JP2016044978A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016044978A5 JP2016044978A5 JP2014166925A JP2014166925A JP2016044978A5 JP 2016044978 A5 JP2016044978 A5 JP 2016044978A5 JP 2014166925 A JP2014166925 A JP 2014166925A JP 2014166925 A JP2014166925 A JP 2014166925A JP 2016044978 A5 JP2016044978 A5 JP 2016044978A5
- Authority
- JP
- Japan
- Prior art keywords
- physical quantity
- quantity sensor
- substrate
- mass part
- fixed electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014166925A JP6655281B2 (ja) | 2014-08-19 | 2014-08-19 | 物理量センサー、電子機器および移動体 |
| US14/816,162 US20160054353A1 (en) | 2014-08-19 | 2015-08-03 | Physical quantity sensor, electronic device, and mobile body |
| CN201510505681.1A CN105371831A (zh) | 2014-08-19 | 2015-08-17 | 物理量传感器、电子设备以及移动体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014166925A JP6655281B2 (ja) | 2014-08-19 | 2014-08-19 | 物理量センサー、電子機器および移動体 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018231194A Division JP6766861B2 (ja) | 2018-12-10 | 2018-12-10 | 物理量センサー、電子機器および移動体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016044978A JP2016044978A (ja) | 2016-04-04 |
| JP2016044978A5 true JP2016044978A5 (enExample) | 2017-09-28 |
| JP6655281B2 JP6655281B2 (ja) | 2020-02-26 |
Family
ID=55348119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014166925A Active JP6655281B2 (ja) | 2014-08-19 | 2014-08-19 | 物理量センサー、電子機器および移動体 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20160054353A1 (enExample) |
| JP (1) | JP6655281B2 (enExample) |
| CN (1) | CN105371831A (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6485260B2 (ja) * | 2015-07-10 | 2019-03-20 | セイコーエプソン株式会社 | 物理量センサー、物理量センサー装置、電子機器および移動体 |
| JP2019045170A (ja) * | 2017-08-30 | 2019-03-22 | セイコーエプソン株式会社 | 物理量センサー、複合センサー、慣性計測ユニット、携帯型電子機器、電子機器及び移動体 |
| JP2019045171A (ja) | 2017-08-30 | 2019-03-22 | セイコーエプソン株式会社 | 物理量センサー、複合センサー、慣性計測ユニット、携帯型電子機器、電子機器及び移動体 |
| JP2019045172A (ja) | 2017-08-30 | 2019-03-22 | セイコーエプソン株式会社 | 物理量センサー、複合センサー、慣性計測ユニット、携帯型電子機器、電子機器及び移動体 |
| JP7139661B2 (ja) * | 2018-04-02 | 2022-09-21 | セイコーエプソン株式会社 | 物理量センサー、物理量センサーデバイス、複合センサーデバイス、慣性計測装置、電子機器および移動体 |
| US11274035B2 (en) | 2019-04-24 | 2022-03-15 | X-Celeprint Limited | Overhanging device structures and related methods of manufacture |
| US12162747B2 (en) * | 2018-12-03 | 2024-12-10 | X-Celeprint Limited | Enclosed cavity structures |
| DE102018222615B4 (de) * | 2018-12-20 | 2021-09-02 | Robert Bosch Gmbh | Bauelement mit einer optimierten mehrlagigen Torsionsfeder |
| WO2020195386A1 (ja) * | 2019-03-27 | 2020-10-01 | パナソニックIpマネジメント株式会社 | 物理量センサ |
| JP7694182B2 (ja) * | 2021-06-17 | 2025-06-18 | セイコーエプソン株式会社 | 慣性センサー及び慣性計測装置 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4736629A (en) * | 1985-12-20 | 1988-04-12 | Silicon Designs, Inc. | Micro-miniature accelerometer |
| US5404749A (en) * | 1993-04-07 | 1995-04-11 | Ford Motor Company | Boron doped silicon accelerometer sense element |
| US5488864A (en) * | 1994-12-19 | 1996-02-06 | Ford Motor Company | Torsion beam accelerometer with slotted tilt plate |
| US5587518A (en) * | 1994-12-23 | 1996-12-24 | Ford Motor Company | Accelerometer with a combined self-test and ground electrode |
| IT1283647B1 (it) * | 1996-08-02 | 1998-04-23 | Ausimont Spa | Perfluoropolieteri a struttura di policarbonato |
| JP2005069852A (ja) * | 2003-08-25 | 2005-03-17 | Seiko Instruments Inc | 容量型力学量センサ |
| US6935175B2 (en) * | 2003-11-20 | 2005-08-30 | Honeywell International, Inc. | Capacitive pick-off and electrostatic rebalance accelerometer having equalized gas damping |
| US7121141B2 (en) * | 2005-01-28 | 2006-10-17 | Freescale Semiconductor, Inc. | Z-axis accelerometer with at least two gap sizes and travel stops disposed outside an active capacitor area |
| DE102006057929A1 (de) * | 2006-12-08 | 2008-06-12 | Robert Bosch Gmbh | Mikromechanischer Inertialsensor mit verringerter Empfindlichkeit gegenüber dem Einfluss driftender Oberflächenladungen und zu seinem Betrieb geeignetes Verfahren |
| DE102006058747A1 (de) * | 2006-12-12 | 2008-06-19 | Robert Bosch Gmbh | Mikromechanischer z-Sensor |
