JP2016082112A - 部品圧着装置 - Google Patents
部品圧着装置 Download PDFInfo
- Publication number
- JP2016082112A JP2016082112A JP2014213449A JP2014213449A JP2016082112A JP 2016082112 A JP2016082112 A JP 2016082112A JP 2014213449 A JP2014213449 A JP 2014213449A JP 2014213449 A JP2014213449 A JP 2014213449A JP 2016082112 A JP2016082112 A JP 2016082112A
- Authority
- JP
- Japan
- Prior art keywords
- component
- film
- block
- crimping
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P11/00—Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for
- B23P11/005—Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for by expanding or crimping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7555—Mechanical means, e.g. for planarising, pressing, stamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
- H01R12/69—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal deformable terminals, e.g. crimping terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
【解決手段】フィルム状部品3を吸着して基板2に押し付ける圧着ツール21が、ブロック保持部32のガイド45に沿って移動自在な複数の主吸着ブロック33と副吸着ブロック34を備える。複数の主吸着ブロック33によってフィルム状部品3の圧着部位の上方部Raを吸着し、副吸着ブロック34によってフィルム状部品3の基板2に対する非圧着部位の上方部Rbを吸着する。
【選択図】図6
Description
2 基板
3 フィルム状部品
21 圧着ツール
32 ブロック保持部
33 主吸着ブロック(第1の吸着ブロック)
34 副吸着ブロック(第2の吸着ブロック)
34J 押圧力吸収部材
43 固定螺子(ブロック固定手段)
45 ガイド
Ra 圧着部位の上方部
Rb 非圧着部位の上方部
Claims (3)
- フィルム状部品を圧着ツールにより吸着し、その吸着したフィルム状部品の基板に対する圧着部位を基板に押し付けて前記フィルム状部品を前記基板に圧着する部品圧着装置であって、
前記圧着ツールは、
水平面内の一の方向に延びたガイドを備えたブロック保持部と、
前記ブロック保持部の前記ガイドに沿って移動自在に設けられ、前記フィルム状部品の前記圧着部位の上方部を吸着する複数の第1の吸着ブロックと、
前記ブロック保持部の前記ガイドに沿って移動自在に設けられ、前記フィルム状部品の基板に対する非圧着部位の上方部を吸着する第2の吸着ブロックと、
前記複数の第1の吸着ブロック及び前記第2の吸着ブロックを前記ガイド内の所望の位置に固定するブロック固定手段とを備えたことを特徴とする部品圧着装置。 - 前記第2の吸着ブロックは、前記複数の第1の吸着ブロックの列の外側の位置に設けられていることを特徴とする請求項1に記載の部品圧着装置。
- 前記第2の吸着ブロックは、前記フィルム状部品を前記基板に対して押し付ける方向に弾性変形自在な押圧力吸収部材を介して前記フィルム状部品の前記非圧着部の上方部を吸着することを特徴とする請求項1又は2に記載の部品圧着装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014213449A JP6467622B2 (ja) | 2014-10-20 | 2014-10-20 | 部品圧着装置 |
US14/865,283 US10065275B2 (en) | 2014-10-20 | 2015-09-25 | Component crimping apparatus |
CN201510660687.6A CN105529287B (zh) | 2014-10-20 | 2015-10-14 | 部件压接装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014213449A JP6467622B2 (ja) | 2014-10-20 | 2014-10-20 | 部品圧着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016082112A true JP2016082112A (ja) | 2016-05-16 |
JP6467622B2 JP6467622B2 (ja) | 2019-02-13 |
Family
ID=55750239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014213449A Active JP6467622B2 (ja) | 2014-10-20 | 2014-10-20 | 部品圧着装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10065275B2 (ja) |
JP (1) | JP6467622B2 (ja) |
