JP2016191719A5 - - Google Patents
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- JP2016191719A5 JP2016191719A5 JP2016147718A JP2016147718A JP2016191719A5 JP 2016191719 A5 JP2016191719 A5 JP 2016191719A5 JP 2016147718 A JP2016147718 A JP 2016147718A JP 2016147718 A JP2016147718 A JP 2016147718A JP 2016191719 A5 JP2016191719 A5 JP 2016191719A5
- Authority
- JP
- Japan
- Prior art keywords
- inspection tool
- identified
- pattern types
- critical pattern
- sampling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161445164P | 2011-02-22 | 2011-02-22 | |
| US61/445,164 | 2011-02-22 | ||
| US13/399,805 US8656323B2 (en) | 2011-02-22 | 2012-02-17 | Based device risk assessment |
| US13/399,805 | 2012-02-17 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013555475A Division JP5980237B2 (ja) | 2011-02-22 | 2012-02-20 | 設計ベースデバイスリスク評価 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018080437A Division JP6498337B2 (ja) | 2011-02-22 | 2018-04-19 | デバイス処理監視方法及び装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016191719A JP2016191719A (ja) | 2016-11-10 |
| JP2016191719A5 true JP2016191719A5 (enExample) | 2017-02-09 |
| JP6329209B2 JP6329209B2 (ja) | 2018-05-23 |
Family
ID=46653807
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013555475A Active JP5980237B2 (ja) | 2011-02-22 | 2012-02-20 | 設計ベースデバイスリスク評価 |
| JP2016147718A Active JP6329209B2 (ja) | 2011-02-22 | 2016-07-27 | 設計ベースデバイスリスク評価 |
| JP2018080437A Active JP6498337B2 (ja) | 2011-02-22 | 2018-04-19 | デバイス処理監視方法及び装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013555475A Active JP5980237B2 (ja) | 2011-02-22 | 2012-02-20 | 設計ベースデバイスリスク評価 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018080437A Active JP6498337B2 (ja) | 2011-02-22 | 2018-04-19 | デバイス処理監視方法及び装置 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8656323B2 (enExample) |
| EP (1) | EP2678880A4 (enExample) |
| JP (3) | JP5980237B2 (enExample) |
| KR (4) | KR102351672B1 (enExample) |
| IL (1) | IL228063A (enExample) |
| SG (1) | SG192891A1 (enExample) |
| TW (1) | TWI468958B (enExample) |
| WO (1) | WO2012115912A2 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5841710B2 (ja) * | 2010-03-17 | 2016-01-13 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法 |
| JP2012155179A (ja) * | 2011-01-27 | 2012-08-16 | Toshiba Corp | 欠陥検査支援装置、欠陥検査支援方法 |
| US8656323B2 (en) * | 2011-02-22 | 2014-02-18 | Kla-Tencor Corporation | Based device risk assessment |
| US9443051B2 (en) * | 2012-08-22 | 2016-09-13 | Mentor Graphics Corporation | Generating root cause candidates for yield analysis |
| US9406330B1 (en) * | 2013-06-19 | 2016-08-02 | WD Media, LLC | Method for HDD disk defect source detection |
| US10120372B2 (en) * | 2013-08-01 | 2018-11-06 | Applied Materials, Inc. | Event processing based system for manufacturing yield improvement |
| US10712289B2 (en) * | 2014-07-29 | 2020-07-14 | Kla-Tencor Corp. | Inspection for multiple process steps in a single inspection process |
| US10133263B1 (en) | 2014-08-18 | 2018-11-20 | Kla-Tencor Corporation | Process condition based dynamic defect inspection |
| US10483081B2 (en) | 2014-10-22 | 2019-11-19 | Kla-Tencor Corp. | Self directed metrology and pattern classification |
| US10267746B2 (en) | 2014-10-22 | 2019-04-23 | Kla-Tencor Corp. | Automated pattern fidelity measurement plan generation |
| US9800605B2 (en) * | 2015-01-30 | 2017-10-24 | Securonix, Inc. | Risk scoring for threat assessment |
| US10018571B2 (en) | 2015-05-28 | 2018-07-10 | Kla-Tencor Corporation | System and method for dynamic care area generation on an inspection tool |
| US10062543B2 (en) | 2015-06-23 | 2018-08-28 | Kla-Tencor Corp. | Determining multi-patterning step overlay error |
