KR101230714B1 - Mold apparatus for resin encapsulation - Google Patents

Mold apparatus for resin encapsulation Download PDF

Info

Publication number
KR101230714B1
KR101230714B1 KR1020110008982A KR20110008982A KR101230714B1 KR 101230714 B1 KR101230714 B1 KR 101230714B1 KR 1020110008982 A KR1020110008982 A KR 1020110008982A KR 20110008982 A KR20110008982 A KR 20110008982A KR 101230714 B1 KR101230714 B1 KR 101230714B1
Authority
KR
South Korea
Prior art keywords
resin
cavity
sealing
communication path
transfer pin
Prior art date
Application number
KR1020110008982A
Other languages
Korean (ko)
Other versions
KR20110090796A (en
Inventor
켄지 오가타
세이고우 칸자키
Original Assignee
다이-이치 세이코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이-이치 세이코 가부시키가이샤 filed Critical 다이-이치 세이코 가부시키가이샤
Publication of KR20110090796A publication Critical patent/KR20110090796A/en
Application granted granted Critical
Publication of KR101230714B1 publication Critical patent/KR101230714B1/en

Links

Images

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The present invention is to provide a resin sealing mold apparatus that is easy to clean, has high productivity, and has a good yield. To this end, the resin sealing mold apparatus communicates with the cavity 21 formed in the lower mold 10 through the communication path 24 among the upper and lower molds sandwiching the substrate on which the semiconductor device is mounted on the surface to seal the resin. The resin reservoir 23 is provided, and the transfer pins 26 are installed on the resin reservoir 23 so as to be movable. In particular, the transfer pin in the resin storage portion 23 at a position away from the communication path 24 by a distance that the sealing resin material extruded directly into the transfer pin 26 cannot pass through the communication path 24. (26) is provided.

Description

Resin Sealing Mold Device {MOLD APPARATUS FOR RESIN ENCAPSULATION}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a resin sealing mold apparatus, particularly a resin sealing mold apparatus for sealing an electronic component such as a semiconductor element mounted on a substrate with a liquid sealing resin material at room temperature.

A conventional resin sealing mold apparatus is for resin-sealing a substrate on which one or more semiconductor devices are mounted by using an upper mold and a lower mold having one or more preliminary cavities having upper and lower movable mechanisms. Some are used for the sealing molding method (refer patent document 1).

That is, a process of heating the upper mold and the lower mold, a process of supplying a sealing resin of a required amount or more to a cavity formed in the lower mold, and a mounting surface of the semiconductor element is opposed to a surface on which the cavity of the lower mold is formed ( Mounting the substrate to the lower mold so as to

Contacting the upper mold with the lower mold on which the substrate is mounted;

Melting the sealing resin and introducing the sealing resin beyond the required amount into the preliminary cavity;

In a step of pressing a predetermined molding pressure to the sealing resin with the vertical moving mechanism,

It is a resin sealing mold apparatus which always seals a board | substrate by making the amount of sealing resin in the said cavity constant.

JP 2006-245151 A

However, in the above-mentioned resin sealing mold apparatus (FIGS. 1 and 2), since the sealing resin material with high liquidity fluidity is used at normal temperature, between the upper and lower movable mechanisms 5 and the lower mold 2 during resin molding. A sealing resin material easily penetrates into a clearance gap, and solidified resin residue easily arises. Further, even when the mold cleaning is performed every time the molding work is finished, the resin residues are not easily removed completely, resulting in poor work efficiency. For this reason, in the subsequent resin molding step, when the vertical movable mechanism 5 is operated, the remaining resin residues enter the cavity and cause defective products, resulting in a poor yield.

In view of the above problems, an object of the present invention is to provide a resin sealing mold apparatus which is easy to clean, has high work efficiency, and has a good yield.

