JP2016065214A5 - - Google Patents
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- Publication number
- JP2016065214A5 JP2016065214A5 JP2015162392A JP2015162392A JP2016065214A5 JP 2016065214 A5 JP2016065214 A5 JP 2016065214A5 JP 2015162392 A JP2015162392 A JP 2015162392A JP 2015162392 A JP2015162392 A JP 2015162392A JP 2016065214 A5 JP2016065214 A5 JP 2016065214A5
- Authority
- JP
- Japan
- Prior art keywords
- polymeric nanoparticles
- resin
- composition
- nanoparticles
- resin mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000002105 nanoparticle Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 23
- 239000002245 particle Substances 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 5
- 238000000034 method Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 3
- 229920000642 polymer Polymers 0.000 claims 3
- 239000012815 thermoplastic material Substances 0.000 claims 3
- 229920000728 polyester Polymers 0.000 claims 2
- 239000004814 polyurethane Substances 0.000 claims 2
- 229920002635 polyurethane Polymers 0.000 claims 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims 1
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 claims 1
- 239000004695 Polyether sulfone Substances 0.000 claims 1
- 239000004697 Polyetherimide Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000004734 Polyphenylene sulfide Substances 0.000 claims 1
- 229920000491 Polyphenylsulfone Polymers 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 229920001940 conductive polymer Polymers 0.000 claims 1
- 239000004643 cyanate ester Substances 0.000 claims 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims 1
- 230000020169 heat generation Effects 0.000 claims 1
- 229920003192 poly(bis maleimide) Polymers 0.000 claims 1
- 229920002492 poly(sulfone) Polymers 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920006260 polyaryletherketone Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 229920006393 polyether sulfone Polymers 0.000 claims 1
- 229920001601 polyetherimide Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 229920000098 polyolefin Polymers 0.000 claims 1
- 229920000069 polyphenylene sulfide Polymers 0.000 claims 1
- 239000012783 reinforcing fiber Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/493,365 | 2014-09-23 | ||
| US14/493,365 US9862828B2 (en) | 2014-09-23 | 2014-09-23 | Polymer nanoparticle additions for resin modification |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020092416A Division JP2020158774A (ja) | 2014-09-23 | 2020-05-27 | 樹脂改質分野における高分子ナノ粒子の添加 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016065214A JP2016065214A (ja) | 2016-04-28 |
| JP2016065214A5 true JP2016065214A5 (enExample) | 2020-07-16 |
| JP7182845B2 JP7182845B2 (ja) | 2022-12-05 |
Family
ID=54325306
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015162392A Active JP7182845B2 (ja) | 2014-09-23 | 2015-08-20 | 樹脂改質分野における高分子ナノ粒子の添加 |
| JP2020092416A Pending JP2020158774A (ja) | 2014-09-23 | 2020-05-27 | 樹脂改質分野における高分子ナノ粒子の添加 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020092416A Pending JP2020158774A (ja) | 2014-09-23 | 2020-05-27 | 樹脂改質分野における高分子ナノ粒子の添加 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9862828B2 (enExample) |
| EP (1) | EP3000841B1 (enExample) |
| JP (2) | JP7182845B2 (enExample) |
| ES (1) | ES2742679T3 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9587076B2 (en) * | 2014-09-23 | 2017-03-07 | The Boeing Company | Polymer nanoparticles for controlling resin reaction rates |
| US10072126B2 (en) * | 2014-09-23 | 2018-09-11 | The Boeing Company | Soluble nanoparticles for composite performance enhancement |
| EP3051273A1 (en) * | 2015-02-02 | 2016-08-03 | Nokia Technologies OY | A mechanical deformation sensor based on plasmonic nanoparticles |
| CN108701894B (zh) * | 2016-03-25 | 2021-05-18 | 康普技术有限责任公司 | 具有由轻质介电材料形成的透镜和相关介电材料的天线 |
| US11431100B2 (en) | 2016-03-25 | 2022-08-30 | Commscope Technologies Llc | Antennas having lenses formed of lightweight dielectric materials and related dielectric materials |
| RU2656045C2 (ru) * | 2016-11-23 | 2018-05-30 | Федеральное государственное унитарное предприятие "Институт химических реактивов и особо чистых химических веществ Национального исследовательского центра "Курчатовский институт" | Способ получения полиимидного композитного материала, армированного наноструктурированным карбидом бора (варианты) |
| RU2673292C1 (ru) * | 2017-08-02 | 2018-11-23 | Общество с ограниченной ответственностью "ПолиКомпозиты" | Способ получения полиимидного композиционного материала, наполненного наноструктурированным карбидом кремния с модифицированной поверхностью |
| US11527835B2 (en) | 2017-09-15 | 2022-12-13 | Commscope Technologies Llc | Methods of preparing a composite dielectric material |
| RU2701249C1 (ru) * | 2019-04-02 | 2019-09-25 | Федеральное государственное унитарное предприятие "Центральный институт авиационного моторостроения имени П.И. Баранова" | Способ диспергирования трудновоспламеняемых наночастиц бора |
| WO2024228184A1 (en) * | 2023-05-04 | 2024-11-07 | Inpack Technologies - Limited Partnership | Method of forming non-conductive polymer layers with a controlled coefficient of thermal expansion |
| CN116704893B (zh) * | 2023-06-01 | 2025-11-14 | 武汉天马微电子有限公司 | 显示装置以及制备方法 |
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-
2014
- 2014-09-23 US US14/493,365 patent/US9862828B2/en active Active
-
2015
- 2015-08-20 JP JP2015162392A patent/JP7182845B2/ja active Active
- 2015-09-23 EP EP15186490.7A patent/EP3000841B1/en active Active
- 2015-09-23 ES ES15186490T patent/ES2742679T3/es active Active
-
2020
- 2020-05-27 JP JP2020092416A patent/JP2020158774A/ja active Pending
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