pins 227 for circuit wiring.

In sealing the semiconductor module 220 with resin, first, after assembling the semiconductor module 220, the other end of the external connection terminal 225 is a fixed side located on the lower side (gravity direction G side) of the mold 200. The semiconductor module 220 is attached to the inside of the cavity 211 by inserting it into the groove 211a on the bottom surface of the cavity 211 of the template 201 (step S101). That is, in step S101, the semiconductor module 220 is fixed inside the cavity 211 of the mold plate 201 on the fixed side of the mold 200 by the external connection terminal 225.

Next, after closing the mold 200, the mold 200 is clamped. At this time, the mold plate 201 on the fixed side of the mold 200 is arranged with the mold surface 201a on the upper side (opposite to the gravity direction G). Further, the mold plate 202 on the movable side of the mold 200 is arranged on the mold plate 201 on the fixed side with the mold surface 202a on the lower side (G side in the gravity direction). Therefore, the semiconductor module 220 is mounted inside the cavity 211 with the main surface on which the semiconductor chip 224 of the laminated substrate 221 and the external connection terminal 225 mounted are facing down.

For example, the back surface of the laminated substrate 221 (the surface opposite to the main surface on which the semiconductor chip 224 and the external connection terminal 225 are mounted) is on the bottom surface of the cavity 211 of the fixed side template 201 located below the mold 200. ) Is on the lower side, and it is not preferable to mount the semiconductor module 220. The reason is that the other end of the external connection terminal 225 (the end on the side not joined to the laminated substrate 221) is attached to the mold surface 202a of the movable mold plate 202 located above the fixed side mold plate 201. A groove (not shown) for inserting a portion (a portion to be exposed from the molding resin) is formed, and the other end portion of the external connection terminal 225 is inserted into the groove when the mold 200 is molded. Because it becomes. In this case, when the other end of the external connection terminal 225 is inserted into the groove of the mold surface 202a of the movable mold plate 202, the external connection terminal 225 may be broken or bent.

Further, for example, it is preferable to form a groove on the mold surface 202a of the movable mold plate 202, which is the upper mold plate of the mold 200, and insert the other end portion of the external connection terminal 225 into the groove. do not have. The reason is that the external connection terminal 225 of the semiconductor module 220 may fall out from the groove of the mold surface 202a of the movable mold plate 202 and the semiconductor module 220 may fall before starting the mold clamping of the mold 200. Because there is. Therefore, the semiconductor module 220 is attached by inserting the other end portion of the external connection terminal 225 into the groove 211a of the fixed side mold plate 201 which is the lower mold plate of the mold 200. As a result, the semiconductor module 220 is mounted so that the laminated substrate 221 is located on the upper side of the cavity 31 with the main surface of the laminated substrate 221 (the surface on which the semiconductor chip 224 and the external connection terminal 225 are mounted) facing down. It becomes a state.

Next, the semiconductor module 220 is left for a predetermined time while being attached to the mold 200 (step S102). The temperature of the mold 200 is always maintained at, for example, about 130 ° C. to 180 ° C. Therefore, by leaving the semiconductor module 220 attached to the mold 200 for a predetermined time before proceeding to step S103, the semiconductor module 220 inside the mold 200 is also heated. Next, the resin material piece is placed on the cal 212 of the template 201 on the fixed side. The resin material piece is heated and softened in the pot 216, and the softened resin material 231 flows into the cavity 211 (FIG. 36). Reference numeral 232 is a bubble remaining inside the resin material 231 that has flowed inside the cavity 211.

Next, the blanger 204 applies pressure to the softened resin material 231 inside the cal 212 of the fixed-side template 201 to allow the resin material 231 to flow, and the resin material 231 is press-fitted into the cavity 211 to create the inside of the cavity 211. Is filled with the resin material 231 (FIG. 37). As a result, the semiconductor module 220 inside the cavity 211 is covered with the resin material 231 and the semiconductor module 220 is resin-sealed (step S103). The resin material 231 overflowing from the cavity 211 is housed in a resin reservoir 215 adjacent to the cavity 211 on the opposite side of the runner 213 with respect to the cavity 211. Reference numeral 234 is an air reservoir in which bubbles 232 that have moved to the resin reservoir 215 are accumulated (FIG. 38).