In order to solve the said subject, the resin sealing mold apparatus which concerns on this invention communicates through the communication path to the cavity formed in the lower mold among the upper and lower molds which clamp the resin by sealing the board | substrate which mounted the component on the surface. Forming a resin reservoir so as to move the transfer pin to the resin reservoir, and injecting a sealing resin material into at least one of the cavity and the resin reservoir, and inserting a substrate into the sealing resin material in the cavity. A resin sealing mold apparatus for immersing a component of the mold and clamping the substrate with the cavity block and the upper mold, wherein a sealing resin material extruded directly by the transfer pin from the communicating passage among the resin reservoirs is used to seal the communicating passage. The transfer pin is provided at a position separated by a distance that cannot pass.

According to the present invention, even if resin residue is generated in the gap between the lower mold and the transfer pin, the resin residue does not penetrate into the cavity through the communication path, and the resin residue remains in the resin reservoir. Therefore, defective products do not occur, the yield is not only improved, and the cleaning operation of the mold is simplified, and the productivity is improved.

As an embodiment of the present invention, groove-shaped resin reservoirs may be formed along the sides of the cavity.

According to this embodiment, since the resin storage part is formed in groove shape, the small resin sealing die apparatus with a small bottom area can be obtained.

In another embodiment of the present invention, the resin reservoir portion communicating with the communication path formed on at least one side of the cavity may be formed, and the transfer pin may be disposed in the inner corner of the resin reservoir portion.

According to this embodiment, since the transfer pin is provided in the inner corner of the resin storage portion, the resin storage portion can be made the length of the required minimum limit, so that the bottom area becomes small, whereby a small resin sealing device can be obtained.

In another embodiment of the present invention, the resin reservoirs may be formed in communication with the communication path formed on at least one side of the cavity and extend in opposite directions, respectively, and the transfer pins may be disposed in the inner corners of the resin reservoir. .

According to this embodiment, since the sealing resin material is divided into and flowed into the resin storage part extended in the opposite direction, respectively, the time which flows into a resin storage part from a cavity can be shortened, and production efficiency improves further.

In still another embodiment of the present invention, the resin reservoir portion may be formed in communication paths formed at adjacent corners of the cavity so that both ends communicate with each other, and a transfer pin may be provided in the center of the resin reservoir portion.

According to this embodiment, since the excess sealing resin material flows into the resin storage part via two communication paths, the injection time of the resin sealing material can be shortened, and the production efficiency is further improved.

Moreover, the fluctuation of the supply amount of the sealing resin material can be eliminated with a small number of transfer pins, and a resin sealing mold apparatus with a simple structure can be obtained.

In a new embodiment of the present invention, the communication path to the cavity, the position and shape of the resin reservoir and the transfer pin are arranged and formed so as to be point symmetrical with the center of symmetry at the intersection of the diagonal lines of the cavity. It is good also as a structure.

According to this embodiment, since the communication path | route, the resin storage part, and the transfer pin are arrange | positioned in the position which becomes point symmetry, it can mold-release a molded article in a balanced manner. Therefore, it is not necessary to install the ejector pins in the cavity, there is no fear of generation of resin residues and mixing, and the yield is not only improved, but the cleaning operation of the mold is simplified, and the productivity is further improved. have.

1 is a plan view showing a lower mold of the first embodiment of the resin sealing mold apparatus according to the present invention.
FIG. 2 is a cross-sectional view showing the manufacturing process of the upper and lower molds according to the first embodiment shown in FIG. 1.
3 (3a, 3b, 3c) are sectional views showing the manufacturing process following FIG.
4 (4a, 4b, 4c) are sectional views showing the manufacturing process following FIG.
5 (5a, 5b) are plan views showing a state in which the resin injected into the lower mold of the first embodiment diffuses.
6 is a plan view showing the lower mold of the second embodiment of the resin sealing mold apparatus according to the present invention.
7 is a plan view showing the lower mold of the third embodiment of the resin sealing mold apparatus according to the present invention.
Fig. 8 is a plan view showing the lower mold of the fourth embodiment of the resin sealing mold apparatus according to the present invention.
9 (9a, 9b) are plan views showing a state in which the resin injected into the lower mold of the fourth embodiment diffuses.

Next, an embodiment of the resin sealing mold apparatus according to the present invention will be described according to the accompanying drawings in FIGS. 1 to 9.

