CA2917563C - Laser machining systems and methods - Google Patents
Laser machining systems and methods Download PDFInfo
- Publication number
- CA2917563C CA2917563C CA2917563A CA2917563A CA2917563C CA 2917563 C CA2917563 C CA 2917563C CA 2917563 A CA2917563 A CA 2917563A CA 2917563 A CA2917563 A CA 2917563A CA 2917563 C CA2917563 C CA 2917563C
- Authority
- CA
- Canada
- Prior art keywords
- laser beam
- workpiece
- laser
- theta lens
- directed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003754 machining Methods 0.000 title claims abstract description 73
- 238000000034 method Methods 0.000 title claims abstract description 35
- 230000003287 optical effect Effects 0.000 claims abstract description 29
- 239000013307 optical fiber Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000011153 ceramic matrix composite Substances 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 description 18
- 230000008901 benefit Effects 0.000 description 6
- 238000013459 approach Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 238000005459 micromachining Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 201000005947 Carney Complex Diseases 0.000 description 2
- 102100031417 Elongation factor-like GTPase 1 Human genes 0.000 description 2
- 101000866914 Homo sapiens Elongation factor-like GTPase 1 Proteins 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 101100279078 Arabidopsis thaliana EFL2 gene Proteins 0.000 description 1
- 102100033940 Ephrin-A3 Human genes 0.000 description 1
- 101100171804 Homo sapiens EFNA3 gene Proteins 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- -1 e.g. Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
- B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/599,612 US10357848B2 (en) | 2015-01-19 | 2015-01-19 | Laser machining systems and methods |
| US14/599,612 | 2015-01-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2917563A1 CA2917563A1 (en) | 2016-07-19 |
| CA2917563C true CA2917563C (en) | 2018-10-02 |
Family
ID=55236190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2917563A Active CA2917563C (en) | 2015-01-19 | 2016-01-14 | Laser machining systems and methods |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10357848B2 (enExample) |
| EP (1) | EP3050664B1 (enExample) |
| JP (1) | JP6159428B2 (enExample) |
| CN (1) | CN105798455B (enExample) |
| BR (1) | BR102016001021A2 (enExample) |
| CA (1) | CA2917563C (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017161284A1 (en) * | 2016-03-17 | 2017-09-21 | Electro Scientific Industries, Inc. | Location of image plane in a laser processing system |
| CN109530928B (zh) * | 2018-12-27 | 2021-03-05 | 北京中科镭特电子有限公司 | 一种激光加工芯片的方法及装置 |
| CN109530929B (zh) * | 2018-12-27 | 2021-03-19 | 北京中科镭特电子有限公司 | 一种激光加工芯片的方法 |
| JP7299597B2 (ja) * | 2018-12-27 | 2023-06-28 | 国立大学法人 東京大学 | レーザ加工におけるレーザ光強度への依存性の判定方法及びレーザ加工装置 |
| CN110181172B (zh) * | 2019-06-06 | 2024-08-20 | 武汉华工激光工程有限责任公司 | 一种激光加工陶瓷异形槽的装置及方法 |
| DE102019125124A1 (de) * | 2019-09-18 | 2021-03-18 | Rogers Germany Gmbh | Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren |
| DE102019134004A1 (de) * | 2019-12-11 | 2021-06-17 | Rogers Germany Gmbh | Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren |
| KR102324548B1 (ko) * | 2019-12-31 | 2021-11-10 | (주)미래컴퍼니 | 레이저 가공 시스템 및 레이저 가공 방법 |
| CN111098043B (zh) * | 2020-01-19 | 2024-12-27 | 中国科学院宁波材料技术与工程研究所 | 水导激光加工装置和加工系统 |
| JP7599776B2 (ja) | 2020-10-02 | 2024-12-16 | 株式会社ディスコ | 被加工物の加工方法 |
| CN115301636A (zh) * | 2022-08-12 | 2022-11-08 | 阳程科技股份有限公司 | 激光除胶方法及采用该方法的除胶设备 |
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| US3792928A (en) * | 1972-02-28 | 1974-02-19 | Schlumberger Compteurs | Fiber optics distance converting technique |
| JPS57175089A (en) * | 1981-04-20 | 1982-10-27 | Inoue Japax Res Inc | Beam working device |
| US4638800A (en) * | 1985-02-08 | 1987-01-27 | Research Physics, Inc | Laser beam surgical system |
| JP2790851B2 (ja) | 1989-05-09 | 1998-08-27 | 株式会社リコー | 光走査装置 |
| US5151389A (en) * | 1990-09-10 | 1992-09-29 | Rockwell International Corporation | Method for dicing semiconductor substrates using an excimer laser beam |
| GB9202434D0 (en) * | 1992-02-05 | 1992-03-18 | Xaar Ltd | Method of and apparatus for forming nozzles |
| US5367399A (en) * | 1992-02-13 | 1994-11-22 | Holotek Ltd. | Rotationally symmetric dual reflection optical beam scanner and system using same |
| JP3207619B2 (ja) | 1993-06-29 | 2001-09-10 | ホーヤ株式会社 | レーザ配線方法及びその装置 |
| US5685636A (en) * | 1995-08-23 | 1997-11-11 | Science And Engineering Associates, Inc. | Eye safe laser security device |
