JP2016146412A - 半導体装置の製造方法、及びアンダーフィルフィルム - Google Patents
半導体装置の製造方法、及びアンダーフィルフィルム Download PDFInfo
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- JP2016146412A JP2016146412A JP2015022672A JP2015022672A JP2016146412A JP 2016146412 A JP2016146412 A JP 2016146412A JP 2015022672 A JP2015022672 A JP 2015022672A JP 2015022672 A JP2015022672 A JP 2015022672A JP 2016146412 A JP2016146412 A JP 2016146412A
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Abstract
Description
工程B:基板上で半導体チップの位置合わせを行う。
工程C:高温・高圧により半導体チップと基板を圧着し、ハンダバンプの金属結合による導通確保、及びアンダーフィルフィルムの硬化による半導体チップと基板の接着を行う。
1.アンダーフィルフィルム
2.半導体装置の製造方法
3.実施例
本実施の形態におけるアンダーフィルフィルムは、複数の半導体チップと電子部品とを、一括圧着するためのものであって、エポキシ樹脂と、酸無水物と、アクリル樹脂と、有機過酸化物とを含有し、最低溶融粘度が、1000Pa・s以上2000Pa・s以下であり、最低溶融粘度到達温度より10℃高い温度から該温度より10℃高い温度までの溶融粘度の傾きが、900Pa・s/℃以上3100Pa・s/℃以下である。ここで、電子部品としては、複数の半導体チップを搭載するボトムチップ、回路基板などが挙げられる。
次に、前述したアンダーフィルフィルムを用いた半導体装置の製造方法について説明する。本実施の形態における半導体装置の製造方法は、ハンダ付き電極が形成された複数の半導体チップを、アンダーフィルフィルムを介してハンダ付き電極と対向する対向電極が形成された電子部品に搭載する搭載工程と、複数の半導体チップと電子部品とを、アンダーフィルフィルムを介して一括圧着する圧着工程とを有する。本法で使用するアンダーフィルフィルムは、前述のように、エポキシ樹脂と、酸無水物と、アクリル樹脂と、有機過酸化物とを含有し、最低溶融粘度が、1000Pa・s以上2000Pa・s以下であり、最低溶融粘度到達温度より10℃高い温度から該温度より10℃高い温度までの溶融粘度の傾きが、900Pa・s/℃以上3100Pa・s/℃以下であるものである。
また、本技術は、半導体チップに設けた小さな孔に金属を充填することによって、サンドイッチ状に積み重ねた複数のチップ基板を電気的に接続するTSV(Through Silicon Via)技術にも適用可能である。
以下、本発明の実施例について説明する。本実施例では、先供給型のアンダーフィルフィルムを作製し、次いで、アンダーフィルフィルムを用いてハンダ付き電極を有する複数の上チップと、これに対向する電極を有する下チップとを図11及び図12に示すようなギャングボンディング装置を使って、一括圧着させて実装体を作製し、ボイド、ハンダ接合状態、及びフィレットについて評価した。
まず、参考例として、アンダーフィルフィルムを用いて1ヘッドに対して1チップずつ接続させて実装体を作製し、ボイド及びハンダ接合状態を評価した。アンダーフィルフィルムの最低溶融粘度及び溶融粘度の傾きの測定、実装体の作製、ボイドの評価、ハンダ接合の評価は、次のように行った。
3.1の実施例と同様、各アンダーフィルフィルムについて、レオメータ(TA社製ARES)を用いて、5℃/min、1Hzの条件でサンプルの最低溶融粘度及び最低溶融粘度到達温度を測定した。そして、最低溶融粘度到達温度+10℃〜最低溶融粘度到達温度+20℃の温度範囲における溶融粘度の傾きを算出した。
アンダーフィルフィルムをウエハ上にプレス機にて、50℃−0.5MPaの条件で貼り合わせ、ダンシングしてハンダ付き電極を有するICチップを得た。
