JP2016171332A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016171332A5 JP2016171332A5 JP2016089114A JP2016089114A JP2016171332A5 JP 2016171332 A5 JP2016171332 A5 JP 2016171332A5 JP 2016089114 A JP2016089114 A JP 2016089114A JP 2016089114 A JP2016089114 A JP 2016089114A JP 2016171332 A5 JP2016171332 A5 JP 2016171332A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- silicon wafer
- polishing composition
- wafer polishing
- molecular weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 37
- 238000005498 polishing Methods 0.000 claims description 26
- 150000002894 organic compounds Chemical class 0.000 claims description 13
- 239000006061 abrasive grain Substances 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 9
- 229910052710 silicon Inorganic materials 0.000 claims 9
- 239000010703 silicon Substances 0.000 claims 9
- 125000003368 amide group Chemical group 0.000 claims 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000000304 alkynyl group Chemical group 0.000 claims 1
- 125000003710 aryl alkyl group Chemical group 0.000 claims 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 125000001309 chloro group Chemical group Cl* 0.000 claims 1
- 125000004093 cyano group Chemical group *C#N 0.000 claims 1
- 125000001028 difluoromethyl group Chemical group [H]C(F)(F)* 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims 1
- 239000002245 particle Substances 0.000 description 10
- 230000002776 aggregation Effects 0.000 description 7
- 239000004372 Polyvinyl alcohol Substances 0.000 description 5
- 238000004220 aggregation Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920002451 polyvinyl alcohol Polymers 0.000 description 5
- 229920000463 Poly(ethylene glycol)-block-poly(propylene glycol)-block-poly(ethylene glycol) Polymers 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000005054 agglomeration Methods 0.000 description 2
- 238000002296 dynamic light scattering Methods 0.000 description 2
- 229920003169 water-soluble polymer Polymers 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 0 CC*[N+]([N-])N=C Chemical compound CC*[N+]([N-])N=C 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016089114A JP6348927B2 (ja) | 2016-04-27 | 2016-04-27 | シリコンウェーハ研磨用組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016089114A JP6348927B2 (ja) | 2016-04-27 | 2016-04-27 | シリコンウェーハ研磨用組成物 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014129497A Division JP6185432B2 (ja) | 2014-06-24 | 2014-06-24 | シリコンウェーハ研磨用組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016171332A JP2016171332A (ja) | 2016-09-23 |
| JP2016171332A5 true JP2016171332A5 (enExample) | 2017-07-20 |
| JP6348927B2 JP6348927B2 (ja) | 2018-06-27 |
Family
ID=56984177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016089114A Active JP6348927B2 (ja) | 2016-04-27 | 2016-04-27 | シリコンウェーハ研磨用組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6348927B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6893835B2 (ja) * | 2017-06-23 | 2021-06-23 | 花王株式会社 | シリコンウェーハ用仕上げ研磨液組成物 |
| JP7103823B2 (ja) * | 2018-03-30 | 2022-07-20 | 株式会社フジミインコーポレーテッド | シリコンウェーハの研磨方法および研磨用組成物 |
| JPWO2023189812A1 (enExample) | 2022-03-31 | 2023-10-05 | ||
| CN119654704A (zh) | 2022-08-05 | 2025-03-18 | 福吉米株式会社 | 研磨用组合物 |
| CN117229717B (zh) * | 2023-08-23 | 2026-03-06 | 上海集成电路材料研究院有限公司 | 一种化学机械抛光液及其制备方法和用途 |
| CN117229716B (zh) * | 2023-08-23 | 2026-03-10 | 上海集成电路材料研究院有限公司 | 一种含吗啉环水溶性小分子的用途及化学机械抛光液 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103890114B (zh) * | 2011-10-24 | 2015-08-26 | 福吉米株式会社 | 研磨用组合物、使用了其的研磨方法和基板的制造方法 |
| JP2014041978A (ja) * | 2012-08-23 | 2014-03-06 | Fujimi Inc | 研磨用組成物、研磨用組成物の製造方法、及び研磨用組成物原液の製造方法 |
| WO2014034425A1 (ja) * | 2012-08-31 | 2014-03-06 | 株式会社 フジミインコーポレーテッド | 研磨用組成物及び基板の製造方法 |
-
2016
- 2016-04-27 JP JP2016089114A patent/JP6348927B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016201557A5 (enExample) | ||
| CN104703941B (zh) | 适用于具有改进特性的干式混合配制品的可再分散聚合物粉末混合物 | |
| JP5491184B2 (ja) | 研磨用組成物 | |
| JP2009292868A5 (enExample) | ||
| JP2019073730A (ja) | 熱伝導性ポリオルガノシロキサン組成物 | |
| JP2013534981A5 (enExample) | ||
| JP2009024168A5 (enExample) | ||
| JP6183821B2 (ja) | エマルション型粘着剤組成物 | |
| CN111448288A (zh) | 包含微细二氧化硅的用于油井水泥浆和水基钻井流体的添加剂及其制备方法 | |
| RU2014129612A (ru) | Композиция для химико-механического полирования, содержащая поливинилфосфоновую кислоту и ее производные | |
| BRPI1103860B1 (pt) | cimento, e , método de vedação, ligação ou revestimento de um substrato | |
| JP2010511777A5 (enExample) | ||
| JP2013510199A (ja) | 疎水性会合する水溶性ナノコンポジット（建築化学適用のためのレオロジー改質剤として） | |
| WO2019131448A1 (ja) | 研磨用組成物 | |
| JP2019121641A5 (enExample) | ||
| EP2176187A2 (fr) | Composition cimentaire pour béton autoplaçant et béton autoplaçant renfermant une telle composition | |
| JP2016522855A (ja) | Ｎ−ビニル−ホモポリマーおよびｎ−ビニルコポリマーからなる群から選択される１種または複数のポリマーを含む化学機械研磨組成物 | |
| JP2008291112A5 (enExample) | ||
| JP2009270034A5 (enExample) | ||
| JP3568154B2 (ja) | カチオン性グラフト改質天然ゴムラテックス | |
| CN103025486B (zh) | 固结磨料线锯用水溶性加工液 | |
| JPWO2008117573A1 (ja) | 化学機械研磨用水系分散体、該水系分散体を調製するためのキット、化学機械研磨方法、および半導体装置の製造方法 | |
| JP2007126568A5 (enExample) | ||
| JP5828655B2 (ja) | 塗料用樹脂組成物 | |
| JP5770432B2 (ja) | 加熱乾燥用エマルション組成物、その製造方法及び制振材組成物 |