Next, the resin material 231 is first cured by holding the semiconductor module 220 resin-sealed with the resin material 231 inside the cavity 211 for a predetermined time (step S104). Next, the mold 200 is opened (opened) and the molded product (semiconductor module 220 resin-sealed with the resin material 231) is taken out (step S105). In this way, the other end of the external connection terminal 225 and the back surface of the laminated substrate 221 are exposed, and the semiconductor module 220 in which the other portions are resin-sealed is formed. Next, by cleaning the residue (residual resin) of the resin material adhering to the molding apparatus and the mold 200 (step S106), one cycle of resin sealing of the semiconductor module 220 is completed. By repeating these steps S101 to S106, the resin sealing of the semiconductor module 220 is continuously performed.

In the mold 200 (FIGS. 31 to 33) of this comparative example, as described above, the mold plate 201 on the fixed side of the mold 200 is arranged with the mold surface 201a facing up, and the mold plate 202 on the movable side is the mold. The surface 202a is placed on the fixed side template 201 with the surface 202a on the lower side (gravity direction side). In this case, when the semiconductor module 220 is sealed with the resin, the softened resin material 231 flows in the direction 233 orthogonal to the direction of gravity. Therefore, the resin material 231 preferentially flows in the lower space inside the cavity 211 due to gravity. As a result, in the space from the middle height position inside the cavity 211 to the height position on the upper side (opposite to the gravity direction side), the flow of the resin material 231 is higher than the lower space inside the cavity 211. The speed slows down.

For example, if there is a difference in the flow velocity of the resin material 231 inside the cavity 211, bubbles 232 will remain in the space above the cavity 211 where the flow velocity of the resin material 231 is slow. Therefore, as described above, when the semiconductor module 220 is arranged so that the laminated substrate 221 is located in the space above the inside of the cavity 211 in order to secure and fix the position accuracy of the semiconductor module 220 (FIGS. 36 to 36). 38), the semiconductor module 220 may be resin-sealed with the bubbles 232 remaining on the conductive plate 223a on which the semiconductor chip 224 is mounted on the laminated substrate 221. The bubbles 232 remaining on the conductive plate 223a cause insulation defects in the semiconductor module 220. That is, it is difficult to optimize the mold 200 of the comparative example according to the shape of the semiconductor component.

On the other hand, according to the present invention, as described above, the orientation of the semiconductor module 220 inside the main body mold 10 can be freely designed by changing the orientation of attaching the individual mold 20 to the main body mold 10 in various ways. can do. Therefore, for example, by arranging the semiconductor module 220 so that the laminated substrate 221 is located in the space below the inside of the cavity 31 of the individual mold 20, the above-mentioned problem caused by the mold 200 of the comparative example occurs. do not have.

As described above, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, even if individual molds have different arrangements, shapes, and dimensions of recesses, runners, and resin reservoirs, if the individual molds have the same external dimensions, one main body mold can be used with various semiconductor modules. You may fit the individual molds that have been made. Further, if the rectangular parallelepiped individual molds have the same dimensions when rotated by 0 degrees (= 180 degrees) and 90 degrees, for example, the individual molds having the same configuration are fitted into one main body mold. When inserting, the individual molds may be fitted into the main body molds in different directions each time.

As described above, the method for manufacturing a semiconductor device and the molding die for the semiconductor device according to the present invention are useful when manufacturing the semiconductor device by the transfer molding method, and particularly when the semiconductor module is resin-sealed. Are suitable.