50℃/secの昇温速度で熱圧着した第1の実装体、及び150℃/secの昇温速度で熱圧着した第2の実装体をSAT(Scanning Acoustic Tomograph, 超音波映像装置)を用いて観察した。第1の実装体及び第2の実装体の両者ともボイドが発生していない場合を「○」と評価し、いずれかの実装体にボイドが発生している場合を「×」と評価した。一般的に、ボイドが生じると、長期信頼性に悪影響を及ぼす可能性が高くなる。
50℃/secの昇温速度で熱圧着した第1の実装体、及び150℃/secの昇温速度で熱圧着した第2の実装体のサンプルを切断し、断面研磨を行い、ICチップの電極とIC基板の電極との間のハンダの状態をSEM(Scanning Electron Microscope)観察した。第1の実装体及び第2の実装体の両者ともハンダ接続、ハンダ濡れ共に良好な状態を「○」と評価し、いずれかの実装体のハンダ接続、又はハンダ濡れが不十分な状態を「×」と評価した。
膜形成樹脂としてのアクリルゴムポリマー(品名:テイサンレジンSG−P3、ナガセケムテックス社製)を40質量部、エポキシ樹脂(品名:JER1031S、三菱化学社製)を20質量部、酸無水物(品名:リカシッドHNA−100、新日本理化社製)を10質量部、硬化促進剤としてのイミダゾール(品名:U−CAT−5002、サンアプロ社製)を1質量部、アクリル樹脂(品名:オクゾールEA−0200、大阪有機化学社製)を68質量部、有機過酸化物(品名:パーヘキサV、日油社製)を2質量部、フィラー(品名:アエロジルR202、日本アエロジル社製)を15質量部配合し、アクリル/エポキシが70/30の樹脂組成物を調製した。これを、剥離処理されたPET(Polyethylene terephthalate)にバーコーターを用いて塗布し、80℃のオーブンで3分間乾燥させ、厚み50μmのアンダーフィルフィルムを作製した(カバー剥離PET(25μm)/アンダーフィルフィルム(50μm)/ベース剥離PET(50μm))。
膜形成樹脂としてのアクリルゴムポリマー(品名:テイサンレジンSG−P3、ナガセケムテックス社製)を40質量部、エポキシ樹脂(品名:JER1031S、三菱化学社製)を30質量部、酸無水物(品名:リカシッドHNA−100、新日本理化社製)を20質量部、硬化促進剤としてのイミダゾール(品名:U−CAT−5002、サンアプロ社製)を1質量部、アクリル樹脂(品名:オクゾールEA−0200、大阪有機化学社製)を49質量部、有機過酸化物(品名:パーヘキサV、日油社製)を1質量部、フィラー(品名:アエロジルR202、日本アエロジル社製)を15質量部配合し、アクリル/エポキシが50/50の樹脂組成物を調製した。これを、剥離処理されたPET(Polyethylene terephthalate)にバーコーターを用いて塗布し、80℃のオーブンで3分間乾燥させ、厚み50μmのアンダーフィルフィルムを作製した(カバー剥離PET(25μm)/アンダーフィルフィルム(50μm)/ベース剥離PET(50μm))。
膜形成樹脂としてのアクリルゴムポリマー(品名:テイサンレジンSG−P3、ナガセケムテックス社製)を40質量部、エポキシ樹脂(品名:JER1031S、三菱化学社製)を45質量部、酸無水物(品名:リカシッドHNA−100、新日本理化社製)を15質量部、硬化促進剤としてのイミダゾール(品名:U−CAT−5002、サンアプロ社製)を1質量部、アクリル樹脂(品名:オクゾールEA−0200、大阪有機化学社製)を39質量部、有機過酸化物(品名:パーヘキサV、日油社製)を1質量部、フィラー(品名:アエロジルR202、日本アエロジル社製)を15質量部配合し、アクリル/エポキシが50/50の樹脂組成物を調製した。これを、剥離処理されたPET(Polyethylene terephthalate)にバーコーターを用いて塗布し、80℃のオーブンで3分間乾燥させ、厚み50μmのアンダーフィルフィルムを作製した(カバー剥離PET(25μm)/アンダーフィルフィルム(50μm)/ベース剥離PET(50μm))。
