JP2015537374A - 容量性結合を備えるｌｅｄパッケージ - Google Patents

容量性結合を備えるｌｅｄパッケージ Download PDF

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Publication number
JP2015537374A
JP2015537374A JP2015536271A JP2015536271A JP2015537374A JP 2015537374 A JP2015537374 A JP 2015537374A JP 2015536271 A JP2015536271 A JP 2015536271A JP 2015536271 A JP2015536271 A JP 2015536271A JP 2015537374 A JP2015537374 A JP 2015537374A
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JP
Japan
Prior art keywords
led package
led
power supply
terminal
supply terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015536271A
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English (en)
Japanese (ja)
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JP2015537374A5 (enExample
Inventor
エフベルトス レイニエル ヤコブス
エフベルトス レイニエル ヤコブス
マーク アンドレ デサムベール
マーク アンドレ デサムベール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
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Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of JP2015537374A publication Critical patent/JP2015537374A/ja
Publication of JP2015537374A5 publication Critical patent/JP2015537374A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
JP2015536271A 2012-10-15 2013-10-11 容量性結合を備えるｌｅｄパッケージ Pending JP2015537374A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261713733P 2012-10-15 2012-10-15
US61/713,733 2012-10-15
PCT/IB2013/059312 WO2014060921A1 (en) 2012-10-15 2013-10-11 Led package with capacitive couplings

Publications (2)

Publication Number Publication Date
JP2015537374A true JP2015537374A (ja) 2015-12-24
JP2015537374A5 JP2015537374A5 (enExample) 2016-12-01

Family

ID=49911751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015536271A Pending JP2015537374A (ja) 2012-10-15 2013-10-11 容量性結合を備えるｌｅｄパッケージ

Country Status (7)

Country Link
US (1) US9386640B2 (enExample)
EP (1) EP2907162A1 (enExample)
JP (1) JP2015537374A (enExample)
KR (1) KR20150066594A (enExample)
CN (1) CN104718621A (enExample)
RU (1) RU2637402C2 (enExample)
WO (1) WO2014060921A1 (enExample)

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CN104769691A (zh) 2012-11-02 2015-07-08 罗姆股份有限公司 片状电容器、电路组件以及电子设备
US9775200B2 (en) 2014-02-12 2017-09-26 Philips Lighting Holding B.V. Illumination system comprising an array of LEDs
KR102659113B1 (ko) * 2015-12-23 2024-04-23 코닌클리케 필립스 엔.브이. 해양 구조체
TR201910536T4 (tr) 2015-12-23 2019-08-21 Koninklijke Philips Nv Bir yüke güç sağlanmasına yönelik yük düzenlemesi ve elektrik gücü düzenlemesi.
AU2016375292B2 (en) 2015-12-23 2021-09-23 Koninklijke Philips N.V. Load arrangement and electrical power arrangement for powering a load
WO2019007843A1 (en) * 2017-07-04 2019-01-10 Philips Lighting Holding B.V. LIGHTING ARRANGEMENT WITH NON-GALVANIC INTERCONNECTED DEVICES
EP3599797A1 (de) * 2018-07-26 2020-01-29 Bilton International GmbH Leuchtsystem und verfahren zum betreiben eines leuchtsystems
DE102018121451B3 (de) * 2018-07-26 2020-01-30 BILTON International GmbH LED-Lichtband und Leuchtsystem
EP3599796B1 (de) * 2018-07-26 2021-02-24 Bilton International GmbH Led-lichtband und leuchtsystem
KR102838427B1 (ko) 2018-09-20 2025-07-28 코닌클리케 필립스 엔.브이. 생물오손에 대해 표면을 보호하기 위한 방법 및 시스템

Citations (3)

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JPH0638266U (ja) * 1992-10-22 1994-05-20 日本航空電子工業株式会社 表面実装用チップ発光ダイオード
JP2006504265A (ja) * 2002-10-22 2006-02-02 クリー　インコーポレイテッド Ａｃ動作用発光ダイオードアセンブリおよびその製造方法
WO2012120404A1 (en) * 2011-03-07 2012-09-13 Koninklijke Philips Electronics N.V. Electroluminescent device

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JP2004511078A (ja) * 2000-10-13 2004-04-08 フラット　ホワイト　ライティング　ピーティーワイ　リミテッド 照明システム
US6636027B1 (en) * 2000-10-24 2003-10-21 General Electric Company LED power source
US6411045B1 (en) * 2000-12-14 2002-06-25 General Electric Company Light emitting diode power supply
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EP1731003B1 (en) * 2004-02-25 2011-03-30 Michael Miskin Ac light emitting diode and ac led drive methods and apparatus
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US8004070B1 (en) 2008-04-29 2011-08-23 Wei Chen Wire-free chip module and method
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JP4557049B2 (ja) * 2008-06-09 2010-10-06 ソニー株式会社 伝送システム、給電装置、受電装置、及び伝送方法
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TWM375821U (en) * 2009-06-06 2010-03-11 Iovision Photoelectric Co Ltd LED lamp strip with replaceable power source
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KR102075991B1 (ko) * 2012-09-07 2020-02-11 삼성전자주식회사 광원장치 및 발광다이오드 패키지

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0638266U (ja) * 1992-10-22 1994-05-20 日本航空電子工業株式会社 表面実装用チップ発光ダイオード
JP2006504265A (ja) * 2002-10-22 2006-02-02 クリー　インコーポレイテッド Ａｃ動作用発光ダイオードアセンブリおよびその製造方法
WO2012120404A1 (en) * 2011-03-07 2012-09-13 Koninklijke Philips Electronics N.V. Electroluminescent device

Also Published As

Publication number Publication date
CN104718621A (zh) 2015-06-17
KR20150066594A (ko) 2015-06-16
US20150289326A1 (en) 2015-10-08
RU2637402C2 (ru) 2017-12-04
RU2015118136A (ru) 2016-12-10
US9386640B2 (en) 2016-07-05
WO2014060921A1 (en) 2014-04-24
EP2907162A1 (en) 2015-08-19

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