JP2016115762A - 配線印刷物及びその製造方法 - Google Patents
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- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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- H05K3/0011—Working of insulating substrates or insulating layers
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
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- H05K3/22—Secondary treatment of printed circuits
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
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Abstract
Description
シート状の基材と、当該基材上に形成された配線と、を含む配線印刷物であって、
前記基材上に導電性インキによりインキ層を形成したのち、当該インキ層の硬化前に前記基材を曲げ変形し、その後に前記インキ層を硬化させることにより、前記配線が形成されていることを特徴とする配線印刷物である。
前記インキ層を形成する前に、前記基材を塑性変形させると共に、前記基材を弾性的に平坦化した状態で前記インキ層を形成したことを特徴とする。
前記基材が、曲げ変形を促進するための曲げ促進加工部を有し、前記曲げ変形が前記曲げ促進加工部において行われ、
前記インキ層が前記曲げ促進加工部に交差して延在していることを特徴とする。
シート状の基材と、当該基材上に形成された第1及び第2の配線と、を含む配線印刷物であって、
前記第1及び第2の配線が、導電性インキによりインキ層を形成したのち当該インキ層を硬化させることにより形成されており、
前記基材が第1及び第2の表面を有し、前記第1の表面には前記第1の配線が形成され、前記第2の表面には前記第2の配線が形成され、
前記第1の配線の第1の接続点と前記第2の配線の第1の接続点、及び前記第1の配線の第2の接続点前記第2の配線の第2の接続点が、それぞれ前記基材を挟んで互いに対応した位置にあることを特徴とする配線印刷物である。
シート状の基材上に導電性インキによりインキ層を形成する工程と、
前記インキ層の形成後であって前記インキ層の硬化前に、前記基材を曲げ変形し、これによって前記インキ層の少なくとも一部を曲げ変形する工程と、
前記曲げ変形後にインキ層を硬化させる工程と、
を含むことを特徴とする配線印刷物の製造方法である。
前記インキ層を形成する工程の前に、前記基材を塑性変形させる工程を更に含み、
前記インキ層を形成する工程は、前記基材を弾性的に平坦化した状態で実行するのが好適である。
2,12,22,32,42 基材
3,13,18,23,33,43 配線又はインキ層
4,44 折り曲げ線
4e ミシン目
4c 切り込み部
4d 接続部
13 第1の配線
14 第2の配線
13a,14a 第1の接続点
13b,14b 第2の接続点
15a,15b 開口部
16 接続片
Claims (10)
- シート状の基材と、当該基材上に形成された配線と、を含む配線印刷物であって、
前記基材上に導電性インキによりインキ層を形成したのち、当該インキ層の硬化前に前記基材を曲げ変形し、その後に前記インキ層を硬化させることにより、前記配線が形成されていることを特徴とする配線印刷物。 - 前記インキ層を形成する前に、前記基材を塑性変形させると共に、前記基材を弾性的に平坦化した状態で前記インキ層を形成したことを特徴とする請求項1に記載の配線印刷物。
- 前記基材が、曲げ変形を促進するための曲げ促進加工部を有し、前記曲げ変形が前記曲げ促進加工部において行われ、
前記インキ層が前記曲げ促進加工部に交差して延在していることを特徴とする請求項1又は2に記載の配線印刷物。 - 前記曲げ促進加工部が、切り込み部と接続部とが交互に配されたミシン目であり、
前記インキ層のうち少なくとも1つが、前記接続部において前記ミシン目に交差していることを特徴とする請求項3に記載の配線印刷物。 - シート状の基材と、当該基材上に形成された第1及び第2の配線と、を含む配線印刷物であって、
前記第1及び第2の配線が、導電性インキによりインキ層を形成したのち当該インキ層を硬化させることにより形成されており、
前記基材が第1及び第2の表面を有し、前記第1の表面には前記第1の配線が形成され、前記第2の表面には前記第2の配線が形成され、
前記第1の配線の第1の接続点と前記第2の配線の第1の接続点、及び前記第1の配線の第2の接続点前記第2の配線の第2の接続点が、それぞれ前記基材を挟んで互いに対応した位置にあることを特徴とする配線印刷物。 - 前記基材が少なくとも一つの開口部を有し、前記開口部を通じて前記第1の配線と前記第2の配線とを相互接続する接続片を更に備えたことを特徴とする請求項5に記載の配線印刷物。
- 前記インキ層が基材の上に形成された後に、前記基材が除去されていることを特徴とする請求項1ないし6のいずれかに記載の配線印刷物。
- 前記基材が紙であることを特徴とする請求項1ないし7のいずれかに記載の配線印刷物。
- シート状の基材上に導電性インキによりインキ層を形成する工程と、
前記インキ層の形成後であって前記インキ層の硬化前に、前記基材を曲げ変形し、これによって前記インキ層の少なくとも一部を曲げ変形する工程と、
前記曲げ変形後にインキ層を硬化させる工程と、
を含むことを特徴とする配線印刷物の製造方法。 - 前記インキ層を形成する工程の前に、前記基材を塑性変形させる工程を更に含み、
前記インキ層を形成する工程は、前記基材を弾性的に平坦化した状態で実行することを特徴とする請求項9に記載の配線印刷物の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2014251947A JP6794091B2 (ja) | 2014-12-12 | 2014-12-12 | 配線印刷物の製造方法 |
