JP2016139676A - 半導体装置と、その製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 131
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 claims abstract description 96
- 239000011810 insulating material Substances 0.000 claims abstract description 82
- 238000000151 deposition Methods 0.000 claims description 20
- 230000008021 deposition Effects 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 description 17
- 239000012535 impurity Substances 0.000 description 16
- 238000005530 etching Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000008646 thermal stress Effects 0.000 description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 6
- 229910010271 silicon carbide Inorganic materials 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000005137 deposition process Methods 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
- H01L29/0623—Buried supplementary region, e.g. buried guard ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7811—Vertical DMOS transistors, i.e. VDMOS transistors with an edge termination structure
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
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- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
【解決手段】半導体装置1は、半導体基板2と、半導体基板2の表面21から裏面22側に延びているゲートトレンチ30と終端トレンチ40を備えている。ゲートトレンチ30の内部にゲート電極32が収容されている。終端トレンチ40の内部に絶縁材41が収容されている。終端トレンチ40の底面44と側面45がなす角度θ45がゲートトレンチ30の底面34と側面35がなす角度θ35より大きい。終端トレンチ40内の絶縁材41の内部に空隙42が形成されている。
【選択図】図2
Description
上記の製造方法では、トレンチ形成工程で、第1トレンチの底面と側面がなす角度が、第2トレンチの底面と側面がなす角度より大きくなるように、第1トレンチと第2トレンチを形成する。その結果、第1トレンチでは底面と開口部の幅の差が大きくなり、それに比べて、第2トレンチでは底面と開口部の幅の差が小さくなる。また、第1トレンチの内部と第2トレンチの内部に絶縁材を堆積させる堆積工程では、絶縁材の堆積速度の違いにより両トレンチの底面付近より開口部付近で絶縁材が速く堆積する。このとき、第1トレンチでは底面と開口部の幅の差が大きいので、絶縁材の堆積速度に違いがあっても、開口部付近が絶縁材によって満たされる前に、底面から開口部に向かって順に絶縁材が堆積してゆく。よって、開口部付近が最後に絶縁材で満たされる。すなわち、開口部より深い部分が絶縁材によって満たされる前に、開口部付近が絶縁材で塞がれることがない。それに比べて、第2トレンチでは底面と開口部の幅の差が小さいので、絶縁材の堆積速度に違いにより底面から開口部に向かって順に絶縁材が満たされてゆくより前に開口部付近が絶縁材によって満たされる。その結果、開口部より深い部分が絶縁材によって満たされる前に開口部付近が絶縁材で塞がれ、第2トレンチ内に堆積した絶縁材の内部に空隙が形成される。
第2トレンチ内の絶縁材の内部に空隙が形成されることによって、その後に実施する熱処理工程中の温度変化によって第2トレンチ内に収容されている絶縁材が半導体基板に対して相対的に膨張/収縮したとしても、空隙によって、絶縁材の相対的な膨張/収縮に起因して発生する熱応力を緩和することができる。
2 :半導体基板
3 :素子領域
4 :周辺領域
5 :表面電極
6 :裏面電極
7 :絶縁膜
11 :ソース領域
12 :ベース領域
13 :ドレイン領域
14 :コンタクト領域
15 :ドリフト領域
17 :フローティング領域
21 :表面
22 :裏面
30 :ゲートトレンチ
31 :ゲート絶縁膜
32 :ゲート電極
33 :層間絶縁膜
34 :底面
35 :側面
36 :開口部
40 :終端トレンチ
41 :絶縁材
42 :空隙
44 :底面
45 :側面
46 :開口部
51 :マスク
52 :マスク
53 :マスク
62 :半導体層
65 :SiC基板
Claims (3)
- 半導体基板と、
前記半導体基板の表面から裏面側に延びている第1トレンチと第2トレンチを備えており、
前記第1トレンチの内部にゲート電極が収容されており、
前記第2トレンチの内部に絶縁材が収容されており、
前記第1トレンチの底面と側面がなす角度が前記第2トレンチの底面と側面がなす角度より大きく、
前記第2トレンチ内の前記絶縁膜の内部に空隙が形成されている、半導体装置。 - 前記第2トレンチの開口部の幅が前記第1トレンチの開口部の幅より小さい請求項1に記載の半導体装置。
- 前記半導体基板の表面から裏面側に延びる第1トレンチと第2トレンチを形成するトレンチ形成工程と、
前記第1トレンチの内部と前記第2トレンチの内部に絶縁材を堆積させる堆積工程と、
前記堆積工程を実施した後の前記半導体基板を熱処理する熱処理工程を備えており、
前記トレンチ形成工程で、前記第1トレンチの底面と側面がなす角度が前記第2トレンチの底面と側面がなす角度より大きくなるように前記第1トレンチと前記第2トレンチを形成する、半導体装置の製造方法。
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JP2015012942A JP2016139676A (ja) | 2015-01-27 | 2015-01-27 | 半導体装置と、その製造方法 |
US15/005,310 US20160218190A1 (en) | 2015-01-27 | 2016-01-25 | Semiconductor device and method for manufacturing semiconductor device |
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JP6367760B2 (ja) * | 2015-06-11 | 2018-08-01 | トヨタ自動車株式会社 | 絶縁ゲート型スイッチング装置とその製造方法 |
KR102571561B1 (ko) * | 2015-10-19 | 2023-08-29 | 삼성전자주식회사 | 3차원 반도체 소자 |
JP6817895B2 (ja) * | 2017-05-24 | 2021-01-20 | 株式会社東芝 | 半導体装置 |
JP7249269B2 (ja) * | 2019-12-27 | 2023-03-30 | 株式会社東芝 | 半導体装置およびその製造方法 |
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JP2008159863A (ja) * | 2006-12-25 | 2008-07-10 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
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