膜形成樹脂としてのアクリルゴムポリマー(品名:テイサンレジンSG−P3、ナガセケムテックス社製)を40質量部、エポキシ樹脂(品名:JER1031S、三菱化学社製)を13質量部、酸無水物(品名:リカシッドHNA−100、新日本理化社製)を7質量部、硬化促進剤としてのイミダゾール(品名:U−CAT−5002、サンアプロ社製)を1質量部、アクリル樹脂(品名:オクゾールEA−0200、大阪有機化学社製)を76質量部、有機過酸化物(品名:パーヘキサV、日油社製)を4質量部、フィラー(品名:アエロジルR202、日本アエロジル社製)を15質量部配合し、アクリル/エポキシが80/20の樹脂組成物を調製した。これを、剥離処理されたPET(Polyethylene terephthalate)にバーコーターを用いて塗布し、80℃のオーブンで3分間乾燥させ、厚み50μmのアンダーフィルフィルムを作製した(カバー剥離PET(25μm)/アンダーフィルフィルム(50μm)/ベース剥離PET(50μm))。
膜形成樹脂としてのアクリルゴムポリマー(品名:テイサンレジンSG−P3、ナガセケムテックス社製)を40質量部、エポキシ樹脂(品名:JER1031S、三菱化学社製)を40質量部、酸無水物(品名:リカシッドHNA−100、新日本理化社製)を30質量部、硬化促進剤としてのイミダゾール(品名:U−CAT−5002、サンアプロ社製)を1質量部、アクリル樹脂(品名:オクゾールEA−0200、大阪有機化学社製)を29質量部、有機過酸化物(品名:パーヘキサV、日油社製)を1質量部、フィラー(品名:アエロジルR202、日本アエロジル社製)を15質量部配合し、アクリル/エポキシが30/70の樹脂組成物を調製した。これを、剥離処理されたPET(Polyethylene terephthalate)にバーコーターを用いて塗布し、80℃のオーブンで3分間乾燥させ、厚み50μmのアンダーフィルフィルムを作製した(カバー剥離PET(25μm)/アンダーフィルフィルム(50μm)/ベース剥離PET(50μm))。
上述したとおり、本実施例では、先供給型のアンダーフィルフィルムを作製し、次いで、アンダーフィルフィルムを用いてハンダ付き電極を有する複数の上チップと、これに対向する電極を有する下チップとを図11及び図12に示すようなギャングボンディング装置を用い、一括圧着させて実装体を作製し、ボイド、ハンダ接合状態、及びフィレットについて評価した。その際のアンダーフィルフィルムの弾性率、最低溶融粘度及び溶融粘度の傾きの測定、実装体の作製、搭載時のチップズレ、ボイド、ハンダ接合、及びフィレットの評価は、次のように行った。
各アンダーフィルフィルムについて、レオメータ(TA社製ARES)を用いて、5℃/min、1Hzの条件でサンプルの弾性率、最低溶融粘度及び最低溶融粘度到達温度を測定した。そして、最低溶融粘度到達温度+10℃〜最低溶融粘度到達温度+20℃の温度範囲における溶融粘度の傾きを算出した。
まず、アンダーフィルフィルムをウエハ上にプレス機にて、50℃−0.5MPaの条件で貼り合わせ、ダンシングしてハンダ付き電極を有する上チップを得た。
下チップ上に9個の上チップを一括圧着した際のチップズレを、X線装置にて目視し、チップズレが5μm以下で実質的に確認できない場合を「○」と評価し、他方、それ以上チップズレが確認できた場合を「×」と評価した。
実装体をSAT(Scanning Acoustic Tomograph, 超音波映像装置)を用いて観察した。実装体のボイド面積を確認し、ボイドが発生していないか、又は発生してもボイドの直径が100μm以下の場合を「○」と評価し、それ以上のボイドが確認できた場合を「×」と評価した。一般的に、100μmを超えたボイドが生じると、経験上、長期信頼性に悪影響を及ぼす可能性が高くなる。
実装体のサンプルを切断し、断面研磨を行い、上チップと下チップとのバンプ間のハンダの状態をSEM(Scanning Electron Microscope)観察した。下チップ側のバンプの90%以上にハンダ濡れ広がりがある場合の良好な状態を「○」と評価し、それ以外のハンダ濡れが不十分な状態を「×」と評価した。
実装体のチップ間及びチップ端部を目視にて観察し、フィレットが形成されている場合を「×」と評価し、フィレットが形成されていない場合を「○」と評価した。
参考例1に記載の樹脂組成物と同様の組成物を調整した。この組成物を、剥離処理されたPET(Polyethylene terephthalate)にバーコーターを用いて塗布し、80℃のオーブンで3分間乾燥させ、厚み18μmのアンダーフィルフィルムを作製した(カバー剥離PET(25μm)/アンダーフィルフィルム(18μm)/ベース剥離PET(50μm))。