| JP2018523820A (ja) * | 2015-07-30 | 2018-08-23 | ケーエルエー−テンカー コーポレイション | 検査ツールへのダイナミックケアエリア生成システムおよび方法 |
| TWI684225B (zh) * | 2015-08-28 | 2020-02-01 | 美商克萊譚克公司 | 自定向計量和圖樣分類 |
| CN112198762B (zh) | 2015-12-22 | 2023-09-19 | Asml荷兰有限公司 | 用于过程窗口表征的设备和方法 |
| US10365639B2 (en) * | 2016-01-06 | 2019-07-30 | Kla-Tencor Corporation | Feature selection and automated process window monitoring through outlier detection |
| US10181185B2 (en) | 2016-01-11 | 2019-01-15 | Kla-Tencor Corp. | Image based specimen process control |
| JP6886607B2 (ja) * | 2016-07-29 | 2021-06-16 | 株式会社ニコン | 欠陥評価装置、欠陥評価方法、および構造物の製造方法 |
| US10055535B2 (en) * | 2016-09-27 | 2018-08-21 | Globalfoundries Inc. | Method, system and program product for identifying anomalies in integrated circuit design layouts |
| US10706522B2 (en) | 2016-11-08 | 2020-07-07 | Kla-Tencor Corporation | System and method for generation of wafer inspection critical areas |
| US10628544B2 (en) | 2017-09-25 | 2020-04-21 | International Business Machines Corporation | Optimizing integrated circuit designs based on interactions between multiple integration design rules |
| US11023648B2 (en) | 2017-12-12 | 2021-06-01 | Siemens Industry Software Inc. | Puzzle-based pattern analysis and classification |
| US10937705B2 (en) * | 2018-03-30 | 2021-03-02 | Onto Innovation Inc. | Sample inspection using topography |
| US11619592B2 (en) * | 2019-07-09 | 2023-04-04 | KLA Corp. | Selecting defect detection methods for inspection of a specimen |
| US11727171B2 (en) * | 2020-09-29 | 2023-08-15 | X Development Llc | Techniques for using convex fabrication loss functions during an inverse design process to obtain fabricable designs |
| CN114943441B (zh) * | 2022-05-17 | 2024-06-18 | 北京师范大学 | 一种基于poi数据的区域土壤污染健康风险评估方法 |
| CN115891670B (zh) * | 2023-03-09 | 2023-06-13 | 西南交通大学 | 一种悬浮体结构及其永磁电动悬浮系统、间隙计算方法 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4475122A (en) * | 1981-11-09 | 1984-10-02 | Tre Semiconductor Equipment Corporation | Automatic wafer alignment technique |
| US6470489B1 (en) * | 1997-09-17 | 2002-10-22 | Numerical Technologies, Inc. | Design rule checking system and method |
| US6553329B2 (en) * | 1999-12-13 | 2003-04-22 | Texas Instruments Incorporated | System for mapping logical functional test data of logical integrated circuits to physical representation using pruned diagnostic list |
| JP3678133B2 (ja) * | 2000-10-30 | 2005-08-03 | 株式会社日立製作所 | 検査システムおよび半導体デバイスの製造方法 |
| US20080189575A1 (en) * | 2001-05-24 | 2008-08-07 | Emilio Miguelanez | Methods and apparatus for data analysis |
| US20110178967A1 (en) * | 2001-05-24 | 2011-07-21 | Test Advantage, Inc. | Methods and apparatus for data analysis |
| EP1479025B1 (en) * | 2001-05-24 | 2010-09-29 | Test Advantage, Inc. | Methods and apparatus for semiconductor testing |
| US8017411B2 (en) * | 2002-12-18 | 2011-09-13 | GlobalFoundries, Inc. | Dynamic adaptive sampling rate for model prediction |
| WO2004061898A2 (en) * | 2003-01-02 | 2004-07-22 | Pdf Solutions, Inc. | Yield improvement |
| US7346470B2 (en) * | 2003-06-10 | 2008-03-18 | International Business Machines Corporation | System for identification of defects on circuits or other arrayed products |
| US9002497B2 (en) * | 2003-07-03 | 2015-04-07 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of wafers and reticles using designer intent data |
| US7135344B2 (en) * | 2003-07-11 | 2006-11-14 | Applied Materials, Israel, Ltd. | Design-based monitoring |
| JP4276503B2 (ja) * | 2003-09-22 | 2009-06-10 | 株式会社日立製作所 | 半導体不良原因絞込み方法 |
| US7003758B2 (en) * | 2003-10-07 | 2006-02-21 | Brion Technologies, Inc. | System and method for lithography simulation |
| US7394534B1 (en) | 2003-11-19 | 2008-07-01 | Kla-Tencor Corporation | Process excursion detection |
