JP2016032114A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016032114A5 JP2016032114A5 JP2015147759A JP2015147759A JP2016032114A5 JP 2016032114 A5 JP2016032114 A5 JP 2016032114A5 JP 2015147759 A JP2015147759 A JP 2015147759A JP 2015147759 A JP2015147759 A JP 2015147759A JP 2016032114 A5 JP2016032114 A5 JP 2016032114A5
- Authority
- JP
- Japan
- Prior art keywords
- heat
- component mount
- heat transfer
- generating component
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 16
- 230000004907 flux Effects 0.000 claims description 8
- 230000001737 promoting effect Effects 0.000 claims 8
- 230000002093 peripheral effect Effects 0.000 claims 6
- 230000020169 heat generation Effects 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/340,614 | 2014-07-25 | ||
| US14/340,614 US9869520B2 (en) | 2014-07-25 | 2014-07-25 | Heat transfer management apparatuses having a composite lamina |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019200655A Division JP6856730B2 (ja) | 2014-07-25 | 2019-11-05 | 複合層を有する熱伝達管理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016032114A JP2016032114A (ja) | 2016-03-07 |
| JP2016032114A5 true JP2016032114A5 (enExample) | 2018-04-19 |
| JP6885664B2 JP6885664B2 (ja) | 2021-06-16 |
Family
ID=55166482
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015147759A Active JP6885664B2 (ja) | 2014-07-25 | 2015-07-27 | 複合層を有する熱伝達管理装置 |
| JP2019200655A Active JP6856730B2 (ja) | 2014-07-25 | 2019-11-05 | 複合層を有する熱伝達管理装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019200655A Active JP6856730B2 (ja) | 2014-07-25 | 2019-11-05 | 複合層を有する熱伝達管理装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9869520B2 (enExample) |
| JP (2) | JP6885664B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10206310B2 (en) | 2017-04-07 | 2019-02-12 | Toyota Motor Engineering & Manufacturing North America, Inc. | Electronics assemblies incorporating three-dimensional heat flow structures |
| US10627653B2 (en) | 2017-08-28 | 2020-04-21 | Toyota Motor Engineering & Manufacturing North America, Inc. | Thermal guiding for photonic components |
| US12279360B2 (en) * | 2022-09-27 | 2025-04-15 | Prime World International Holdings Ltd. | Optical transceiver including heat dissipation components thermally coupled to opposite sides of housing |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5074037A (en) | 1989-12-01 | 1991-12-24 | Oerlikon-Contraves Ag | Process for producing electrical connections on a universal substrate |
| US5550750A (en) | 1993-05-28 | 1996-08-27 | Mentor Graphics Corporation | Method and system for integrating component analysis with multiple component placement |
| US5644687A (en) | 1994-12-29 | 1997-07-01 | International Business Machines Corporation | Methods and system for thermal analysis of electronic packages |
| US7308008B2 (en) | 2002-11-08 | 2007-12-11 | Finisar Corporation | Magnetically controlled heat sink |
| WO2007070879A1 (en) | 2005-12-17 | 2007-06-21 | Gradient Design Automation, Inc. | Simulation of ic temperature distributions using an adaptive 3d grid |
| JP2005223078A (ja) * | 2004-02-04 | 2005-08-18 | Murata Mfg Co Ltd | 回路モジュール |
| US20070108595A1 (en) | 2005-11-16 | 2007-05-17 | Ati Technologies Inc. | Semiconductor device with integrated heat spreader |
| JP4540630B2 (ja) * | 2006-03-24 | 2010-09-08 | 三菱電機株式会社 | 高熱伝導プリント配線板 |
| US7490309B1 (en) | 2006-08-31 | 2009-02-10 | Cadence Design Systems, Inc. | Method and system for automatically optimizing physical implementation of an electronic circuit responsive to simulation analysis |
| JP4277036B2 (ja) * | 2006-09-29 | 2009-06-10 | Ｔｄｋ株式会社 | 半導体内蔵基板及びその製造方法 |
| US20080137308A1 (en) * | 2006-12-11 | 2008-06-12 | Magna International Inc. | Thermal Management system and method for semiconductor lighting systems |
| US20080288908A1 (en) | 2007-05-15 | 2008-11-20 | Mirror Semiconductor, Inc. | Simultaneous design of integrated circuit and printed circuit board |
| US8021907B2 (en) * | 2008-06-09 | 2011-09-20 | Stats Chippac, Ltd. | Method and apparatus for thermally enhanced semiconductor package |
| JP2010165728A (ja) * | 2009-01-13 | 2010-07-29 | Kyocera Corp | 多層基板及び携帯通信機器 |
| TWI377465B (en) | 2010-03-11 | 2012-11-21 | Delta Electronics Inc | Heat dissipating module and electronic device using such heat dissipating module |
| CN102548341A (zh) | 2010-12-10 | 2012-07-04 | 旭丽电子(广州)有限公司 | 散热壳体结构 |
| US8601428B2 (en) | 2011-12-13 | 2013-12-03 | Qualcomm Incorporated | System and method for use case-based thermal analysis of heuristically determined component combinations and layouts in a portable computing device |
| JP2013161812A (ja) * | 2012-02-01 | 2013-08-19 | Nec Corp | 基板及び発熱部品の放熱方法 |
| US9125299B2 (en) * | 2012-12-06 | 2015-09-01 | Apple Inc. | Cooling for electronic components |
-
2014
- 2014-07-25 US US14/340,614 patent/US9869520B2/en active Active
-
2015
- 2015-07-27 JP JP2015147759A patent/JP6885664B2/ja active Active
-
2019
- 2019-11-05 JP JP2019200655A patent/JP6856730B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2015185741A5 (enExample) | ||
| US9401590B2 (en) | Heat sink for contactor in power distribution assembly | |
| JP2016059147A5 (ja) | パワーモジュール及び電力変換装置 | |
| WO2011137756A3 (zh) | 复合材料以及电子设备 | |
| JP6380037B2 (ja) | 半導体装置およびそれを用いた電子部品 | |
| US20140085911A1 (en) | Thermal blocker for mobile device skin hot spot management | |
| EA201990574A1 (ru) | Печатная плата для соединения аккумуляторных элементов и аккумуляторная батарея | |
| JPWO2015129161A1 (ja) | チップ抵抗器 | |
| JP2014216656A5 (enExample) | ||
| JP2016032114A5 (enExample) | ||
| US10811332B2 (en) | Thermal-dissipating substrate structure | |
| RU2017133004A (ru) | Слой планарного трансформатора, сборка слоев для планарного трансформатора и планарный трансформатор | |
| JP2014053603A5 (enExample) | ||
| JP6856730B2 (ja) | 複合層を有する熱伝達管理装置 | |
| CN104684248A (zh) | 布线基板 | |
| PE20201084A1 (es) | Panel que tiene un elemento de conexion electrica y cable de conexion | |
| CN207441436U (zh) | 一种串联结构的多层平面线圈 | |
| US20140247559A1 (en) | Heat dissipation structure of electronic shield cover | |
| JP2017530556A5 (enExample) | ||
| CN207531248U (zh) | 一种移动终端 | |
| JP2014192321A (ja) | 電子部品内蔵配線板およびその製造方法 | |
| JP6275989B2 (ja) | セラミック配線基板 | |
| US20140076529A1 (en) | Heat dissipation structure | |
| CN205304302U (zh) | 一种无线充电接收线圈 | |
| CN203482490U (zh) | Pcb板 |