1 Mold plate on the fixed side of the main body mold 1a Mold surface on the fixed side of the main body mold 2 Mold surface on the movable side of the main body mold 2a Mold surface on the movable side of the main body mold 3 Mold tightening force 4 Brander 5 Individual mold 10 Main body mold 11 Recess on the fixed side of the main body mold 11a Pin hole 12 Cal 13 Runner 14 Gate 14a, 14b Gate surface of the main body mold 15 Recess on the movable side of the main body mold 15a Movable side of the main body mold 1st space of the concave part of the main body 15b 2nd space of the concave part on the movable side of the main body mold 15c Support part of the concave part on the movable side of the main body mold 15d Bottom of the concave part on the movable side of the main body mold 16 Pot 18 Electromagnet 20 Individual mold 21,22 Individual mold mold plates 21a, 22a Individual mold mold plate mold surface 22b Grooves for inserting external connection terminals of individual mold mold plates 22c, 22d Individual mold mold plate side surface 31 Cavity of individual mold 32 Runner of individual mold 33 Resin reservoir of individual mold 41, 41', 44, 44', 45, 72, 82 Pressure 43 Constant temperature bath 46 In the recess of the mold plate on the fixed side of the main body mold Direction parallel to the bottom surface 47 Resin material 47a Bubbles generated inside the resin material 47b Direction perpendicular to the gravity direction 49 Eject pin 51 Heater 54,74 Flow direction of the resin material 60a, 60a', 60b, 60c Slide mechanism 61, 61', 63, 65 Slide mechanism protrusions 61a, 61a', 65a Slide mechanism protrusion inclined surfaces 62, 62', 64,66 Slide mechanism notches 62a, 62a', 66a Slide mechanism notch inclined surfaces 220 Semiconductor module 221 Laminated board 222 Ceramic board 223a, 223b Conductive plate 224 Semiconductor chip 225 External connection terminal 226 Circuit board 227 Terminal pin G Gravity direction R Direction of rotation of individual mold x1 to x3 Recessed part of mold plate of main body Dimensions of three sides of a substantially rectangular cavity formed by x11 to x13 Dimensions of three sides of an individual mold having a substantially rectangular shape

Claims (19)

