BR102016001021A2 - método e sistema para usinar a laser uma peça de trabalho - Google Patents

método e sistema para usinar a laser uma peça de trabalho Download PDF

Info

Publication number
BR102016001021A2
BR102016001021A2 BR102016001021A BR102016001021A BR102016001021A2 BR 102016001021 A2 BR102016001021 A2 BR 102016001021A2 BR 102016001021 A BR102016001021 A BR 102016001021A BR 102016001021 A BR102016001021 A BR 102016001021A BR 102016001021 A2 BR102016001021 A2 BR 102016001021A2
Authority
BR
Brazil
Prior art keywords
laser beam
workpiece
laser
directed
usable field
Prior art date
Application number
BR102016001021A
Other languages
English (en)
Portuguese (pt)
Inventor
Hongqiang Chen
Steven Robert Hayashi
Xi Zhang
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of BR102016001021A2 publication Critical patent/BR102016001021A2/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
BR102016001021A 2015-01-19 2016-01-18 método e sistema para usinar a laser uma peça de trabalho BR102016001021A2 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/599,612 US10357848B2 (en) 2015-01-19 2015-01-19 Laser machining systems and methods

Publications (1)

Publication Number Publication Date
BR102016001021A2 true BR102016001021A2 (pt) 2016-08-02

Family

ID=55236190

Family Applications (1)

Application Number Title Priority Date Filing Date
BR102016001021A BR102016001021A2 (pt) 2015-01-19 2016-01-18 método e sistema para usinar a laser uma peça de trabalho

Country Status (6)

Country Link
US (2) US10357848B2 (enExample)
EP (1) EP3050664B1 (enExample)
JP (1) JP6159428B2 (enExample)
CN (1) CN105798455B (enExample)
BR (1) BR102016001021A2 (enExample)
CA (1) CA2917563C (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017161284A1 (en) * 2016-03-17 2017-09-21 Electro Scientific Industries, Inc. Location of image plane in a laser processing system
CN109530928B (zh) * 2018-12-27 2021-03-05 北京中科镭特电子有限公司 一种激光加工芯片的方法及装置
CN109530929B (zh) * 2018-12-27 2021-03-19 北京中科镭特电子有限公司 一种激光加工芯片的方法
JP7299597B2 (ja) * 2018-12-27 2023-06-28 国立大学法人 東京大学 レーザ加工におけるレーザ光強度への依存性の判定方法及びレーザ加工装置
CN110181172B (zh) * 2019-06-06 2024-08-20 武汉华工激光工程有限责任公司 一种激光加工陶瓷异形槽的装置及方法
DE102019125124A1 (de) * 2019-09-18 2021-03-18 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren
DE102019134004A1 (de) * 2019-12-11 2021-06-17 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren
KR102324548B1 (ko) * 2019-12-31 2021-11-10 (주)미래컴퍼니 레이저 가공 시스템 및 레이저 가공 방법
CN111098043B (zh) * 2020-01-19 2024-12-27 中国科学院宁波材料技术与工程研究所 水导激光加工装置和加工系统
JP7599776B2 (ja) 2020-10-02 2024-12-16 株式会社ディスコ 被加工物の加工方法
CN115301636A (zh) * 2022-08-12 2022-11-08 阳程科技股份有限公司 激光除胶方法及采用该方法的除胶设备

