JP2016135736A - 半導体基板 - Google Patents
半導体基板 Download PDFInfo
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- JP2016135736A JP2016135736A JP2016001405A JP2016001405A JP2016135736A JP 2016135736 A JP2016135736 A JP 2016135736A JP 2016001405 A JP2016001405 A JP 2016001405A JP 2016001405 A JP2016001405 A JP 2016001405A JP 2016135736 A JP2016135736 A JP 2016135736A
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- crystal layer
- layer
- crystal
- substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 161
- 239000004065 semiconductor Substances 0.000 title claims abstract description 67
- 239000013078 crystal Substances 0.000 claims abstract description 327
- 238000003917 TEM image Methods 0.000 claims abstract description 11
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 5
- 239000010703 silicon Substances 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 340
- 239000002346 layers by function Substances 0.000 claims description 79
- 238000000034 method Methods 0.000 claims description 9
- 230000003746 surface roughness Effects 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 4
- 230000035882 stress Effects 0.000 description 59
- 229910002704 AlGaN Inorganic materials 0.000 description 26
- 150000004767 nitrides Chemical class 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 4
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- -1 nitride compound Chemical class 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Landscapes
- Chemical Vapour Deposition (AREA)
- Recrystallisation Techniques (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims (4)
- ベース基板と、第1結晶層と、第2結晶層と、第3結晶層と、第4結晶層と、機能層とを有し、
前記ベース基板、前記第1結晶層、前記第2結晶層および前記機能層と、前記第3結晶層および前記第4結晶層とが、前記ベース基板、前記第1結晶層、前記第2結晶層、前記第3結晶層、前記第4結晶層、前記機能層の順に配置され、
前記第1結晶層と前記第2結晶層とが格子整合または擬格子整合して接し、
前記第2結晶層と前記第3結晶層とが互いに接し、
前記第3結晶層と前記第4結晶層とが格子整合または擬格子整合して接し、
前記機能層の熱膨張係数が、前記ベース基板の熱膨張係数より大きく、
前記第1結晶層の格子定数が、前記第2結晶層の格子定数より小さく、
前記第3結晶層の格子定数が、前記第4結晶層の格子定数より小さく、
前記第1結晶層および前記第2結晶層が互いに接する第1界面と、前記第2結晶層および前記第3結晶層が互いに接する前記第2界面と、前記第3結晶層および前記第4結晶層が互いに接する第3界面とを、同一視野に含んで断面TEM像を観察した場合、前記第1界面を含んで観察される第1モアレ画像の面積が、前記第2界面を含んで観察される第2モアレ画像の面積より小さく、前記第3界面を含んで観察される第3モアレ画像の面積が、前記第2モアレ画像の面積より小さい
半導体基板。 - 前記ベース基板がシリコンからなり、
前記第1結晶層がAlxGa1−xNからなり、
前記第2結晶層がAlyGa1−yNからなり、
xおよびyが0≦y<x≦1の関係を有する
請求項1に記載の半導体基板。 - 前記第2結晶層は、前記第1結晶層を結晶成長させた場合における表面粗さより、前記第2結晶層の表面粗さが大きくなる条件で結晶成長させたものである
請求項1または請求項2に記載の半導体基板。 - 前記第1結晶層、前記第2結晶層および前記機能層の各層が、エピタキシャル成長法により形成されたものである
請求項1から3の何れか一項に記載の半導体基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010106959 | 2010-05-07 | ||
JP2010106959 | 2010-05-07 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011100192A Division JP2011254068A (ja) | 2010-05-07 | 2011-04-27 | 半導体基板 |
Related Child Applications (1)
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---|---|---|---|
JP2017086721A Division JP2017147464A (ja) | 2010-05-07 | 2017-04-26 | 半導体基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016135736A true JP2016135736A (ja) | 2016-07-28 |
JP6138974B2 JP6138974B2 (ja) | 2017-05-31 |
Family
ID=45417728
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011100192A Withdrawn JP2011254068A (ja) | 2010-05-07 | 2011-04-27 | 半導体基板 |
JP2016001405A Active JP6138974B2 (ja) | 2010-05-07 | 2016-01-06 | 半導体基板 |
JP2017086721A Pending JP2017147464A (ja) | 2010-05-07 | 2017-04-26 | 半導体基板 |
