CN105798455B - 激光加工系统和方法 - Google Patents
激光加工系统和方法 Download PDFInfo
- Publication number
- CN105798455B CN105798455B CN201610033089.0A CN201610033089A CN105798455B CN 105798455 B CN105798455 B CN 105798455B CN 201610033089 A CN201610033089 A CN 201610033089A CN 105798455 B CN105798455 B CN 105798455B
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- China
- Prior art keywords
- laser beam
- workpiece
- guiding
- laser
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007493 shaping process Methods 0.000 description 19
- 238000005516 engineering process Methods 0.000 description 10
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- 238000009826 distribution Methods 0.000 description 3
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- 238000005459 micromachining Methods 0.000 description 3
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- 240000007594 Oryza sativa Species 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
- B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/599,612 US10357848B2 (en) | 2015-01-19 | 2015-01-19 | Laser machining systems and methods |
| US14/599612 | 2015-01-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105798455A CN105798455A (zh) | 2016-07-27 |
| CN105798455B true CN105798455B (zh) | 2018-01-19 |
Family
ID=55236190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610033089.0A Active CN105798455B (zh) | 2015-01-19 | 2016-01-19 | 激光加工系统和方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10357848B2 (enExample) |
| EP (1) | EP3050664B1 (enExample) |
| JP (1) | JP6159428B2 (enExample) |
| CN (1) | CN105798455B (enExample) |
| BR (1) | BR102016001021A2 (enExample) |
| CA (1) | CA2917563C (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108700661A (zh) * | 2016-03-17 | 2018-10-23 | 伊雷克托科学工业股份有限公司 | 在镭射加工系统中的像平面的定位 |
| CN109530929B (zh) * | 2018-12-27 | 2021-03-19 | 北京中科镭特电子有限公司 | 一种激光加工芯片的方法 |
| JP7299597B2 (ja) * | 2018-12-27 | 2023-06-28 | 国立大学法人 東京大学 | レーザ加工におけるレーザ光強度への依存性の判定方法及びレーザ加工装置 |
| CN109530928B (zh) * | 2018-12-27 | 2021-03-05 | 北京中科镭特电子有限公司 | 一种激光加工芯片的方法及装置 |
| CN110181172B (zh) * | 2019-06-06 | 2024-08-20 | 武汉华工激光工程有限责任公司 | 一种激光加工陶瓷异形槽的装置及方法 |
| DE102019125124A1 (de) * | 2019-09-18 | 2021-03-18 | Rogers Germany Gmbh | Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren |
| DE102019134004A1 (de) | 2019-12-11 | 2021-06-17 | Rogers Germany Gmbh | Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren |
| KR102324548B1 (ko) * | 2019-12-31 | 2021-11-10 | (주)미래컴퍼니 | 레이저 가공 시스템 및 레이저 가공 방법 |
| CN111098043B (zh) * | 2020-01-19 | 2024-12-27 | 中国科学院宁波材料技术与工程研究所 | 水导激光加工装置和加工系统 |
| JP7599776B2 (ja) | 2020-10-02 | 2024-12-16 | 株式会社ディスコ | 被加工物の加工方法 |
| CN115301636A (zh) * | 2022-08-12 | 2022-11-08 | 阳程科技股份有限公司 | 激光除胶方法及采用该方法的除胶设备 |
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| US3792928A (en) * | 1972-02-28 | 1974-02-19 | Schlumberger Compteurs | Fiber optics distance converting technique |
| JPS57175089A (en) * | 1981-04-20 | 1982-10-27 | Inoue Japax Res Inc | Beam working device |
| US4638800A (en) * | 1985-02-08 | 1987-01-27 | Research Physics, Inc | Laser beam surgical system |
| JP2790851B2 (ja) | 1989-05-09 | 1998-08-27 | 株式会社リコー | 光走査装置 |
| US5151389A (en) * | 1990-09-10 | 1992-09-29 | Rockwell International Corporation | Method for dicing semiconductor substrates using an excimer laser beam |
| GB9202434D0 (en) * | 1992-02-05 | 1992-03-18 | Xaar Ltd | Method of and apparatus for forming nozzles |
| US5367399A (en) * | 1992-02-13 | 1994-11-22 | Holotek Ltd. | Rotationally symmetric dual reflection optical beam scanner and system using same |
| JP3207619B2 (ja) | 1993-06-29 | 2001-09-10 | ホーヤ株式会社 | レーザ配線方法及びその装置 |
| US5685636A (en) * | 1995-08-23 | 1997-11-11 | Science And Engineering Associates, Inc. | Eye safe laser security device |
| US5744780A (en) | 1995-09-05 | 1998-04-28 | The United States Of America As Represented By The United States Department Of Energy | Apparatus for precision micromachining with lasers |
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| US6501045B1 (en) * | 2000-04-06 | 2002-12-31 | Resonetics, Inc. | Method and apparatus for controlling the taper angle of the walls of laser machined features |
| US6455807B1 (en) * | 2000-06-26 | 2002-09-24 | W.A. Whitney Co. | Method and apparatus for controlling a laser-equipped machine tool to prevent self-burning |
| KR100829876B1 (ko) | 2000-10-26 | 2008-05-16 | 엑스에스아이엘 테크놀러지 리미티드 | 레이저 기계가공의 제어 |
| GB0029038D0 (en) * | 2000-11-29 | 2001-01-10 | Owen Geoffrey D | Refractive optical deflector |
| ATE323569T1 (de) * | 2001-03-22 | 2006-05-15 | Xsil Technology Ltd | Ein laserbearbeitungssystem und -verfahren |
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| JP2007307599A (ja) * | 2006-05-20 | 2007-11-29 | Sumitomo Electric Ind Ltd | スルーホール成形体およびレーザー加工方法 |
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| JP6064228B2 (ja) | 2013-05-24 | 2017-01-25 | パナソニックIpマネジメント株式会社 | レーザ切断装置およびレーザ切断方法 |
-
2015
- 2015-01-19 US US14/599,612 patent/US10357848B2/en active Active
-
2016
- 2016-01-14 CA CA2917563A patent/CA2917563C/en active Active
- 2016-01-15 JP JP2016005742A patent/JP6159428B2/ja active Active
- 2016-01-18 BR BR102016001021A patent/BR102016001021A2/pt not_active Application Discontinuation
- 2016-01-18 EP EP16151730.5A patent/EP3050664B1/en active Active
- 2016-01-19 CN CN201610033089.0A patent/CN105798455B/zh active Active
-
2019
- 2019-05-30 US US16/426,414 patent/US11420288B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20190275609A1 (en) | 2019-09-12 |
| EP3050664A1 (en) | 2016-08-03 |
| CN105798455A (zh) | 2016-07-27 |
| EP3050664B1 (en) | 2019-07-17 |
| US11420288B2 (en) | 2022-08-23 |
| US20160207143A1 (en) | 2016-07-21 |
| JP2016132035A (ja) | 2016-07-25 |
| CA2917563C (en) | 2018-10-02 |
| BR102016001021A2 (pt) | 2016-08-02 |
| US10357848B2 (en) | 2019-07-23 |
| CA2917563A1 (en) | 2016-07-19 |
| JP6159428B2 (ja) | 2017-07-05 |
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