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3792928A (en) * 1972-02-28 1974-02-19 Schlumberger Compteurs Fiber optics distance converting technique
JPS57175089A (en) * 1981-04-20 1982-10-27 Inoue Japax Res Inc Beam working device
US4638800A (en) * 1985-02-08 1987-01-27 Research Physics, Inc Laser beam surgical system
JP2790851B2 (ja) 1989-05-09 1998-08-27 株式会社リコー 光走査装置
US5151389A (en) * 1990-09-10 1992-09-29 Rockwell International Corporation Method for dicing semiconductor substrates using an excimer laser beam
GB9202434D0 (en) * 1992-02-05 1992-03-18 Xaar Ltd Method of and apparatus for forming nozzles
US5367399A (en) * 1992-02-13 1994-11-22 Holotek Ltd. Rotationally symmetric dual reflection optical beam scanner and system using same
JP3207619B2 (ja) 1993-06-29 2001-09-10 ホーヤ株式会社 レーザ配線方法及びその装置
US5685636A (en) * 1995-08-23 1997-11-11 Science And Engineering Associates, Inc. Eye safe laser security device
US5744780A (en) 1995-09-05 1998-04-28 The United States Of America As Represented By The United States Department Of Energy Apparatus for precision micromachining with lasers
US5638176A (en) * 1996-06-25 1997-06-10 International Business Machines Corporation Inexpensive interferometric eye tracking system
US6294778B1 (en) * 1999-04-22 2001-09-25 Ecrm, Inc. Method and apparatus for recording a flat field image
US6285002B1 (en) * 1999-05-10 2001-09-04 Bryan Kok Ann Ngoi Three dimensional micro machining with a modulated ultra-short laser pulse
JP3201394B2 (ja) * 1999-08-10 2001-08-20 住友電気工業株式会社 ｆθレンズ
US6501045B1 (en) * 2000-04-06 2002-12-31 Resonetics, Inc. Method and apparatus for controlling the taper angle of the walls of laser machined features
US6455807B1 (en) * 2000-06-26 2002-09-24 W.A. Whitney Co. Method and apparatus for controlling a laser-equipped machine tool to prevent self-burning
DE60124938T2 (de) 2000-10-26 2007-09-20 Xsil Technology Ltd. Steueurung von laserbearbeitung
GB0029038D0 (en) * 2000-11-29 2001-01-10 Owen Geoffrey D Refractive optical deflector
KR100894088B1 (ko) * 2001-03-22 2009-04-20 엑스에스아이엘 테크놀러지 리미티드 레이저 기계 가공 시스템 및 방법
US7357486B2 (en) * 2001-12-20 2008-04-15 Hewlett-Packard Development Company, L.P. Method of laser machining a fluid slot
US6951995B2 (en) * 2002-03-27 2005-10-04 Gsi Lumonics Corp. Method and system for high-speed, precise micromachining an array of devices
US20040188401A1 (en) 2003-03-28 2004-09-30 Sadao Mori Laser processing apparatus
US7521651B2 (en) * 2003-09-12 2009-04-21 Orbotech Ltd Multiple beam micro-machining system and method
WO2008045130A2 (en) * 2006-02-17 2008-04-17 Cornell Research Foundation, Inc. Property modification during film growth
JP2007307599A (ja) * 2006-05-20 2007-11-29 Sumitomo Electric Ind Ltd スルーホール成形体およびレーザー加工方法
JP5654234B2 (ja) 2006-08-22 2015-01-14 ケンブリッジ テクノロジー インコーポレイテッド Ｘ−ｙ高速穴あけシステム
US20090323739A1 (en) * 2006-12-22 2009-12-31 Uv Tech Systems Laser optical system
US7489429B2 (en) 2007-02-14 2009-02-10 Michael J. Scaggs Precision laser machining apparatus
US7742212B2 (en) * 2007-02-14 2010-06-22 Michael J. Scaggs Precision laser machining apparatus
US20090057282A1 (en) 2007-08-15 2009-03-05 Chunfu Huang Laser machining method utilizing variable inclination angle
JP2009072789A (ja) 2007-09-18 2009-04-09 Hamamatsu Photonics Kk レーザ加工装置
JP4386137B2 (ja) 2008-02-29 2009-12-16 トヨタ自動車株式会社 レーザ加工装置及びレーザ加工方法
CN102006964B (zh) * 2008-03-21 2016-05-25 Imra美国公司 基于激光的材料加工方法和系统
US8237080B2 (en) 2008-03-27 2012-08-07 Electro Scientific Industries, Inc Method and apparatus for laser drilling holes with Gaussian pulses
JP2009297781A (ja) 2008-06-17 2009-12-24 Kataoka Seisakusho:Kk レーザ加工装置
EP2393625A1 (en) 2009-02-03 2011-12-14 Abbott Cardiovascular Systems Inc. Improved laser cutting process for forming stents
US8340485B2 (en) * 2009-05-29 2012-12-25 Corning Cable Systems Llc Laser-shaped optical fibers along with optical assemblies and methods therefor
CN101856772A (zh) 2010-05-27 2010-10-13 张立国 一种光束旋转振镜扫描聚焦加工系统
JP2012071314A (ja) 2010-09-27 2012-04-12 Mitsubishi Heavy Ind Ltd 複合材の加工方法及び複合材の加工装置
CN103338891B (zh) * 2010-10-22 2016-03-02 伊雷克托科学工业股份有限公司 用于光束抖动和刮削的镭射加工系统和方法
US20120132629A1 (en) 2010-11-30 2012-05-31 Electro Scientific Industries, Inc. Method and apparatus for reducing taper of laser scribes
US8462439B2 (en) * 2011-08-22 2013-06-11 Bae Systems Information And Electronic Systems Integration Inc. Athermal apochromatic telecentric F-theta lens with low F-number
JP5953198B2 (ja) 2011-09-28 2016-07-20 株式会社リプス・ワークス 極短パルスレーザによる多次元パターン形成装置及び形成方法
US9931712B2 (en) 2012-01-11 2018-04-03 Pim Snow Leopard Inc. Laser drilling and trepanning device
US9841311B2 (en) * 2012-10-16 2017-12-12 Hand Held Products, Inc. Dimensioning system
CN105163897A (zh) * 2013-03-15 2015-12-16 伊雷克托科学工业股份有限公司 锥度控制的射束角协调及工件运动
JP6064228B2 (ja) 2013-05-24 2017-01-25 パナソニックＩｐマネジメント株式会社 レーザ切断装置およびレーザ切断方法

Also Published As

Publication number Publication date
EP3050664B1 (en) 2019-07-17
CA2917563A1 (en) 2016-07-19
CN105798455A (zh) 2016-07-27
EP3050664A1 (en) 2016-08-03
JP2016132035A (ja) 2016-07-25
JP6159428B2 (ja) 2017-07-05
CA2917563C (en) 2018-10-02
CN105798455B (zh) 2018-01-19
US10357848B2 (en) 2019-07-23
US20190275609A1 (en) 2019-09-12
US11420288B2 (en) 2022-08-23
US20160207143A1 (en) 2016-07-21

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Legal Events

Date Code Title Description
B03A Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements