JP2016136606A - エッチング方法 - Google Patents

エッチング方法 Download PDF

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Publication number
JP2016136606A
JP2016136606A JP2015034212A JP2015034212A JP2016136606A JP 2016136606 A JP2016136606 A JP 2016136606A JP 2015034212 A JP2015034212 A JP 2015034212A JP 2015034212 A JP2015034212 A JP 2015034212A JP 2016136606 A JP2016136606 A JP 2016136606A
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JP
Japan
Prior art keywords
gas
region
processing
plasma
deposit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015034212A
Other languages
English (en)
Japanese (ja)
Inventor
光 渡邉
Hikaru Watanabe
光 渡邉
晃弘 辻
Akihiro Tsuji
晃弘 辻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to CN201610018014.5A priority Critical patent/CN105810579B/zh
Priority to TW105101026A priority patent/TWI684218B/zh
Priority to US14/995,392 priority patent/US9633864B2/en
Priority to KR1020160004684A priority patent/KR102513051B1/ko
Priority to EP16151256.1A priority patent/EP3046137A1/en
Publication of JP2016136606A publication Critical patent/JP2016136606A/ja
Pending legal-status Critical Current

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    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05C—BOLTS OR FASTENING DEVICES FOR WINGS, SPECIALLY FOR DOORS OR WINDOWS
    • E05C9/00—Arrangements of simultaneously actuated bolts or other securing devices at well-separated positions on the same wing
    • E05C9/18—Details of fastening means or of fixed retaining means for the ends of bars
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
    • E05B15/00—Other details of locks; Parts for engagement by bolts of fastening devices
    • E05B15/02—Striking-plates; Keepers; Bolt staples; Escutcheons
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05C—BOLTS OR FASTENING DEVICES FOR WINGS, SPECIALLY FOR DOORS OR WINDOWS
    • E05C19/00—Other devices specially designed for securing wings, e.g. with suction cups
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES E05D AND E05F, RELATING TO CONSTRUCTION ELEMENTS, ELECTRIC CONTROL, POWER SUPPLY, POWER SIGNAL OR TRANSMISSION, USER INTERFACES, MOUNTING OR COUPLING, DETAILS, ACCESSORIES, AUXILIARY OPERATIONS NOT OTHERWISE PROVIDED FOR, APPLICATION THEREOF
    • E05Y2800/00—Details, accessories and auxiliary operations not otherwise provided for
    • E05Y2800/10—Additional functions
    • E05Y2800/12—Sealing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Drying Of Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Plasma Technology (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2015034212A 2015-01-16 2015-02-24 エッチング方法 Pending JP2016136606A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201610018014.5A CN105810579B (zh) 2015-01-16 2016-01-12 蚀刻方法
TW105101026A TWI684218B (zh) 2015-01-16 2016-01-14 蝕刻方法（三）
US14/995,392 US9633864B2 (en) 2015-01-16 2016-01-14 Etching method
KR1020160004684A KR102513051B1 (ko) 2015-01-16 2016-01-14 에칭 방법
EP16151256.1A EP3046137A1 (en) 2015-01-16 2016-01-14 Etching method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015006775 2015-01-16
JP2015006775 2015-01-16

Publications (1)

Publication Number Publication Date
JP2016136606A true JP2016136606A (ja) 2016-07-28

Family

ID=56513112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015034212A Pending JP2016136606A (ja) 2015-01-16 2015-02-24 エッチング方法

Country Status (3)

Country Link
JP (1) JP2016136606A (zh)
KR (1) KR102513051B1 (zh)
TW (1) TWI684218B (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108878285A (zh) * 2017-05-11 2018-11-23 东京毅力科创株式会社 蚀刻方法
KR20190052633A (ko) 2017-11-08 2019-05-16 도쿄엘렉트론가부시키가이샤 에칭 방법
CN110391140A (zh) * 2018-04-17 2019-10-29 东京毅力科创株式会社 蚀刻方法和等离子体处理装置
JP2020145404A (ja) * 2019-02-28 2020-09-10 東京エレクトロン株式会社 基板処理方法および基板処理装置
CN111681956A (zh) * 2019-03-11 2020-09-18 东京毅力科创株式会社 等离子体处理方法和等离子体处理装置
KR20210035074A (ko) 2018-08-21 2021-03-31 도쿄엘렉트론가부시키가이샤 에칭 방법 및 플라즈마 처리 장치
KR20210041072A (ko) 2018-08-24 2021-04-14 도쿄엘렉트론가부시키가이샤 에칭하는 방법 및 플라즈마 처리 장치
CN113394082A (zh) * 2016-08-29 2021-09-14 东京毅力科创株式会社 等离子体处理装置和被处理体的处理方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7138514B2 (ja) * 2018-08-22 2022-09-16 東京エレクトロン株式会社 環状部材、プラズマ処理装置及びプラズマエッチング方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3027951B2 (ja) * 1997-03-12 2000-04-04 日本電気株式会社 半導体装置の製造方法
JP2002025979A (ja) * 2000-07-03 2002-01-25 Hitachi Ltd 半導体集積回路装置の製造方法
US6716766B2 (en) * 2002-08-22 2004-04-06 Micron Technology, Inc. Process variation resistant self aligned contact etch
US7056830B2 (en) * 2003-09-03 2006-06-06 Applied Materials, Inc. Method for plasma etching a dielectric layer
JP2014209515A (ja) * 2013-04-16 2014-11-06 東京エレクトロン株式会社 エッチング方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113394082A (zh) * 2016-08-29 2021-09-14 东京毅力科创株式会社 等离子体处理装置和被处理体的处理方法
CN108878285A (zh) * 2017-05-11 2018-11-23 东京毅力科创株式会社 蚀刻方法
CN108878285B (zh) * 2017-05-11 2023-06-16 东京毅力科创株式会社 蚀刻方法
KR20190052633A (ko) 2017-11-08 2019-05-16 도쿄엘렉트론가부시키가이샤 에칭 방법
US10529583B2 (en) 2017-11-08 2020-01-07 Tokyo Electron Limited Etching method
CN110391140A (zh) * 2018-04-17 2019-10-29 东京毅力科创株式会社 蚀刻方法和等离子体处理装置
KR20210035074A (ko) 2018-08-21 2021-03-31 도쿄엘렉트론가부시키가이샤 에칭 방법 및 플라즈마 처리 장치
KR20210041072A (ko) 2018-08-24 2021-04-14 도쿄엘렉트론가부시키가이샤 에칭하는 방법 및 플라즈마 처리 장치
US11710643B2 (en) 2018-08-24 2023-07-25 Tokyo Electron Limited Method of etching and plasma processing apparatus
JP2020145404A (ja) * 2019-02-28 2020-09-10 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP7390165B2 (ja) 2019-02-28 2023-12-01 東京エレクトロン株式会社 基板処理方法および基板処理装置
CN111681956A (zh) * 2019-03-11 2020-09-18 东京毅力科创株式会社 等离子体处理方法和等离子体处理装置

Also Published As

Publication number Publication date
KR20160088816A (ko) 2016-07-26
TW201635371A (zh) 2016-10-01
TWI684218B (zh) 2020-02-01
KR102513051B1 (ko) 2023-03-22

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