参考例2に記載された樹脂組成物と同様な樹脂組成物を作成した。この組成物を、剥離処理されたPET(Polyethylene terephthalate)にバーコーターを用いて塗布し、80℃のオーブンで3分間乾燥させ、厚み18μmのアンダーフィルフィルムを作製した(カバー剥離PET(25μm)/アンダーフィルフィルム(18μm)/ベース剥離PET(50μm))。
参考例3に記載の樹脂組成物と同様な樹脂組成物を調整した。この組成物を、剥離処理されたPET(Polyethylene terephthalate)にバーコーターを用いて塗布し、80℃のオーブンで3分間乾燥させ、厚み18μmのアンダーフィルフィルムを作製した(カバー剥離PET(25μm)/アンダーフィルフィルム(18μm)/ベース剥離PET(50μm))。
参考例4の樹脂組成物と同様の組成物を調整した。この組成物を、剥離処理されたPET(Polyethylene terephthalate)にバーコーターを用いて塗布し、80℃のオーブンで3分間乾燥させ、厚み18μmのアンダーフィルフィルムを作製した(カバー剥離PET(25μm)/アンダーフィルフィルム(18μm)/ベース剥離PET(50μm))。
比較例5に記載の樹脂組成物の同様な樹脂組成物を調整した。この樹脂組成物を、剥離処理されたPET(Polyethylene terephthalate)にバーコーターを用いて塗布し、80℃のオーブンで3分間乾燥させ、厚み18μmのアンダーフィルフィルムを作製した(カバー剥離PET(25μm)/アンダーフィルフィルム(18μm)/ベース剥離PET(50μm))。
Claims (10)
- ハンダ付き電極が形成された複数の半導体チップを、アンダーフィルフィルムを介して前記ハンダ付き電極と対向する対向電極が形成された電子部品に搭載する搭載工程と、
前記複数の半導体チップと前記電子部品とを、前記アンダーフィルフィルムを介して一括圧着する圧着工程とを有し、
前記アンダーフィルフィルムが、エポキシ樹脂と、酸無水物と、アクリル樹脂と、有機過酸化物とを含有し、最低溶融粘度が、1000Pa・s以上2000Pa・s以下であり、最低溶融粘度到達温度より10℃高い温度から該温度より10℃高い温度までの溶融粘度の傾きが、900Pa・s/℃以上3100Pa・s/℃以下である半導体装置の製造方法。 - 前前記溶融粘度の傾きが、1700Pa・s/℃以上3100Pa・s/℃以下である請求項1記載の半導体装置の製造方法。
- 前記アクリル樹脂と前記有機過酸化物との合計質量と、前記エポキシ樹脂と前記酸無水物との合計質量との比が、7:3〜5:5である請求項2記載の半導体装置の製造方法。
- 前記エポキシ樹脂が、グリシジルエーテル型エポキシ樹脂であり、
前記酸無水物が、脂環式酸無水物である請求項1乃至3のいずれか1項に記載の半導体装置の製造方法。 - 前記アクリル樹脂が、フルオレン系アクリレートであり、
前記有機過酸化物が、パーオキシケタールである請求項1乃至4のいずれか1項に記載の半導体装置の製造方法。 - 複数の半導体チップと電子部品とを、一括圧着するためのアンダーフィルフィルムであって、
エポキシ樹脂と、酸無水物と、アクリル樹脂と、有機過酸化物とを含有し、最低溶融粘度が、1000Pa・s以上2000Pa・s以下であり、最低溶融粘度到達温度より10℃高い温度から該温度より10℃高い温度までの溶融粘度の傾きが、900Pa・s/℃以上3100Pa・s/℃以下であるアンダーフィルフィルム。 - 前前記溶融粘度の傾きが、1700Pa・s/℃以上3100Pa・s/℃以下である請求項6記載のアンダーフィルフィルム。
- 前記アクリル樹脂と前記有機過酸化物との合計質量と、前記エポキシ樹脂と前記酸無水物との合計質量との比が、7:3〜5:5である請求項7記載のアンダーフィルフィルム。
- 前記エポキシ樹脂が、グリシジルエーテル型エポキシ樹脂であり、
前記酸無水物が、脂環式酸無水物である請求項6乃至8のいずれか1項に記載のアンダーフィルフィルム。 - 前記アクリル樹脂が、フルオレン系アクリレートであり、
前記有機過酸化物が、パーオキシケタールである請求項6乃至9のいずれか1項に記載のアンダーフィルフィルム。
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