CN (1) | CN105529287B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180136248A (ko) * | 2017-06-14 | 2018-12-24 | 주식회사 프로텍 | 판상 자재 고정 장치 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104584712B (zh) * | 2012-08-22 | 2017-03-08 | 松下知识产权经营株式会社 | 元件安装装置和安装方法 |
JP6467622B2 (ja) * | 2014-10-20 | 2019-02-13 | パナソニックIpマネジメント株式会社 | 部品圧着装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000077898A (ja) * | 1998-09-01 | 2000-03-14 | Shibaura Mechatronics Corp | 部品実装装置 |
JP2007235178A (ja) * | 2007-06-06 | 2007-09-13 | Matsushita Electric Ind Co Ltd | 電子部品のボンディング装置 |
JP2011100800A (ja) * | 2009-11-04 | 2011-05-19 | Panasonic Corp | 部品圧着装置、および、部品圧着方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5509192A (en) * | 1993-03-30 | 1996-04-23 | Ando Electric Co., Ltd. | Apparatus for press-fitting connectors into printed boards |
JP2929937B2 (ja) * | 1994-04-20 | 1999-08-03 | 松下電器産業株式会社 | 電子部品実装装置及び電子部品の実装方法 |
JP3588444B2 (ja) * | 2000-10-26 | 2004-11-10 | 松下電器産業株式会社 | 電子部品、部品実装装置及び部品実装方法 |
KR100395925B1 (ko) * | 2001-08-01 | 2003-08-27 | 삼성전자주식회사 | 테스트 핸들러의 반도체 디바이스 로딩장치 |
KR100622415B1 (ko) * | 2004-12-06 | 2006-09-19 | 미래산업 주식회사 | 반도체 소자 테스트 핸들러의 소자 반송장치 |
JP4908404B2 (ja) | 2005-04-28 | 2012-04-04 | 東レエンジニアリング株式会社 | ボンディング装置およびこれを備えたボンディングシステム |
CN101981681B (zh) * | 2008-04-01 | 2012-10-24 | 松下电器产业株式会社 | 零件安装装置及方法 |
JP2013042070A (ja) | 2011-08-19 | 2013-02-28 | Shibaura Mechatronics Corp | 電子部品の実装装置及び実装方法 |
CN104584712B (zh) * | 2012-08-22 | 2017-03-08 | 松下知识产权经营株式会社 | 元件安装装置和安装方法 |
CN104051290B (zh) * | 2013-03-12 | 2018-03-09 | 松下知识产权经营株式会社 | 接合装置及薄膜状基板保持单元 |
JP6393897B2 (ja) * | 2014-06-23 | 2018-09-26 | パナソニックIpマネジメント株式会社 | 部品圧着装置 |
JP6467622B2 (ja) * | 2014-10-20 | 2019-02-13 | パナソニックIpマネジメント株式会社 | 部品圧着装置 |
-
2014
- 2014-10-20 JP JP2014213449A patent/JP6467622B2/ja active Active
-
2015
- 2015-09-25 US US14/865,283 patent/US10065275B2/en active Active
- 2015-10-14 CN CN201510660687.6A patent/CN105529287B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000077898A (ja) * | 1998-09-01 | 2000-03-14 | Shibaura Mechatronics Corp | 部品実装装置 |
JP2007235178A (ja) * | 2007-06-06 | 2007-09-13 | Matsushita Electric Ind Co Ltd | 電子部品のボンディング装置 |
JP2011100800A (ja) * | 2009-11-04 | 2011-05-19 | Panasonic Corp | 部品圧着装置、および、部品圧着方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180136248A (ko) * | 2017-06-14 | 2018-12-24 | 주식회사 프로텍 | 판상 자재 고정 장치 |
KR101952508B1 (ko) * | 2017-06-14 | 2019-02-27 | 주식회사 프로텍 | 판상 자재 고정 장치 |
Also Published As
Publication number | Publication date |
---|---|
CN105529287B (zh) | 2020-08-11 |
US10065275B2 (en) | 2018-09-04 |
JP6467622B2 (ja) | 2019-02-13 |
US20160113164A1 (en) | 2016-04-21 |
CN105529287A (zh) | 2016-04-27 |
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