EP15866751.9A EP3232744B1 (en) | 2014-12-12 | 2015-08-07 | Printed wiring board and manufacturing method for same |
CN201580065344.3A CN107006120B (zh) | 2014-12-12 | 2015-08-07 | 配线印刷物及其制造方法 |
PCT/JP2015/003999 WO2016092716A1 (ja) | 2014-12-12 | 2015-08-07 | 配線印刷物及びその製造方法 |
US15/614,335 US10212810B2 (en) | 2014-12-12 | 2017-06-05 | Printed wiring board and method of producing the same |
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JP2014251947A JP6794091B2 (ja) | 2014-12-12 | 2014-12-12 | 配線印刷物の製造方法 |
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JP2016115762A true JP2016115762A (ja) | 2016-06-23 |
JP6794091B2 JP6794091B2 (ja) | 2020-12-02 |
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US (1) | US10212810B2 (ja) |
EP (1) | EP3232744B1 (ja) |
JP (1) | JP6794091B2 (ja) |
CN (1) | CN107006120B (ja) |
WO (1) | WO2016092716A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2019098195A1 (ja) * | 2017-11-14 | 2019-05-23 | 日立化成株式会社 | 物品及びその製造方法 |
WO2020039550A1 (ja) * | 2018-08-23 | 2020-02-27 | 三菱電機株式会社 | フレキシブル基板 |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN108495488B (zh) * | 2018-05-23 | 2019-06-21 | 深圳市汇芯线路科技有限公司 | 一种多层印刷线路板的制作方法 |
CN108650780B (zh) * | 2018-05-23 | 2019-07-16 | 深圳市爱升精密电路科技有限公司 | 一种柔性印刷电路板 |
WO2021176498A1 (ja) * | 2020-03-02 | 2021-09-10 | 株式会社Fuji | 配線形成方法 |
CN114845008B (zh) * | 2021-02-01 | 2024-09-06 | 宁波舜宇光电信息有限公司 | 感光组件、摄像模组和线路板的制备方法 |
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2014
- 2014-12-12 JP JP2014251947A patent/JP6794091B2/ja active Active
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2015
- 2015-08-07 EP EP15866751.9A patent/EP3232744B1/en active Active
- 2015-08-07 CN CN201580065344.3A patent/CN107006120B/zh active Active
- 2015-08-07 WO PCT/JP2015/003999 patent/WO2016092716A1/ja active Application Filing
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Patent Citations (2)
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JP2001177224A (ja) * | 1999-12-17 | 2001-06-29 | Sony Corp | 立体回路基板及びその製造方法 |
JP2006165198A (ja) * | 2004-12-06 | 2006-06-22 | Ricoh Co Ltd | 三次元成形回路部品の製造方法およびこれにより製造された三次元成形回路部品 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019098195A1 (ja) * | 2017-11-14 | 2019-05-23 | 日立化成株式会社 | 物品及びその製造方法 |
JPWO2019098195A1 (ja) * | 2017-11-14 | 2020-11-19 | 日立化成株式会社 | 物品及びその製造方法 |
WO2020039550A1 (ja) * | 2018-08-23 | 2020-02-27 | 三菱電機株式会社 | フレキシブル基板 |
JPWO2020039550A1 (ja) * | 2018-08-23 | 2021-04-30 | 三菱電機株式会社 | フレキシブル基板 |
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US20170273197A1 (en) | 2017-09-21 |
US10212810B2 (en) | 2019-02-19 |
JP6794091B2 (ja) | 2020-12-02 |
CN107006120A (zh) | 2017-08-01 |
WO2016092716A1 (ja) | 2016-06-16 |
EP3232744B1 (en) | 2022-05-04 |
EP3232744A4 (en) | 2018-08-08 |
CN107006120B (zh) | 2019-08-20 |
EP3232744A1 (en) | 2017-10-18 |
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