The resin sealing mold apparatus according to the first embodiment is composed of a lower mold 10 and an upper mold 30, as shown in Figs. The lower mold 10 is to fit the cavity block 20 of the planar quadrilateral to the hermetic block 11 of the quadrangular frame shape.

As for the said sealing block 11, the annular packing 12 is embedded along the upper end surface.

In the cavity block 20, partition walls 22 and 22 are formed on both sides of the cavity 21 formed at the center thereof, thereby partitioning the cavity 21 and the resin reservoir 23. The cavity 21 and the resin reservoir 23 communicate with each other via a communication path 24 formed in the center of the partition wall 22.

In the inner corner of the resin reservoir 23, a transfer pin 26 capable of moving up and down is provided. Therefore, the transfer pin 26 is disposed at the position farthest from the communication path 24.

On the other hand, the transfer pin is provided at a position away from the communication path by a distance at which the sealing resin material extruded directly by the transfer pin cannot pass through the communication path. Therefore, even if resin residues occur in the gap between the lower mold and the transfer pin, the resin residues remain in the resin reservoir and do not penetrate into the cavity.

The upper mold 30 has the same planar shape as the lower mold 10, and a vacuum suction hole (not shown) capable of adsorbing and holding a substrate 42 described later on its lower surface. Not formed).

As the sealing resin material 40 used for this embodiment, transparent resin, such as a silicone resin which is a liquid at normal temperature, or an epoxy resin is mentioned, for example. Since the sealing resin material 40 has high fluidity and easily leaks from the air vent formed in the mold, in the present embodiment, the air in the cavity is drawn out by a vacuum decompression device without forming an air vent. After the pressure was reduced to a pressure of, the resin was sealed.

Next, the working process of the said resin sealing mold apparatus is demonstrated.

As shown in FIG. 2, of the lower mold 10 and the upper mold 30 in the open state, the transfer pin 26 of the lower mold 10 is pulled to a position lower than the bottom surface of the resin reservoir 23. It is in the indented state, and the fluctuation | variation of the supply amount of the sealing resin material 40 supplied was able to be eliminated.

As shown in FIG. 5A, a dispenser (not shown) in the center of the cavity 21 of the lower mold 10 and the recess and the resin reservoir 23 into which the transfer pin 26 is drawn is drawn. When the sealing resin material 40 is injected appropriately, the sealing resin material 40 is diffused as shown in FIG. 5B.

On the other hand, the substrate 42 on which the semiconductor device 41 is mounted is conveyed to an encoder (not shown) so as to be adsorbed and held by the vacuum suction hole of the upper mold 30 ( 3a). After the lower mold 10 is raised, only the sealed block 11 is raised again, and the lower surface of the upper mold 30 is pressed against the packing 12 of the sealed block 11 to close the sealed space 31. Form. Subsequently, the air in the sealed space 31 is extracted with a vacuum decompression device, and the pressure is reduced to a predetermined pressure. Then, the cavity block 20 is pushed up, and the substrate (in the sealing resin material 40 in the cavity 21) The semiconductor element 41 of 42 is immersed and sealed with resin, and the substrate 42 is clamped by the cavity block 20 and the upper mold 30. At that time, the excess sealing resin 40 in the cavity 21 flows into the resin storage part 23 via the communication path 24. As shown in FIG. 4A, the transfer pin 26 is moved to and fro, thereby absorbing fluctuations in the supply amount of the sealing resin material 40 and at the same time forming a predetermined molding pressure in the cavity 21. Is applied to cure the sealing resin material 40.

In addition, in this embodiment, although the sealing resin material 40 is inject | poured into the recessed part created by attracting the cavity 21 and the transfer pin 26, and the resin storage part 23, it is only in the cavity 21. You may inject.

However, in the case where the sealing resin material is injected only into the cavity 21, when the clamping speed is high when the substrate 42 is clamped by the cavity block 20 and the upper mold 30, the sealing resin material 40 communicates with each other. Not only (24) but since the partition wall 22 may be directly passed into the resin reservoir 23, it is necessary to slow down the clamp speed.

On the other hand, when the sealing resin material 40 is pre-injected into the recessed part created by drawing the cavity 21 and the transfer pin 26, and the resin storage part 23, the resin storage part 23 from the cavity 21 is carried out. It is possible to reduce the amount of the sealing resin material 40 flowing into the). Therefore, there is an advantage that the clamp speed can be increased and the productivity can be further improved.

As shown in FIG. 4B, after the sealing resin material 40 is cured, the lower mold 10 is lowered, and the transfer pin 26 is protruded to form the molded article 43 in the lower mold 10. ). At this time, since the vacuum suction hole of the upper mold 30 continues to adsorb | suck the board | substrate 42, it assists mold release of the molded article 43, and prevents a fall. Then, the lower mold 10 and the upper mold 30 are separated by a predetermined distance, and then the resin sealing operation is completed by carrying out the molded article 43 by an unloader (not shown). Thereafter, by repeating the same resin sealing operation, the continuous operation becomes possible.

In the second embodiment, as shown in FIG. 6, the communication paths 24 and 24 are formed at the centers of the opposite sides of the cavity 21 formed in the cavity block 20, respectively. Is a case where the resin reservoirs 23 are extended in the opposite directions, respectively. In the inner corner of the resin reservoir 23, a transfer pin 26 capable of moving up and down is provided. Others are the same as in the first embodiment described above, and thus description thereof is omitted.

According to this embodiment, there exists an advantage that a structure is simple and manufacture is easy.

In the third embodiment, as shown in FIG. 7, the communication paths 24 are formed at the centers of the four sides of the cavity 21 formed in the cavity block 20, and both sides from the communication paths 24 are provided. This is the case where the resin storage portions 23 are formed, respectively. And the transfer pin 26 which can move to the inner corner of the said resin storage part 23 is provided. Since others are the same as those of the first embodiment described above, the description is omitted.

According to this embodiment, since the resin storage part 23 is formed in each of the four sides of the cavity 21, even if the fluctuation | variation of the supply amount of a sealing resin material is large, it can adjust easily. Therefore, there exists an advantage that it is easy to respond even if the size and number of components mounted on the surface of a board | substrate differ.

In the fourth embodiment, as shown in FIG. 8, the communication paths 24 are formed in the corners of the two sides that face each other among the four sides of the cavity 21 formed in the cavity block 20. The resin storage part 23 is formed so that both ends may communicate with the furnaces 24 and 24. Then, a transfer pin 26 capable of moving in the center of the resin reservoir 23 is provided. Therefore, the transfer pin 26 is disposed at the position farthest from the communication path 24. Since others are the same as those of the first embodiment described above, the description is omitted.

In the fourth embodiment, as shown in FIG. 9, when the sealing resin material 40 is appropriately injected and diffused into the cavity 21, the extra sealing resin material 40 is connected to the two communication paths 24. It flows into the resin reservoir 23 through. Therefore, the resin sealing work time can be shortened and the production efficiency is further improved.

Moreover, the fluctuation of the supply amount of the sealing resin material can be eliminated with the few transfer pins 26, and there exists an advantage that the resin sealing mold apparatus with a simple structure can be obtained.

In addition, the said communication path is not limited to the case formed in the center of the side of the cavity 21, It may be formed in the middle of a side as needed, It does not specifically limit.

In addition, since the resin storage part may be formed in three sides of a cavity, of course, it can select suitably as needed.

The transfer pin is not limited to the case where it is installed in the inner corner of the resin reservoir, and may be provided at a position separated by a distance from which the resin residue cannot pass through the communication path.

The resin sealing mold apparatus according to the present invention is not limited to the semiconductor device described above, and of course, the LED element can also be resin sealed as a component.