Family Applications Before (1)
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JP2011100192A Withdrawn JP2011254068A (ja) | 2010-05-07 | 2011-04-27 | 半導体基板 |
Family Applications After (1)
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JP2017086721A Pending JP2017147464A (ja) | 2010-05-07 | 2017-04-26 | 半導体基板 |
Country Status (1)
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JP (3) | JP2011254068A (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5228122B1 (ja) | 2012-03-08 | 2013-07-03 | 株式会社東芝 | 窒化物半導体素子及び窒化物半導体ウェーハ |
KR101464854B1 (ko) | 2013-01-14 | 2014-11-25 | 주식회사 엘지실트론 | 반도체 기판 |
RU2696352C2 (ru) * | 2014-12-23 | 2019-08-01 | Интигрейтед Соулар | Способ эпитаксиального выращивания границы раздела между материалами из iii-v групп и кремниевой пластиной, обеспечивающий нейтрализацию остаточных деформаций |
WO2018216240A1 (ja) | 2017-05-26 | 2018-11-29 | 創光科学株式会社 | テンプレート、窒化物半導体紫外線発光素子及びテンプレートの製造方法 |
WO2021084755A1 (ja) * | 2019-11-01 | 2021-05-06 | 三菱電機株式会社 | 化合物半導体の結晶欠陥観察方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000277441A (ja) * | 1999-03-26 | 2000-10-06 | Nagoya Kogyo Univ | 半導体構造とそれを備えた半導体素子及び結晶成長方法 |
JP2009260296A (ja) * | 2008-03-18 | 2009-11-05 | Hitachi Cable Ltd | 窒化物半導体エピタキシャルウエハ及び窒化物半導体素子 |
Family Cites Families (13)
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JP3184717B2 (ja) * | 1993-10-08 | 2001-07-09 | 三菱電線工業株式会社 | GaN単結晶およびその製造方法 |
JPH1131811A (ja) * | 1997-07-09 | 1999-02-02 | Nippon Telegr & Teleph Corp <Ntt> | 歪多重量子井戸構造の成長方法 |
US6232138B1 (en) * | 1997-12-01 | 2001-05-15 | Massachusetts Institute Of Technology | Relaxed InxGa(1-x)as buffers |
JP3613197B2 (ja) * | 2001-04-17 | 2005-01-26 | 日亜化学工業株式会社 | 窒化物半導体基板の成長方法 |
JP4058594B2 (ja) * | 2001-08-20 | 2008-03-12 | サンケン電気株式会社 | 半導体発光素子 |
JP2004363500A (ja) * | 2003-06-06 | 2004-12-24 | Satoru Tanaka | 窒化物系化合物半導体の製造方法および窒化物系化合物半導体 |
JP4457609B2 (ja) * | 2003-08-26 | 2010-04-28 | 豊田合成株式会社 | 窒化ガリウム(GaN)の製造方法 |
JP4468744B2 (ja) * | 2004-06-15 | 2010-05-26 | 日本電信電話株式会社 | 窒化物半導体薄膜の作製方法 |
US7339205B2 (en) * | 2004-06-28 | 2008-03-04 | Nitronex Corporation | Gallium nitride materials and methods associated with the same |
JP5064808B2 (ja) * | 2007-01-05 | 2012-10-31 | 古河電気工業株式会社 | 半導体電子デバイス |
US20080296625A1 (en) * | 2007-06-04 | 2008-12-04 | Sharp Laboratories Of America Inc. | Gallium nitride-on-silicon multilayered interface |
JP5053220B2 (ja) * | 2008-09-30 | 2012-10-17 | 古河電気工業株式会社 | 半導体電子デバイスおよび半導体電子デバイスの製造方法 |
JP5546133B2 (ja) * | 2009-01-16 | 2014-07-09 | 古河電気工業株式会社 | 半導体電子デバイス |
-
2011
- 2011-04-27 JP JP2011100192A patent/JP2011254068A/ja not_active Withdrawn
-
2016
- 2016-01-06 JP JP2016001405A patent/JP6138974B2/ja active Active
-
2017
- 2017-04-26 JP JP2017086721A patent/JP2017147464A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000277441A (ja) * | 1999-03-26 | 2000-10-06 | Nagoya Kogyo Univ | 半導体構造とそれを備えた半導体素子及び結晶成長方法 |
JP2009260296A (ja) * | 2008-03-18 | 2009-11-05 | Hitachi Cable Ltd | 窒化物半導体エピタキシャルウエハ及び窒化物半導体素子 |
Also Published As
Publication number | Publication date |
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JP6138974B2 (ja) | 2017-05-31 |
JP2011254068A (ja) | 2011-12-15 |
JP2017147464A (ja) | 2017-08-24 |
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