| US6931297B1 (en) * | 2004-03-05 | 2005-08-16 | Lsi Logic Corporation | Feature targeted inspection |
| US7373277B1 (en) * | 2004-03-09 | 2008-05-13 | Kla-Tencor Technologies Corp. | Methods and systems for detection of selected defects particularly in relatively noisy inspection data |
| TW200622275A (en) * | 2004-09-06 | 2006-07-01 | Mentor Graphics Corp | Integrated circuit yield and quality analysis methods and systems |
| US7600212B2 (en) * | 2005-10-03 | 2009-10-06 | Cadence Design Systems, Inc. | Method of compensating photomask data for the effects of etch and lithography processes |
| US7698676B1 (en) * | 2005-11-10 | 2010-04-13 | Qi-De Qian | Method and system for improving manufacturability of integrated devices |
| US7676077B2 (en) * | 2005-11-18 | 2010-03-09 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
| US7570796B2 (en) * | 2005-11-18 | 2009-08-04 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
| US8041103B2 (en) * | 2005-11-18 | 2011-10-18 | Kla-Tencor Technologies Corp. | Methods and systems for determining a position of inspection data in design data space |
| JP2007189141A (ja) * | 2006-01-16 | 2007-07-26 | Fujitsu Ltd | 集積回路の製造方法。 |
| EP1873663A1 (en) * | 2006-06-27 | 2008-01-02 | Takumi Technology Corporation | Method for optimizing an integrated circuit physical layout |
| US20090073440A1 (en) * | 2006-09-30 | 2009-03-19 | Timothy Tiemeyer | System and method for detecting surface features on a semiconductor workpiece surface |
| KR100828026B1 (ko) | 2007-04-05 | 2008-05-08 | 삼성전자주식회사 | 집적회로 설계패턴의 레이아웃 수정방법 및 이를 수행하기위한 장치 |
| US8175831B2 (en) * | 2007-04-23 | 2012-05-08 | Kla-Tencor Corp. | Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers |
| JP4774383B2 (ja) * | 2007-05-31 | 2011-09-14 | 株式会社日立ハイテクノロジーズ | データ処理装置、およびデータ処理方法 |
| CN101785009B (zh) * | 2007-08-20 | 2012-10-10 | 恪纳腾公司 | 确定实际缺陷是潜在系统性缺陷还是潜在随机缺陷的计算机实现的方法 |
| JP5081590B2 (ja) * | 2007-11-14 | 2012-11-28 | 株式会社日立ハイテクノロジーズ | 欠陥観察分類方法及びその装置 |
| JP5065943B2 (ja) * | 2008-02-29 | 2012-11-07 | 株式会社日立ハイテクノロジーズ | 製造プロセスモニタリングシステム |
| US20090273669A1 (en) * | 2008-04-30 | 2009-11-05 | Nadav Wertsman | Method and system for detecting critical defects |
| JP5429869B2 (ja) * | 2008-12-22 | 2014-02-26 | 株式会社 Ngr | パターン検査装置および方法 |
| JP2010249656A (ja) * | 2009-04-15 | 2010-11-04 | Toshiba Corp | 基板検査装置および基板検査方法 |
| US8594975B2 (en) * | 2010-03-04 | 2013-11-26 | Kla-Tencor Corporation | Systems and methods for wafer edge feature detection and quantification |
| US8572440B1 (en) * | 2010-11-15 | 2013-10-29 | E.Digital Corporation | System and method for managing information stored in semiconductors |
| US8656323B2 (en) | 2011-02-22 | 2014-02-18 | Kla-Tencor Corporation | Based device risk assessment |
-
2012
- 2012-02-17 US US13/399,805 patent/US8656323B2/en active Active
- 2012-02-20 JP JP2013555475A patent/JP5980237B2/ja active Active
- 2012-02-20 WO PCT/US2012/025827 patent/WO2012115912A2/en not_active Ceased
- 2012-02-20 KR KR1020217003069A patent/KR102351672B1/ko active Active
- 2012-02-20 SG SG2013063565A patent/SG192891A1/en unknown
- 2012-02-20 KR KR1020197034994A patent/KR102212388B1/ko active Active
- 2012-02-20 KR KR1020187035840A patent/KR102051773B1/ko active Active
- 2012-02-20 KR KR1020137024554A patent/KR101931834B1/ko active Active
- 2012-02-20 EP EP12749801.2A patent/EP2678880A4/en not_active Withdrawn
- 2012-02-22 TW TW101105895A patent/TWI468958B/zh active
-
2013
- 2013-08-21 IL IL228063A patent/IL228063A/en active IP Right Grant
-
2014
- 2014-02-12 US US14/178,866 patent/US10223492B1/en active Active
-
2016
- 2016-07-27 JP JP2016147718A patent/JP6329209B2/ja active Active
-
2018
- 2018-04-19 JP JP2018080437A patent/JP6498337B2/ja active Active
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