JP2011171320A - 発光装置及び照明装置 - Google Patents
発光装置及び照明装置 Download PDFInfo
- Publication number
- JP2011171320A JP2011171320A JP2010030806A JP2010030806A JP2011171320A JP 2011171320 A JP2011171320 A JP 2011171320A JP 2010030806 A JP2010030806 A JP 2010030806A JP 2010030806 A JP2010030806 A JP 2010030806A JP 2011171320 A JP2011171320 A JP 2011171320A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- power supply
- conductor
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 87
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000000926 separation method Methods 0.000 claims description 15
- 238000005286 illumination Methods 0.000 claims description 5
- 238000009413 insulation Methods 0.000 abstract description 25
- 230000002829 reductive effect Effects 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 43
- 239000003990 capacitor Substances 0.000 description 33
- 230000006378 damage Effects 0.000 description 13
- 230000005611 electricity Effects 0.000 description 12
- 230000003068 static effect Effects 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 8
- 230000005012 migration Effects 0.000 description 8
- 238000013508 migration Methods 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000009499 grossing Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- -1 and for example Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
【解決手段】本発明は、表面側が絶縁性を有する基板2と、この基板2の表面側に実装され、電気的に接続された複数の発光素子3と、前記基板2に配設され、複数の発光素子3に給電する正極側給電導体6及び負極側給電導体7と、これら正極側給電導体6及び負極側給電導体7から前記発光素子3の実装領域の外側に導出された導出端子部8と、この導出端子部8に接続され実装されたノイズ対応部品4とを備える発光装置1である。
【選択図】図1
Description
発光素子とは、LED等の固体発光素子である。また、発光素子の実装個数には特段制限はない。
本発明は、これら正極側給電導体及び負極側給電導体を利用してノイズ対応部品を接続することを主旨としている。
複数の同種部品とは、例えば、保護素子としてのコンデンサを複数直列に接続して実装するような場合を意味している。
このような構成により、導体間の合計の離間距離を長くすることができる。
照明装置には、光源や屋内又は屋外で使用される照明器具、ディスプレイ装置等が含まれる。
請求項2に記載の発明によれば、請求項1に記載の発明の効果に加え、マイグレーション現象による絶縁性の低下を抑制することができる。
請求項3に記載の発明によれば、請求項1又は請求項2に記載の発明の効果を奏する照明装置を提供できる。
なお、正極側給電導体6及び負極側給電導体7の他端部からは給電端子部9が略直交する方向に延出して形成されている。
続いて、照明装置20の回路構成について図4を参照して説明する。
次に、図5の参照を加えて上記照明装置20の作用を説明する。図5は、照明装置20における浮遊容量を示す概略の結線図である。
次に、本発明の第2の実施形態について図6を参照して説明する。なお、第1の実施形態と同一又は相当部分には同一符号を付し重複した説明は省略する。
以上のような導出端子部8及びノイズ対応部品4が適用される実施例を以下に説明する。
4・・・ノイズ対応部品(コンデンサ、定電圧ダイオード)、
6・・・正極側給電導体、7・・・負極側給電導体、8・・・導出端子部、
81・・・導出導体部、82・・・接続導体部、20、50・・・照明装置
Claims (3)
- 表面側が絶縁性を有する基板と;
この基板の表面側に実装され、電気的に接続された複数の発光素子と;
前記基板の表面側に配設され、複数の発光素子に給電する正極側給電導体及び負極側給電導体と;
これら正極側給電導体及び負極側給電導体から前記発光素子の実装領域の外側に導出された導出端子部と;
この導出端子部に接続され実装されたノイズ対応部品と;
を具備することを特徴とする発光装置。 - 前記ノイズ対応部品は、複数の同種部品からなり、前記導出端子部は、正極側給電導体及び負極側給電導体から連続する導出導体部と、この導出導体部の端縁間に所定の離間距離を空けて配置された少なくとも1つの接続導体部とから構成され、前記複数の同種部品は、導出導体部と接続導体部又は一の接続導体部と他の接続導体部との間に接続されていることを特徴とする請求項1に記載の発光装置。
- 装置本体と;
この装置本体に配設された請求項1又は請求項2に記載の発光装置と;
この発光装置に電力を供給する点灯装置と;
を具備することを特徴とする照明装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010030806A JP5516956B2 (ja) | 2010-02-16 | 2010-02-16 | 発光装置及び照明装置 |
CN201110038806.6A CN102163602B (zh) | 2010-02-16 | 2011-02-14 | 发光装置以及具备此发光装置的照明装置 |
US13/027,788 US8716943B2 (en) | 2010-02-16 | 2011-02-15 | Light-emitting device and lighting apparatus provided with the same |
EP11154499.5A EP2360993A3 (en) | 2010-02-16 | 2011-02-15 | Light-emitting device having noise suppressing means and lighting apparatus provided with the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010030806A JP5516956B2 (ja) | 2010-02-16 | 2010-02-16 | 発光装置及び照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011171320A true JP2011171320A (ja) | 2011-09-01 |
JP5516956B2 JP5516956B2 (ja) | 2014-06-11 |
Family
ID=44685166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010030806A Expired - Fee Related JP5516956B2 (ja) | 2010-02-16 | 2010-02-16 | 発光装置及び照明装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5516956B2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013073181A1 (ja) * | 2011-11-15 | 2013-05-23 | パナソニック株式会社 | 発光モジュールおよびこれを用いたランプ |
