JP6885664B2 - 複合層を有する熱伝達管理装置 - Google Patents

複合層を有する熱伝達管理装置 Download PDF

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Publication number
JP6885664B2
JP6885664B2 JP2015147759A JP2015147759A JP6885664B2 JP 6885664 B2 JP6885664 B2 JP 6885664B2 JP 2015147759 A JP2015147759 A JP 2015147759A JP 2015147759 A JP2015147759 A JP 2015147759A JP 6885664 B2 JP6885664 B2 JP 6885664B2
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heat
heat transfer
component mount
generating component
mount
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JP2015147759A
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English (en)
Japanese (ja)
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JP2016032114A5 (enExample
JP2016032114A (ja
Inventor
メフメット ディード アーカン
メフメット ディード アーカン
壮史 野村
壮史 野村
ワン キーナン
ワン キーナン
ドナルド シュマーレンバーグ ポール
ドナルド シュマーレンバーグ ポール
Original Assignee
トヨタ モーター エンジニアリング アンド マニュファクチャリング ノース アメリカ，インコーポレイティド
トヨタ モーター エンジニアリング アンド マニュファクチャリング ノース アメリカ，インコーポレイティド
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Publication of JP2016032114A publication Critical patent/JP2016032114A/ja
Publication of JP2016032114A5 publication Critical patent/JP2016032114A5/ja
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/14—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by endowing the walls of conduits with zones of different degrees of conduction of heat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2015147759A 2014-07-25 2015-07-27 複合層を有する熱伝達管理装置 Active JP6885664B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/340,614 2014-07-25
US14/340,614 US9869520B2 (en) 2014-07-25 2014-07-25 Heat transfer management apparatuses having a composite lamina

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019200655A Division JP6856730B2 (ja) 2014-07-25 2019-11-05 複合層を有する熱伝達管理装置

Publications (3)

Publication Number Publication Date
JP2016032114A JP2016032114A (ja) 2016-03-07
JP2016032114A5 JP2016032114A5 (enExample) 2018-04-19
JP6885664B2 true JP6885664B2 (ja) 2021-06-16

Family

ID=55166482

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015147759A Active JP6885664B2 (ja) 2014-07-25 2015-07-27 複合層を有する熱伝達管理装置
JP2019200655A Active JP6856730B2 (ja) 2014-07-25 2019-11-05 複合層を有する熱伝達管理装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019200655A Active JP6856730B2 (ja) 2014-07-25 2019-11-05 複合層を有する熱伝達管理装置

Country Status (2)

Country Link
US (1) US9869520B2 (enExample)
JP (2) JP6885664B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10206310B2 (en) 2017-04-07 2019-02-12 Toyota Motor Engineering & Manufacturing North America, Inc. Electronics assemblies incorporating three-dimensional heat flow structures
US10627653B2 (en) 2017-08-28 2020-04-21 Toyota Motor Engineering & Manufacturing North America, Inc. Thermal guiding for photonic components
US12279360B2 (en) * 2022-09-27 2025-04-15 Prime World International Holdings Ltd. Optical transceiver including heat dissipation components thermally coupled to opposite sides of housing

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5074037A (en) 1989-12-01 1991-12-24 Oerlikon-Contraves Ag Process for producing electrical connections on a universal substrate
US5550750A (en) 1993-05-28 1996-08-27 Mentor Graphics Corporation Method and system for integrating component analysis with multiple component placement
US5644687A (en) 1994-12-29 1997-07-01 International Business Machines Corporation Methods and system for thermal analysis of electronic packages
US7308008B2 (en) 2002-11-08 2007-12-11 Finisar Corporation Magnetically controlled heat sink
WO2007070879A1 (en) 2005-12-17 2007-06-21 Gradient Design Automation, Inc. Simulation of ic temperature distributions using an adaptive 3d grid
JP2005223078A (ja) * 2004-02-04 2005-08-18 Murata Mfg Co Ltd 回路モジュール
US20070108595A1 (en) 2005-11-16 2007-05-17 Ati Technologies Inc. Semiconductor device with integrated heat spreader
JP4540630B2 (ja) * 2006-03-24 2010-09-08 三菱電機株式会社 高熱伝導プリント配線板
US7490309B1 (en) 2006-08-31 2009-02-10 Cadence Design Systems, Inc. Method and system for automatically optimizing physical implementation of an electronic circuit responsive to simulation analysis
JP4277036B2 (ja) * 2006-09-29 2009-06-10 Ｔｄｋ株式会社 半導体内蔵基板及びその製造方法
US20080137308A1 (en) * 2006-12-11 2008-06-12 Magna International Inc. Thermal Management system and method for semiconductor lighting systems
US20080288908A1 (en) 2007-05-15 2008-11-20 Mirror Semiconductor, Inc. Simultaneous design of integrated circuit and printed circuit board
US8021907B2 (en) * 2008-06-09 2011-09-20 Stats Chippac, Ltd. Method and apparatus for thermally enhanced semiconductor package
JP2010165728A (ja) * 2009-01-13 2010-07-29 Kyocera Corp 多層基板及び携帯通信機器
TWI377465B (en) 2010-03-11 2012-11-21 Delta Electronics Inc Heat dissipating module and electronic device using such heat dissipating module
CN102548341A (zh) 2010-12-10 2012-07-04 旭丽电子(广州)有限公司 散热壳体结构
US8601428B2 (en) 2011-12-13 2013-12-03 Qualcomm Incorporated System and method for use case-based thermal analysis of heuristically determined component combinations and layouts in a portable computing device
JP2013161812A (ja) * 2012-02-01 2013-08-19 Nec Corp 基板及び発熱部品の放熱方法
US9125299B2 (en) * 2012-12-06 2015-09-01 Apple Inc. Cooling for electronic components

Also Published As

Publication number Publication date
JP6856730B2 (ja) 2021-04-07
JP2020017770A (ja) 2020-01-30
US20160025430A1 (en) 2016-01-28
JP2016032114A (ja) 2016-03-07
US9869520B2 (en) 2018-01-16

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