JP2016132035A5 - - Google Patents

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Publication number
JP2016132035A5
JP2016132035A5 JP2016005742A JP2016005742A JP2016132035A5 JP 2016132035 A5 JP2016132035 A5 JP 2016132035A5 JP 2016005742 A JP2016005742 A JP 2016005742A JP 2016005742 A JP2016005742 A JP 2016005742A JP 2016132035 A5 JP2016132035 A5 JP 2016132035A5
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Japan
Prior art keywords
laser beam
workpiece
view
field
engaging
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JP2016005742A
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Japanese (ja)
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JP6159428B2 (ja
JP2016132035A (ja
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Priority claimed from US14/599,612 external-priority patent/US10357848B2/en
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JP2016005742A 2015-01-19 2016-01-15 レーザ加工システム及び方法 Active JP6159428B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/599,612 US10357848B2 (en) 2015-01-19 2015-01-19 Laser machining systems and methods
US14/599,612 2015-01-19

Publications (3)

Publication Number Publication Date
JP2016132035A JP2016132035A (ja) 2016-07-25
JP2016132035A5 true JP2016132035A5 (enExample) 2017-06-15
JP6159428B2 JP6159428B2 (ja) 2017-07-05

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JP2016005742A Active JP6159428B2 (ja) 2015-01-19 2016-01-15 レーザ加工システム及び方法

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US (2) US10357848B2 (enExample)
EP (1) EP3050664B1 (enExample)
JP (1) JP6159428B2 (enExample)
CN (1) CN105798455B (enExample)
BR (1) BR102016001021A2 (enExample)
CA (1) CA2917563C (enExample)

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JP2019512397A (ja) * 2016-03-17 2019-05-16 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザ加工システムにおける像平面の配置
CN109530928B (zh) * 2018-12-27 2021-03-05 北京中科镭特电子有限公司 一种激光加工芯片的方法及装置
JP7299597B2 (ja) * 2018-12-27 2023-06-28 国立大学法人 東京大学 レーザ加工におけるレーザ光強度への依存性の判定方法及びレーザ加工装置
CN109530929B (zh) * 2018-12-27 2021-03-19 北京中科镭特电子有限公司 一种激光加工芯片的方法
CN110181172B (zh) * 2019-06-06 2024-08-20 武汉华工激光工程有限责任公司 一种激光加工陶瓷异形槽的装置及方法
DE102019125124A1 (de) * 2019-09-18 2021-03-18 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren
DE102019134004A1 (de) 2019-12-11 2021-06-17 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren
KR102324548B1 (ko) * 2019-12-31 2021-11-10 (주)미래컴퍼니 레이저 가공 시스템 및 레이저 가공 방법
CN111098043B (zh) * 2020-01-19 2024-12-27 中国科学院宁波材料技术与工程研究所 水导激光加工装置和加工系统
JP7599776B2 (ja) 2020-10-02 2024-12-16 株式会社ディスコ 被加工物の加工方法
KR102921493B1 (ko) * 2021-01-27 2026-02-02 삼성디스플레이 주식회사 표시 장치의 제조장치
CN115301636A (zh) * 2022-08-12 2022-11-08 阳程科技股份有限公司 激光除胶方法及采用该方法的除胶设备
CN122184631A (zh) * 2026-05-14 2026-06-12 西湖仪器(杭州)技术有限公司 一种碳化硅镜片近似无锥度异形激光切割的加工方法和激光切割系统

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