JP2016128902A5 - - Google Patents

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Publication number
JP2016128902A5
JP2016128902A5 JP2015245014A JP2015245014A JP2016128902A5 JP 2016128902 A5 JP2016128902 A5 JP 2016128902A5 JP 2015245014 A JP2015245014 A JP 2015245014A JP 2015245014 A JP2015245014 A JP 2015245014A JP 2016128902 A5 JP2016128902 A5 JP 2016128902A5
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JP2015245014A
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Japanese (ja)
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JP2016128902A (ja
JP6261091B2 (ja
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JP2015245014A 2014-12-31 2015-12-16 フォトレジストパターントリミング組成物及び方法 Active JP6261091B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462099095P 2014-12-31 2014-12-31
US62/099,095 2014-12-31

Publications (3)

Publication Number Publication Date
JP2016128902A JP2016128902A (ja) 2016-07-14
JP2016128902A5 true JP2016128902A5 (enExample) 2017-02-23
JP6261091B2 JP6261091B2 (ja) 2018-01-17

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JP2015245014A Active JP6261091B2 (ja) 2014-12-31 2015-12-16 フォトレジストパターントリミング組成物及び方法

Country Status (5)

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US (1) US9696629B2 (enExample)
JP (1) JP6261091B2 (enExample)
KR (1) KR101790056B1 (enExample)
CN (1) CN105739242B (enExample)
TW (1) TWI617611B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9455177B1 (en) * 2015-08-31 2016-09-27 Dow Global Technologies Llc Contact hole formation methods
TWI615383B (zh) * 2015-10-31 2018-02-21 羅門哈斯電子材料有限公司 熱酸產生劑以及光阻劑圖案修整組合物及方法
TWI628159B (zh) * 2015-10-31 2018-07-01 羅門哈斯電子材料有限公司 熱酸產生劑以及光阻劑圖案修整組合物及方法
US9869933B2 (en) 2016-03-07 2018-01-16 Rohm And Haas Electronic Materials Llc Pattern trimming methods
US9760011B1 (en) 2016-03-07 2017-09-12 Rohm And Haas Electronic Materials Llc Pattern trimming compositions and methods
JP6556673B2 (ja) * 2016-07-26 2019-08-07 Hoya株式会社 フォトマスクの製造方法、描画装置、表示装置の製造方法、フォトマスク基板の検査方法、及びフォトマスク基板の検査装置
US10133179B2 (en) * 2016-07-29 2018-11-20 Rohm And Haas Electronic Materials Llc Pattern treatment methods
US9910355B2 (en) * 2016-07-29 2018-03-06 Rohm And Haas Electronic Materials Llc Method of negative tone development using a copolymer multilayer electrolyte and articles made therefrom
US10241411B2 (en) * 2016-10-31 2019-03-26 Rohm And Haas Electronic Materials Llc Topcoat compositions containing fluorinated thermal acid generators
US10684549B2 (en) * 2016-12-31 2020-06-16 Rohm And Haas Electronic Materials Llc Pattern-formation methods
US9799534B1 (en) 2017-01-04 2017-10-24 International Business Machines Corporation Application of titanium-oxide as a patterning hardmask
US11003074B2 (en) 2017-05-01 2021-05-11 Rohm And Haas Electronic Materials Llc Pattern formation methods and photoresist pattern overcoat compositions
TWI884927B (zh) * 2018-10-17 2025-06-01 美商英培雅股份有限公司 圖案化有機金屬光阻及圖案化的方法
CN109503434B (zh) * 2018-11-16 2021-08-06 山东第一医科大学(山东省医学科学院) 一种聚酯ptt的改性剂间苯二甲酸二丙二醇酯-5-磺酸钠的多组分催化合成方法
EP3953767A4 (en) 2019-04-12 2023-06-07 Inpria Corporation ORGANOMETALLIC PHOTORESIN DEVELOPER COMPOSITIONS AND METHODS OF TREATMENT
US11506981B2 (en) 2019-05-31 2022-11-22 Rohm And Haas Electronic Materials Llc Photoresist pattern trimming compositions and pattern formation methods
US11754927B2 (en) 2019-05-31 2023-09-12 Rohm And Haas Electronic Materials Llc Photoresist pattern trimming compositions and pattern formation methods

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180320B1 (en) 1998-03-09 2001-01-30 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a semiconductor device having a fine pattern, and semiconductor device manufactured thereby
JP2001215734A (ja) * 2000-02-04 2001-08-10 Tokyo Ohka Kogyo Co Ltd レジストパターンの表面欠陥減少方法及びそれに用いる表面欠陥減少用処理液
JP4329216B2 (ja) 2000-03-31 2009-09-09 Jsr株式会社 レジストパターン縮小化材料及びそれを使用する微細レジストパターンの形成方法
US6492075B1 (en) 2000-06-16 2002-12-10 Advanced Micro Devices, Inc. Chemical trim process
JP2002006512A (ja) 2000-06-20 2002-01-09 Mitsubishi Electric Corp 微細パターン形成方法、微細パターン形成用材料、およびこの微細パターン形成方法を用いた半導体装置の製造方法
JP2002299202A (ja) 2001-03-29 2002-10-11 Sony Corp 半導体装置の製造方法
US6869899B2 (en) 2001-07-12 2005-03-22 International Business Machines Corporation Lateral-only photoresist trimming for sub-80 nm gate stack
JP3953822B2 (ja) 2002-01-25 2007-08-08 富士通株式会社 レジストパターン薄肉化材料、レジストパターン及びその製造方法、並びに、半導体装置及びその製造方法
JP3743753B2 (ja) * 2002-03-20 2006-02-08 竹本油脂株式会社 ペルフルオロアルキルナフタレンスルホン酸塩、その製造方法、分散剤及び合成高分子用帯電防止剤
US6916594B2 (en) * 2002-12-30 2005-07-12 Hynix Semiconductor Inc. Overcoating composition for photoresist and method for forming photoresist pattern using the same
CN1288719C (zh) 2003-03-10 2006-12-06 联华电子股份有限公司 图案光刻胶的微缩制造过程
US7862982B2 (en) 2008-06-12 2011-01-04 International Business Machines Corporation Chemical trim of photoresist lines by means of a tuned overcoat material
TWI510854B (zh) 2011-12-31 2015-12-01 羅門哈斯電子材料有限公司 光阻劑圖案修整方法
TWI481969B (zh) * 2011-12-31 2015-04-21 羅門哈斯電子材料有限公司 光阻劑圖案修整方法
JP5776615B2 (ja) * 2012-04-11 2015-09-09 信越化学工業株式会社 パターン形成方法
JP6328931B2 (ja) * 2012-12-31 2018-05-23 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC フォトレジストパターントリミング方法
KR102346806B1 (ko) * 2013-12-30 2022-01-04 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 포토레지스트 패턴 트리밍 조성물 및 방법

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