JP2016136617A - シリコンのエッチングおよびクリーニング - Google Patents

シリコンのエッチングおよびクリーニング Download PDF

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Publication number
JP2016136617A
JP2016136617A JP2015240748A JP2015240748A JP2016136617A JP 2016136617 A JP2016136617 A JP 2016136617A JP 2015240748 A JP2015240748 A JP 2015240748A JP 2015240748 A JP2015240748 A JP 2015240748A JP 2016136617 A JP2016136617 A JP 2016136617A
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JP
Japan
Prior art keywords
etching
gas
silicon
layer
processing chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015240748A
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English (en)
Japanese (ja)
Other versions
JP2016136617A5 (enExample
Inventor
トム・エー．・カンプ
A Kamp Tom
アレクサンダー・エム．・パターソン
M Paterson Alexander
ニーマ・ラストガー
Rastgar Neema
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2016136617A publication Critical patent/JP2016136617A/ja
Publication of JP2016136617A5 publication Critical patent/JP2016136617A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/26—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials
    • H10P50/264—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means
    • H10P50/266—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only
    • H10P50/267—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only using plasmas
    • H10P50/268—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only using plasmas of silicon-containing layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/273—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a delineation of conductive layers, e.g. by RIE
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

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  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Semiconductor Memories (AREA)
JP2015240748A 2014-12-19 2015-12-10 シリコンのエッチングおよびクリーニング Pending JP2016136617A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/576,978 US20160181111A1 (en) 2014-12-19 2014-12-19 Silicon etch and clean
US14/576,978 2014-12-19

Publications (2)

Publication Number Publication Date
JP2016136617A true JP2016136617A (ja) 2016-07-28
JP2016136617A5 JP2016136617A5 (enExample) 2019-01-17

Family

ID=56130284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015240748A Pending JP2016136617A (ja) 2014-12-19 2015-12-10 シリコンのエッチングおよびクリーニング

Country Status (6)

Country Link
US (1) US20160181111A1 (enExample)
JP (1) JP2016136617A (enExample)
KR (1) KR20160075330A (enExample)
CN (1) CN105719950B (enExample)
SG (1) SG10201510080RA (enExample)
TW (1) TWI709171B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016130795A1 (en) * 2015-02-12 2016-08-18 Massachusetts Institute Of Technology Methods and apparatus for variable selectivity atomic layer etching
US9620376B2 (en) 2015-08-19 2017-04-11 Lam Research Corporation Self limiting lateral atomic layer etch
US20190157051A1 (en) * 2017-11-20 2019-05-23 Lam Research Corporation Method for cleaning chamber
US10714329B2 (en) * 2018-09-28 2020-07-14 Taiwan Semiconductor Manufacturing Co., Ltd. Pre-clean for contacts
CN111933566A (zh) * 2020-09-24 2020-11-13 晶芯成(北京)科技有限公司 浅沟槽隔离结构的形成方法
CN115672874A (zh) * 2021-07-30 2023-02-03 江苏鲁汶仪器股份有限公司 一种等离子体处理方法
WO2026151429A1 (en) * 2025-01-08 2026-07-16 Applied Materials, Inc. Controlled etching using pulsed plasma

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013110418A (ja) * 2012-11-30 2013-06-06 Renesas Electronics Corp 半導体装置の製造方法
US20140120726A1 (en) * 2012-11-01 2014-05-01 Srinivas D. Nemani Method of patterning a low-k dielectric film
JP2014209622A (ja) * 2013-04-05 2014-11-06 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 半導体製造用の内部プラズマグリッドの適用
JP2014219285A (ja) * 2013-05-08 2014-11-20 株式会社デンソー 物理量センサの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6939811B2 (en) * 2002-09-25 2005-09-06 Lam Research Corporation Apparatus and method for controlling etch depth
US7780793B2 (en) * 2004-02-26 2010-08-24 Applied Materials, Inc. Passivation layer formation by plasma clean process to reduce native oxide growth
US8173547B2 (en) * 2008-10-23 2012-05-08 Lam Research Corporation Silicon etch with passivation using plasma enhanced oxidation
US8501629B2 (en) * 2009-12-23 2013-08-06 Applied Materials, Inc. Smooth SiConi etch for silicon-containing films
US20120220116A1 (en) * 2011-02-25 2012-08-30 Applied Materials, Inc. Dry Chemical Cleaning For Semiconductor Processing
CN102931130A (zh) * 2011-08-11 2013-02-13 应用材料公司 灰化后侧壁修复

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140120726A1 (en) * 2012-11-01 2014-05-01 Srinivas D. Nemani Method of patterning a low-k dielectric film
JP2013110418A (ja) * 2012-11-30 2013-06-06 Renesas Electronics Corp 半導体装置の製造方法
JP2014209622A (ja) * 2013-04-05 2014-11-06 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 半導体製造用の内部プラズマグリッドの適用
JP2014219285A (ja) * 2013-05-08 2014-11-20 株式会社デンソー 物理量センサの製造方法

Also Published As

Publication number Publication date
TWI709171B (zh) 2020-11-01
KR20160075330A (ko) 2016-06-29
CN105719950B (zh) 2019-05-17
US20160181111A1 (en) 2016-06-23
TW201640578A (zh) 2016-11-16
CN105719950A (zh) 2016-06-29
SG10201510080RA (en) 2016-07-28

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