| US5744780A (en) | 1995-09-05 | 1998-04-28 | The United States Of America As Represented By The United States Department Of Energy | Apparatus for precision micromachining with lasers |
| US5638176A (en) * | 1996-06-25 | 1997-06-10 | International Business Machines Corporation | Inexpensive interferometric eye tracking system |
| US6294778B1 (en) * | 1999-04-22 | 2001-09-25 | Ecrm, Inc. | Method and apparatus for recording a flat field image |
| US6285002B1 (en) * | 1999-05-10 | 2001-09-04 | Bryan Kok Ann Ngoi | Three dimensional micro machining with a modulated ultra-short laser pulse |
| JP3201394B2 (ja) * | 1999-08-10 | 2001-08-20 | 住友電気工業株式会社 | fθレンズ |
| US6501045B1 (en) * | 2000-04-06 | 2002-12-31 | Resonetics, Inc. | Method and apparatus for controlling the taper angle of the walls of laser machined features |
| US6455807B1 (en) * | 2000-06-26 | 2002-09-24 | W.A. Whitney Co. | Method and apparatus for controlling a laser-equipped machine tool to prevent self-burning |
| DE60124938T2 (de) | 2000-10-26 | 2007-09-20 | Xsil Technology Ltd. | Steueurung von laserbearbeitung |
| GB0029038D0 (en) * | 2000-11-29 | 2001-01-10 | Owen Geoffrey D | Refractive optical deflector |
| KR100894088B1 (ko) * | 2001-03-22 | 2009-04-20 | 엑스에스아이엘 테크놀러지 리미티드 | 레이저 기계 가공 시스템 및 방법 |
| US7357486B2 (en) * | 2001-12-20 | 2008-04-15 | Hewlett-Packard Development Company, L.P. | Method of laser machining a fluid slot |
| US6951995B2 (en) * | 2002-03-27 | 2005-10-04 | Gsi Lumonics Corp. | Method and system for high-speed, precise micromachining an array of devices |
| US20040188401A1 (en) | 2003-03-28 | 2004-09-30 | Sadao Mori | Laser processing apparatus |
| US7521651B2 (en) * | 2003-09-12 | 2009-04-21 | Orbotech Ltd | Multiple beam micro-machining system and method |
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| JP2007307599A (ja) * | 2006-05-20 | 2007-11-29 | Sumitomo Electric Ind Ltd | スルーホール成形体およびレーザー加工方法 |
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| US20090323739A1 (en) * | 2006-12-22 | 2009-12-31 | Uv Tech Systems | Laser optical system |
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| JP2009072789A (ja) | 2007-09-18 | 2009-04-09 | Hamamatsu Photonics Kk | レーザ加工装置 |
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| CN102006964B (zh) * | 2008-03-21 | 2016-05-25 | Imra美国公司 | 基于激光的材料加工方法和系统 |
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| CN101856772A (zh) | 2010-05-27 | 2010-10-13 | 张立国 | 一种光束旋转振镜扫描聚焦加工系统 |
| JP2012071314A (ja) | 2010-09-27 | 2012-04-12 | Mitsubishi Heavy Ind Ltd | 複合材の加工方法及び複合材の加工装置 |
| CN103338891B (zh) * | 2010-10-22 | 2016-03-02 | 伊雷克托科学工业股份有限公司 | 用于光束抖动和刮削的镭射加工系统和方法 |
| US20120132629A1 (en) | 2010-11-30 | 2012-05-31 | Electro Scientific Industries, Inc. | Method and apparatus for reducing taper of laser scribes |
| US8462439B2 (en) * | 2011-08-22 | 2013-06-11 | Bae Systems Information And Electronic Systems Integration Inc. | Athermal apochromatic telecentric F-theta lens with low F-number |
| JP5953198B2 (ja) | 2011-09-28 | 2016-07-20 | 株式会社リプス・ワークス | 極短パルスレーザによる多次元パターン形成装置及び形成方法 |
| US9931712B2 (en) | 2012-01-11 | 2018-04-03 | Pim Snow Leopard Inc. | Laser drilling and trepanning device |
| US9841311B2 (en) * | 2012-10-16 | 2017-12-12 | Hand Held Products, Inc. | Dimensioning system |
| CN105163897A (zh) * | 2013-03-15 | 2015-12-16 | 伊雷克托科学工业股份有限公司 | 锥度控制的射束角协调及工件运动 |
| JP6064228B2 (ja) | 2013-05-24 | 2017-01-25 | パナソニックIpマネジメント株式会社 | レーザ切断装置およびレーザ切断方法 |
-
2015
- 2015-01-19 US US14/599,612 patent/US10357848B2/en active Active
-
2016
- 2016-01-14 CA CA2917563A patent/CA2917563C/en active Active
- 2016-01-15 JP JP2016005742A patent/JP6159428B2/ja active Active
- 2016-01-18 BR BR102016001021A patent/BR102016001021A2/pt not_active Application Discontinuation
- 2016-01-18 EP EP16151730.5A patent/EP3050664B1/en active Active
- 2016-01-19 CN CN201610033089.0A patent/CN105798455B/zh active Active
-
2019
- 2019-05-30 US US16/426,414 patent/US11420288B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3050664B1 (en) | 2019-07-17 |
| CA2917563A1 (en) | 2016-07-19 |
| CN105798455A (zh) | 2016-07-27 |
| EP3050664A1 (en) | 2016-08-03 |
| JP2016132035A (ja) | 2016-07-25 |
| BR102016001021A2 (pt) | 2016-08-02 |
| JP6159428B2 (ja) | 2017-07-05 |
| CN105798455B (zh) | 2018-01-19 |
| US10357848B2 (en) | 2019-07-23 |
| US20190275609A1 (en) | 2019-09-12 |
| US11420288B2 (en) | 2022-08-23 |
| US20160207143A1 (en) | 2016-07-21 |
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