US9236551B2 (en) | 2012-12-04 | 2016-01-12 | Toshiba Lighting & Technology Corporation | Light emitting device and luminaire |
JP2016021358A (ja) * | 2014-06-16 | 2016-02-04 | 東芝ライテック株式会社 | ランプ装置および照明装置 |
CN110525329A (zh) * | 2019-10-12 | 2019-12-03 | 吉林大学 | 一种亮度可调节的车辆盲区警示灯及其控制方法 |
US10630033B2 (en) | 2016-06-03 | 2020-04-21 | Signify Holding B.V. | Surge protected luminaire |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101868839B1 (ko) * | 2016-07-04 | 2018-06-19 | 김선복 | Led 조명장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009164567A (ja) * | 2007-12-13 | 2009-07-23 | Panasonic Electric Works Co Ltd | 発光装置 |
-
2010
- 2010-02-16 JP JP2010030806A patent/JP5516956B2/ja not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009164567A (ja) * | 2007-12-13 | 2009-07-23 | Panasonic Electric Works Co Ltd | 発光装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013073181A1 (ja) * | 2011-11-15 | 2013-05-23 | パナソニック株式会社 | 発光モジュールおよびこれを用いたランプ |
JPWO2013073181A1 (ja) * | 2011-11-15 | 2015-04-02 | パナソニックIpマネジメント株式会社 | 発光モジュールおよびこれを用いたランプ |
US9423118B2 (en) | 2011-11-15 | 2016-08-23 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting module and lamp using same |
US9236551B2 (en) | 2012-12-04 | 2016-01-12 | Toshiba Lighting & Technology Corporation | Light emitting device and luminaire |
JP2016021358A (ja) * | 2014-06-16 | 2016-02-04 | 東芝ライテック株式会社 | ランプ装置および照明装置 |
US10630033B2 (en) | 2016-06-03 | 2020-04-21 | Signify Holding B.V. | Surge protected luminaire |
CN110525329A (zh) * | 2019-10-12 | 2019-12-03 | 吉林大学 | 一种亮度可调节的车辆盲区警示灯及其控制方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5516956B2 (ja) | 2014-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2011146353A (ja) | 照明装置 | |
US8390021B2 (en) | Semiconductor light-emitting device, light-emitting module, and illumination device | |
JP5266075B2 (ja) | 電球形照明装置 | |
JP5655302B2 (ja) | 照明装置 | |
JP5516956B2 (ja) | 発光装置及び照明装置 | |
JP2007227882A (ja) | 発光ダイオードパッケージとその製造方法 | |
JP2011071242A (ja) | 発光装置及び照明装置 | |
JP4866975B2 (ja) | Ledランプおよび照明器具 | |
US8716943B2 (en) | Light-emitting device and lighting apparatus provided with the same | |
US9338837B2 (en) | Lighting device | |
JP6206266B2 (ja) | 車両用発光モジュール、車両用照明装置、および車両用灯具 | |
EP2447596A2 (en) | Light emitting device and illumination device | |
US20120267645A1 (en) | Light emitting diode module package structure | |
JP6229871B2 (ja) | 照明装置、および車両用灯具 | |
US8633639B2 (en) | Multichip package structure and light bulb of using the same | |
JP2011096876A (ja) | 発光装置及び照明装置 | |
JP2016162816A (ja) | 発光モジュールおよび照明装置 | |
JP2012015226A (ja) | 発光装置及び照明装置 | |
JP2005294779A (ja) | Led光源 | |
JP2018530152A (ja) | 電子回路を備えるled光源 | |
JP2012134306A (ja) | 発光装置及びそれを用いた照明装置 | |
JP2010287749A (ja) | 発光体および照明器具 | |
JP5966192B2 (ja) | 照明装置、および車両用灯具 | |
CN104976526A (zh) | Led发光装置及具有该led发光装置的灯具 | |
KR101467923B1 (ko) | 전자 소자 조립체와 그 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120920 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20121106 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130625 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130702 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130902 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20131008 |
|
RD07 | Notification of extinguishment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7427 Effective date: 20140205 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140306 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140319 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 5516956 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
LAPS | Cancellation because of no payment of annual fees |