10 ： Lower mold
11 ： Hermetic block
12 ： Packing
20 ： Cavity Block
21 ： Cavity
22 ： Partition wall
23 ： Resin storage part
24 ： Communication route
26 ： Transfer pin
30 ： Upper mold
31 ： Enclosed space
40 ： Sealing resin material
41 ： Semiconductor device
42 ： Board
43 ： Molded article

Claims (6)

A resin reservoir is formed so as to communicate through a communication path to the cavity formed in the lower mold among upper and lower molds sandwiching the substrate on which the component is mounted on the surface, and the transfer pin can be moved to the resin reservoir. In addition, a sealing resin material is injected into at least one of the cavity and the resin reservoir, a part of the substrate is immersed in the sealing resin material in the cavity, and the resin sealing clamps the substrate with the cavity block and the upper mold. As a mold apparatus,
The resin sealing mold apparatus of the said resin storage part provided with the said transfer pin in the position separated from the said communication path by the distance which the sealing resin material directly extruded by the said transfer pin cannot pass through the said communication path. . The resin sealing mold apparatus according to claim 1, wherein a groove-shaped resin reservoir is formed along the side of the cavity. The resin sealing mold apparatus according to claim 1 or 2, wherein a resin storage portion communicating with a communication path formed on at least one side of the cavity is formed, and a transfer pin is disposed at an inner corner of the resin storage portion. . The resin reservoir according to claim 1 or 2, wherein a resin reservoir is formed in communication with a communication path formed on at least one side of the cavity and extends in opposite directions, respectively, and transfer pins are disposed at inner corners of the resin reservoir. Resin sealing mold machine. The resin sealing mold according to claim 1 or 2, wherein resin reservoirs are formed in communication paths formed at adjacent corners of the cavity so that both ends communicate with each other, and a transfer pin is provided at the center of the resin reservoir. Device. The position and shape of the communication path to the cavity, the position of the resin reservoir and the transfer pin are arranged and formed so as to be point symmetrical with the center of symmetry at the point where the diagonal line of the cavity intersects. Resin sealing mold device.
KR1020110008982A 2010-02-03 2011-01-28 Mold apparatus for resin encapsulation KR101230714B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010022313A JP5428903B2 (en) 2010-02-03 2010-02-03 Resin sealing mold equipment
JPJP-P-2010-022313 2010-02-03

Publications (2)

Publication Number Publication Date
KR20110090796A KR20110090796A (en) 2011-08-10
KR101230714B1 true KR101230714B1 (en) 2013-02-07

Family

ID=44438798

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110008982A KR101230714B1 (en) 2010-02-03 2011-01-28 Mold apparatus for resin encapsulation

Country Status (4)

Country Link
JP (1) JP5428903B2 (en)
KR (1) KR101230714B1 (en)
CN (1) CN102157398B (en)
TW (1) TW201132483A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5627618B2 (en) * 2012-02-23 2014-11-19 Ｔｏｗａ株式会社 Fixing jig manufacturing method and fixing jig
JP6143665B2 (en) * 2013-12-26 2017-06-07 Ｔｏｗａ株式会社 Semiconductor sealing method and semiconductor sealing device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0878455A (en) * 1994-08-31 1996-03-22 Nec Corp Manufacturing equipment of plastic molded type semiconductor device and its manufacture
KR20010090606A (en) * 2000-05-17 2001-10-18 니시무로 타이죠 Semiconductor device, method for manufacturing semiconductor device, resin sealing mold and system for manufacturing semiconductor
KR20060102504A (en) * 2005-03-22 2006-09-27 가부시끼가이샤 르네사스 테크놀로지 A method of manufacturing a semiconductor device
KR20080067682A (en) * 2004-11-12 2008-07-21 마쯔시다덴기산교 가부시키가이샤 Resin-sealed mold and resin-sealed device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03110845U (en) * 1990-02-27 1991-11-13
JPH06106560A (en) * 1992-09-29 1994-04-19 Sanyo Silicon Denshi Kk Electronic part sealing mold
JPH091596A (en) * 1995-06-20 1997-01-07 Hitachi Ltd Molding device
JPH10296787A (en) * 1997-04-24 1998-11-10 Matsushita Electric Ind Co Ltd Insert resin molding device
JPH11121487A (en) * 1997-10-14 1999-04-30 Oki Electric Ind Co Ltd Resin sealing device for semiconductor device
JP3127889B2 (en) * 1998-06-25 2001-01-29 日本電気株式会社 Manufacturing method of semiconductor package and mold for molding the same
US7384582B2 (en) * 2000-08-04 2008-06-10 Renesas Technology Corp. Mold cleaning sheet and method for producing semiconductor devices using the same
JP3667249B2 (en) * 2001-04-24 2005-07-06 アピックヤマダ株式会社 Resin sealing device
JP4388789B2 (en) * 2003-10-29 2009-12-24 新日本無線株式会社 Resin sealing device and resin sealing method for semiconductor device
JP4855026B2 (en) * 2005-09-27 2012-01-18 Ｔｏｗａ株式会社 Resin sealing molding method and apparatus for electronic parts

