JP2016181511A - 導電性粒子、異方性導電接着剤及び接続構造体 - Google Patents

導電性粒子、異方性導電接着剤及び接続構造体 Download PDF

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Publication number
JP2016181511A
JP2016181511A JP2016059252A JP2016059252A JP2016181511A JP 2016181511 A JP2016181511 A JP 2016181511A JP 2016059252 A JP2016059252 A JP 2016059252A JP 2016059252 A JP2016059252 A JP 2016059252A JP 2016181511 A JP2016181511 A JP 2016181511A
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JP
Japan
Prior art keywords
particles
metal layer
particle
conductive particles
sputtering
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Pending
Application number
JP2016059252A
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English (en)
Japanese (ja)
Inventor
博之 熊倉
Hiroyuki Kumakura
博之 熊倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of JP2016181511A publication Critical patent/JP2016181511A/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/023—Alloys based on aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
JP2016059252A 2015-03-23 2016-03-23 導電性粒子、異方性導電接着剤及び接続構造体 Pending JP2016181511A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015059415 2015-03-23
JP2015059415 2015-03-23

Publications (1)

Publication Number Publication Date
JP2016181511A true JP2016181511A (ja) 2016-10-13

Family

ID=56977377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016059252A Pending JP2016181511A (ja) 2015-03-23 2016-03-23 導電性粒子、異方性導電接着剤及び接続構造体

Country Status (3)

Country Link
JP (1) JP2016181511A (ko)
KR (1) KR20170093911A (ko)
WO (1) WO2016152943A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220161358A (ko) 2020-03-30 2022-12-06 쇼와덴코머티리얼즈가부시끼가이샤 접착제 조성물 및 접속 구조체

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002331385A (ja) * 2001-05-08 2002-11-19 Sony Corp はんだ材料及びその製造方法、並びにはんだペースト
KR101342255B1 (ko) * 2009-11-16 2013-12-16 히타치가세이가부시끼가이샤 회로 접속 재료 및 이를 이용한 회로 부재의 접속 구조
JP5522390B2 (ja) * 2010-07-27 2014-06-18 Ｊｓｒ株式会社 導電性ペースト組成物および導電接着方法
JP2012164454A (ja) * 2011-02-04 2012-08-30 Sony Chemical & Information Device Corp 導電性粒子及びこれを用いた異方性導電材料
JP6188456B2 (ja) * 2012-07-03 2017-08-30 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6457743B2 (ja) * 2013-05-22 2019-01-23 積水化学工業株式会社 接続構造体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220161358A (ko) 2020-03-30 2022-12-06 쇼와덴코머티리얼즈가부시끼가이샤 접착제 조성물 및 접속 구조체
US11887748B2 (en) 2020-03-30 2024-01-30 Resonac Corporation Adhesive composition and coupling structure

Also Published As

Publication number Publication date
WO2016152943A1 (ja) 2016-09-29
KR20170093911A (ko) 2017-08-16

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