Individual molds
Two first mold plates that are overlapped with the mold surfaces facing each other,
A first cavity provided between the mold surfaces of the two first mold plates and to which semiconductor components are mounted inside,
A first path portion provided between the mold surfaces of the two first mold plates, connected to the first cavity, and supplying resin to the first cavity when the semiconductor component is resin-sealed. Have,
The main body mold is
Two second mold plates that are overlapped with the mold surfaces facing each other,
A resin supply unit provided between the mold surfaces of the two second mold plates and supplying the resin to the first cavity, and a resin supply unit.
A second cavity provided between the mold surfaces of the two second mold plates and to which the individual mold is mounted inside,
A second path portion provided between the mold surfaces of the two second mold plates, connected to the resin supply section and the second cavity, and supplying the resin from the resin supply section to the second cavity. And have
The individual mold and the main body mold move the individual mold toward a surface having the second path portion inside the second cavity when the individual mold is pushed into the second cavity. Further, it has a moving mechanism for fixing the individual mold to a surface having the second path portion inside the second cavity.
The moving mechanism is provided on a surface of the individual mold and the main body mold that is orthogonal to and faces the direction in which the individual mold is pushed into the second cavity .
The main body mold is a molding mold for a semiconductor device, further comprising an extrusion mechanism for extruding the individual mold attached to the second cavity from the second cavity . The molding die for a semiconductor device according to claim 1, wherein the moving mechanism has a protrusion provided on one surface and a groove provided on the opposite surface and fitted to the protrusion. .. The main body mold connects the second path portion and the first path portion between the second path portion and the first path portion of the individual mold, and from the second path portion. The molding die for a semiconductor device according to claim 1 or 2, which has a gate for adjusting the inflow rate of the resin flowing into the first path portion. Individual molds
Two first mold plates that are overlapped with the mold surfaces facing each other,
A first cavity provided between the mold surfaces of the two first mold plates and to which semiconductor components are mounted inside,
A first path portion provided between the mold surfaces of the two first mold plates, connected to the first cavity, and supplying resin to the first cavity when the semiconductor component is resin-sealed. Have,
The main body mold is
Two second mold plates that are overlapped with the mold surfaces facing each other,
A resin supply unit provided between the mold surfaces of the two second mold plates and supplying the resin to the first cavity, and a resin supply unit.
A second cavity provided between the mold surfaces of the two second mold plates and to which the individual mold is mounted inside,
A second path portion provided between the mold surfaces of the two second mold plates, connected to the resin supply section and the second cavity, and supplying the resin from the resin supply section to the second cavity. And have
The mold surface of the individual mold and the mold surface of the main body mold face different directions.
The main body mold is a molding mold for a semiconductor device, further comprising an extrusion mechanism for extruding the individual mold attached to the second cavity from the second cavity. The molding die for a semiconductor device according to claim 4, wherein the mold surface of the individual mold and the mold surface of the main body mold are orthogonal to each other. The individual mold is
Further having a resin accommodating portion provided on the opposite side of the first path portion with respect to the first cavity on the mold surface of the first mold plate and accommodating the resin overflowing from the first cavity.
The invention according to any one of claims 1 to 4, wherein when the individual mold is attached to the second cavity of the main body mold, the resin accommodating portion is located above the first cavity. Molding dies for semiconductor devices. The extrusion mechanism is an eject pin that moves so as to project from the main body mold side to the individual mold side, contacts at least a part of the individual mold, and pushes the individual mold out of the second cavity. The molding die for a semiconductor device according to any one of claims 1 to 6. A first mounting process in which semiconductor parts are attached to one of the first molds of an individual mold having two first molds, and the mold surfaces of the two first molds are overlapped with each other facing each other. When,
A second mold having two second molds, the individual mold is attached to one of the second molds, and the mold surfaces of the two second molds are overlapped with each other so as to face each other. Installation process and
A sealing step provided on the mold surface of the second mold plate, in which the resin is supplied to the individual mold from a resin supply unit that supplies the resin to the individual mold, and the semiconductor parts are sealed with the resin. When,
The first take-out step of taking out the individual mold from the main body mold, and
A second extraction step of extracting the semiconductor component from the individual mold, and
In order,
In the first mounting step, the semiconductor component is mounted inside the first cavity provided on the mold surface of the first mold plate of one of the individual molds, and the mold surfaces of the two first mold plates are mounted. By superimposing the semiconductor parts so as to face each other, the semiconductor component is fixed inside the first cavity and a first path portion connected to the first cavity is formed .
In the second mounting step,
A state in which the individual mold is attached to the inside of a second cavity provided on the mold surface of one of the main body molds, and the mold surfaces of the two second mold plates face each other. The individual molds are pushed into the second cavity, and a second path portion connecting the resin supply portion and the first cavity is formed via the first path portion .
The individual mold is pushed into the second cavity by a moving mechanism provided on a surface of the individual mold and the main body mold, which is orthogonal to and faces the direction in which the individual mold is pushed into the second cavity. The mold is moved toward the surface of the second path portion inside the second cavity, and the individual mold is fixed to the surface of the second path portion inside the second cavity.
In the sealing step, the resin is supplied from the resin supply section to the first cavity via the second path section and the first path section.
In the first extraction step, the semiconductor device is characterized in that the individual mold is taken out from the main body mold by extruding the individual mold from the second cavity by an extrusion mechanism attached to the second cavity. Manufacturing method. In the first taking-out step, the individual mold is closed to the second cavity by an eject pin that moves so as to project from the main body mold side to the individual mold side and comes into contact with at least a part of the individual mold. The method for manufacturing a semiconductor device according to claim 8, wherein the semiconductor device is extruded from the surface. The method for manufacturing a semiconductor device according to claim 8 or 9, further comprising a heating step of heating the individual mold before the second take-out step. The method for manufacturing a semiconductor device according to claim 10, wherein the heating step is performed after the first mounting step. The method for manufacturing a semiconductor device according to claim 10, wherein in the second mounting step, the heating step is performed by the heat transferred from the heated main body mold. After the first mounting step and before the second mounting step, the individual mold is rotated to determine the direction of the semiconductor component inside the individual mold with respect to the gravity direction during the first mounting step. The method for manufacturing a semiconductor device according to any one of claims 8 to 12, further comprising a rotation step of changing the direction to a different direction from the above. The method for manufacturing a semiconductor device according to claim 13, wherein in the rotation step, the individual mold is rotated by 180 ° about an axis orthogonal to the direction of gravity. The method for manufacturing a semiconductor device according to claim 13, wherein in the rotation step, the individual mold is rotated by 90 ° about an axis orthogonal to the direction of gravity. In the sealing step, the resin is supplied from the resin supply unit to the first cavity, and the semiconductor component is sealed with the resin.
In the first taking-out step, the individual mold is taken out from the second cavity of the main body mold.
The method for manufacturing a semiconductor device according to any one of claims 8 to 15, wherein in the second extraction step, the semiconductor component is taken out from the first cavity of the individual mold. In the second mounting step, the individual mold is placed inside the second cavity of the main body mold so that the first path portion and the second path portion are located at the same height as the first cavity. The method for manufacturing a semiconductor device according to any one of claims 8 to 16. In the second mounting step, the individual mold is mounted inside the second cavity of the main body mold so that the first path portion and the second path portion are located above the first cavity. The method for manufacturing a semiconductor device according to any one of claims 8 to 16. In the second mounting step, the individual mold is mounted inside the second cavity of the main body mold so that the first path portion and the second path portion are located below the first cavity. The method for manufacturing a semiconductor device according to any one of claims 8 to 16.

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