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0878455A (en) * 1994-08-31 1996-03-22 Nec Corp Manufacturing equipment of plastic molded type semiconductor device and its manufacture
KR20010090606A (en) * 2000-05-17 2001-10-18 니시무로 타이죠 Semiconductor device, method for manufacturing semiconductor device, resin sealing mold and system for manufacturing semiconductor
KR20080067682A (en) * 2004-11-12 2008-07-21 마쯔시다덴기산교 가부시키가이샤 Resin-sealed mold and resin-sealed device
KR20060102504A (en) * 2005-03-22 2006-09-27 가부시끼가이샤 르네사스 테크놀로지 A method of manufacturing a semiconductor device

Also Published As

Publication number Publication date
KR20110090796A (en) 2011-08-10
JP2011159915A (en) 2011-08-18
TW201132483A (en) 2011-10-01
CN102157398B (en) 2014-10-29
CN102157398A (en) 2011-08-17
JP5428903B2 (en) 2014-02-26

Similar Documents

Publication Publication Date Title
KR100929054B1 (en) Method of Resin Encapsulation, Apparatus for Resin Encapsulation, Method of Manufacturing Semiconductor Device, Semiconductor Device and Resin Material
KR101832597B1 (en) Resin Sealing Apparatus and Resin Sealing Method
KR20150126360A (en) Resin molding mold, resin molding device, resin molding method, and resin molding mold evaluation method
KR102059738B1 (en) Molding die, resin molding apparatus, resin molding method and method for manufacturing resin-molded component
TWI633630B (en) Compression molding device, resin packaging product manufacturing device, compression molding method, and resin packaging product manufacturing method
EP3025838B1 (en) Molded article production system and molded article production method
KR20170099957A (en) Resin molding device and resin molding method
JP2013123849A (en) Resin sealing device and resin sealing method
CN113597365A (en) Resin molding device and method for manufacturing resin molded product
TW201923991A (en) Resin molding apparatus and method for manufacturing resin-molded product capable of suppressing or preventing molding defects even if the thickness of a product to be molded varies
KR101614970B1 (en) Method and system for cooling resin-sealed substrate, system for conveying such substrate, and resin-sealing system
JP5065747B2 (en) Semiconductor package manufacturing method and manufacturing apparatus
KR101230714B1 (en) Mold apparatus for resin encapsulation
KR101052324B1 (en) Encapsulation material forming method
JP2018086739A (en) Mold, resin molding device, and resin molding method
KR101835787B1 (en) A moulding apparatus for manufacturing semiconductor package
CN113573867A (en) Resin molding device and method for manufacturing resin molded product
JP2000286279A (en) Resin-sealing device and sealing method
KR20190090778A (en) Compression Molding Apparatus, Compression Molding Method and Manufacturing Method of Compression Molded Article
KR101496033B1 (en) Wafer level molding apparatus
JP7203926B1 (en) Mold for resin molding, resin molding apparatus, and method for manufacturing resin molded product
KR102071561B1 (en) Molding apparatus for semiconductor package
KR20120028686A (en) Molding apparatus for manufacturing semiconductor packages
KR101562773B1 (en) Side view package and die set and method for forming its body
KR20170015174A (en) Electronic component sealing apparatus and electronic component manufacturing method using the same

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20151130

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee