JP6159428B2 - レーザ加工システム及び方法 - Google Patents

レーザ加工システム及び方法 Download PDF

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Publication number
JP6159428B2
JP6159428B2 JP2016005742A JP2016005742A JP6159428B2 JP 6159428 B2 JP6159428 B2 JP 6159428B2 JP 2016005742 A JP2016005742 A JP 2016005742A JP 2016005742 A JP2016005742 A JP 2016005742A JP 6159428 B2 JP6159428 B2 JP 6159428B2
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Japan
Prior art keywords
laser beam
workpiece
laser
view
lens
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JP2016005742A
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English (en)
Japanese (ja)
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JP2016132035A (ja
JP2016132035A5 (enExample
Inventor
ホンチャン・チェン
スティーブン・ロバート・ハヤシ
シイ・ツァン
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General Electric Co
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General Electric Co
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Publication of JP2016132035A publication Critical patent/JP2016132035A/ja
Publication of JP2016132035A5 publication Critical patent/JP2016132035A5/ja
Application granted granted Critical
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • B23K26/048Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2016005742A 2015-01-19 2016-01-15 レーザ加工システム及び方法 Active JP6159428B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/599,612 US10357848B2 (en) 2015-01-19 2015-01-19 Laser machining systems and methods
US14/599,612 2015-01-19

Publications (3)

Publication Number Publication Date
JP2016132035A JP2016132035A (ja) 2016-07-25
JP2016132035A5 JP2016132035A5 (enExample) 2017-06-15
JP6159428B2 true JP6159428B2 (ja) 2017-07-05

Family

ID=55236190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016005742A Active JP6159428B2 (ja) 2015-01-19 2016-01-15 レーザ加工システム及び方法

Country Status (6)

Country Link
US (2) US10357848B2 (enExample)
EP (1) EP3050664B1 (enExample)
JP (1) JP6159428B2 (enExample)
CN (1) CN105798455B (enExample)
BR (1) BR102016001021A2 (enExample)
CA (1) CA2917563C (enExample)

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CN109530928B (zh) * 2018-12-27 2021-03-05 北京中科镭特电子有限公司 一种激光加工芯片的方法及装置
CN109530929B (zh) * 2018-12-27 2021-03-19 北京中科镭特电子有限公司 一种激光加工芯片的方法
JP7299597B2 (ja) * 2018-12-27 2023-06-28 国立大学法人 東京大学 レーザ加工におけるレーザ光強度への依存性の判定方法及びレーザ加工装置
CN110181172B (zh) * 2019-06-06 2024-08-20 武汉华工激光工程有限责任公司 一种激光加工陶瓷异形槽的装置及方法
DE102019125124A1 (de) * 2019-09-18 2021-03-18 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren
DE102019134004A1 (de) * 2019-12-11 2021-06-17 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren
KR102324548B1 (ko) * 2019-12-31 2021-11-10 (주)미래컴퍼니 레이저 가공 시스템 및 레이저 가공 방법
CN111098043B (zh) * 2020-01-19 2024-12-27 中国科学院宁波材料技术与工程研究所 水导激光加工装置和加工系统
JP7599776B2 (ja) 2020-10-02 2024-12-16 株式会社ディスコ 被加工物の加工方法
CN115301636A (zh) * 2022-08-12 2022-11-08 阳程科技股份有限公司 激光除胶方法及采用该方法的除胶设备

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Also Published As

Publication number Publication date
EP3050664B1 (en) 2019-07-17
CA2917563A1 (en) 2016-07-19
CN105798455A (zh) 2016-07-27
EP3050664A1 (en) 2016-08-03
JP2016132035A (ja) 2016-07-25
BR102016001021A2 (pt) 2016-08-02
CA2917563C (en) 2018-10-02
CN105798455B (zh) 2018-01-19
US10357848B2 (en) 2019-07-23
US20190275609A1 (en) 2019-09-12
US11420288B2 (en) 2022-08-23
US20160207143A1 (en) 2016-07-21

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