| US7610809B2 (en) * | 2007-01-18 | 2009-11-03 | Freescale Semiconductor, Inc. | Differential capacitive sensor and method of making same |
| US7578190B2 (en) * | 2007-08-03 | 2009-08-25 | Freescale Semiconductor, Inc. | Symmetrical differential capacitive sensor and method of making same |
| US8079262B2 (en) * | 2007-10-26 | 2011-12-20 | Rosemount Aerospace Inc. | Pendulous accelerometer with balanced gas damping |
| US8096182B2 (en) * | 2008-05-29 | 2012-01-17 | Freescale Semiconductor, Inc. | Capacitive sensor with stress relief that compensates for package stress |
| DE102008043788A1 (de) * | 2008-11-17 | 2010-05-20 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
| DE102009002559A1 (de) * | 2009-04-22 | 2010-10-28 | Robert Bosch Gmbh | Sensoranordnung |
| ITTO20090597A1 (it) * | 2009-07-31 | 2011-02-01 | St Microelectronics Srl | Struttura di rilevamento microelettromeccanica ad asse z con ridotte derive termiche |
| DE102009029095B4 (de) * | 2009-09-02 | 2017-05-18 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
| DE102010029645B4 (de) * | 2010-06-02 | 2018-03-29 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit einer Teststruktur zur Bestimmung der Schichtdicke einer Abstandsschicht und Verfahren zum Herstellen einer solchen Teststruktur |
| DE102010039069B4 (de) * | 2010-08-09 | 2023-08-24 | Robert Bosch Gmbh | Beschleunigungssensor mit einer Dämpfungseinrichtung |
| US8555719B2 (en) * | 2011-01-24 | 2013-10-15 | Freescale Semiconductor, Inc. | MEMS sensor with folded torsion springs |
| JP5790296B2 (ja) * | 2011-08-17 | 2015-10-07 | セイコーエプソン株式会社 | 物理量センサー及び電子機器 |
| JP5930183B2 (ja) * | 2012-04-09 | 2016-06-08 | セイコーエプソン株式会社 | 物理量センサーおよび電子機器 |
| JP5942554B2 (ja) * | 2012-04-11 | 2016-06-29 | セイコーエプソン株式会社 | 物理量センサーおよび電子機器 |
| JP6002481B2 (ja) * | 2012-07-06 | 2016-10-05 | 日立オートモティブシステムズ株式会社 | 慣性センサ |
| US9176157B2 (en) * | 2012-12-05 | 2015-11-03 | Maxim Integrated Products, Inc. | Micro-electromechanical structure with low sensitivity to thermo-mechanical stress |
| US9134337B2 (en) * | 2012-12-17 | 2015-09-15 | Maxim Integrated Products, Inc. | Microelectromechanical z-axis out-of-plane stopper |
| ITTO20130237A1 (it) * | 2013-03-22 | 2014-09-23 | St Microelectronics Srl | Struttura microelettromeccanica di rilevamento ad asse z ad elevata sensibilita', in particolare per un accelerometro mems |
| US20150268268A1 (en) * | 2013-06-17 | 2015-09-24 | Freescale Semiconductor, Inc. | Inertial sensor with trim capacitance and method of trimming offset |
| CN103901227B (zh) * | 2014-04-02 | 2016-04-27 | 清华大学 | 硅微谐振式加速度计 |
-
2014
- 2014-08-19 JP JP2014166925A patent/JP6655281B2/ja active Active
-
2015
- 2015-08-03 US US14/816,162 patent/US20160054353A1/en not_active Abandoned
- 2015-08-17 CN CN201510505681.1A patent/CN105371831A/zh active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016044978A5 (enExample) | ||
| PL3507845T3 (pl) | Materiał kompozytowy krzem-tlenek krzemu-lit z kompensacją zmiany objętości mający nanocząstki krzemu wbudowane w matrycę kompozytową krzem: krzemianu litu i cykliczne procesy produkcyjne ex-situ | |
| JP2013137552A5 (enExample) | ||
| JP2016081059A5 (enExample) | ||
| WO2015049321A3 (en) | A sensor for an oral appliance | |
| JP2015228014A5 (ja) | 表示装置 | |
| GB201219308D0 (en) | Electronic device packages and methods | |
| JP2014225664A5 (enExample) | ||
| JP2015064534A5 (ja) | 表示素子およびその製造方法 | |
| JP2015185958A5 (enExample) | ||
| WO2016043848A3 (en) | Electrochemical sensors and packaging and related methods | |
| JP2018523191A5 (enExample) | ||
| JP2015084377A5 (enExample) | ||
| JP2016102737A5 (enExample) | ||
| EP3410929A4 (en) | MINIATURIZED PRESSURE / FORCE SENSOR WITH INTEGRATED CONDUCTORS | |
| JP2014057236A5 (enExample) | ||
| USD760102S1 (en) | Chemical sensor device | |
| WO2015017748A3 (en) | Mast stabilizing device | |
| JP2015068800A5 (enExample) | ||
| EP3593279A4 (en) | FINGERPRINT SENSOR MODULE WITH A FINGERPRINT SENSOR DEVICE AND A SUBSTRATE CONNECTED TO THE SENSOR DEVICE | |
| JP2013130567A5 (enExample) | ||
| EP2835829A3 (en) | Integrated circuit device | |
| JP2014085233A5 (enExample) | ||
| JP2016044979A5 (enExample) | ||
| WO2015002736A3 (en) | Surface modification of metal nanostructures |