JP2015536578A5 - - Google Patents

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Publication number
JP2015536578A5
JP2015536578A5 JP2015545514A JP2015545514A JP2015536578A5 JP 2015536578 A5 JP2015536578 A5 JP 2015536578A5 JP 2015545514 A JP2015545514 A JP 2015545514A JP 2015545514 A JP2015545514 A JP 2015545514A JP 2015536578 A5 JP2015536578 A5 JP 2015536578A5
Authority
JP
Japan
Prior art keywords
circuit board
cover
primary
primary cover
casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015545514A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015536578A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2013/072869 external-priority patent/WO2014089076A2/en
Publication of JP2015536578A publication Critical patent/JP2015536578A/ja
Publication of JP2015536578A5 publication Critical patent/JP2015536578A5/ja
Pending legal-status Critical Current

Links

JP2015545514A 2012-12-03 2013-12-03 通過気流冷却技術および通過気流回路基板モジュール Pending JP2015536578A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261732794P 2012-12-03 2012-12-03
US61/732,794 2012-12-03
PCT/US2013/072869 WO2014089076A2 (en) 2012-12-03 2013-12-03 Air-flow-by cooling technology and air-flow-by circuit board modules

Publications (2)

Publication Number Publication Date
JP2015536578A JP2015536578A (ja) 2015-12-21
JP2015536578A5 true JP2015536578A5 (enExample) 2017-01-26

Family

ID=49918812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015545514A Pending JP2015536578A (ja) 2012-12-03 2013-12-03 通過気流冷却技術および通過気流回路基板モジュール

Country Status (6)

Country Link
US (1) US9389654B2 (enExample)
EP (1) EP2926636B1 (enExample)
JP (1) JP2015536578A (enExample)
AU (1) AU2013356269B2 (enExample)
CA (1) CA2893488C (enExample)
WO (1) WO2014089076A2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102512004B1 (ko) * 2018-02-01 2023-03-21 한온시스템 주식회사 전장부품 냉각기 및 그 제조 방법
CN111954438A (zh) * 2020-07-17 2020-11-17 中国航空无线电电子研究所 穿透式强迫风冷模块
CN120770205A (zh) * 2023-03-07 2025-10-10 瑞典爱立信有限公司 用于电子设备的冷却布置
CN119212362A (zh) * 2024-11-14 2024-12-27 南通红松科技有限公司 一种电子信息抗干扰设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2173349B (en) * 1985-03-29 1988-12-07 Gec Avionics Electric circuit module arrangement
US4771365A (en) * 1987-10-30 1988-09-13 Honeywell Inc. Passive cooled electronic chassis
JPH05198961A (ja) * 1992-01-22 1993-08-06 Matsushita Electric Works Ltd カード型モジュール基板用アダプター
JP2000278202A (ja) * 1999-03-23 2000-10-06 Kokusai Electric Co Ltd 基地局用無線ユニット
JP3905317B2 (ja) 2000-11-22 2007-04-18 富士通株式会社 通信装置
US6697255B1 (en) 2002-02-14 2004-02-24 Mercury Computer Systems, Inc. Circuit board assembly with integrated shaping and control of flow resistance curve
US6690575B1 (en) 2002-02-14 2004-02-10 Mercury Computer Systems, Inc. Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies
US6661657B1 (en) 2002-02-14 2003-12-09 Mercury Computer Systems, Inc. Circuit board assembly for use in a central inlet chassis configuration
US6781831B1 (en) 2002-02-14 2004-08-24 Mercury Computer Systems, Inc. Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers
US6759588B1 (en) 2002-02-14 2004-07-06 Mercury Computer Systems, Inc. Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover
US6879486B1 (en) 2002-02-14 2005-04-12 Mercury Computer Systems, Inc. Central inlet circuit board assembly
US6683787B1 (en) 2002-02-14 2004-01-27 Mercury Computer Systems, Inc. Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks
JP4042520B2 (ja) * 2002-10-15 2008-02-06 日本電気株式会社 通信機器の実装構造とその放熱方法
US7365974B2 (en) 2005-10-14 2008-04-29 Smiths Aerospace Llc Method for electronics equipment cooling having improved EMI control and reduced weight
FR2894428B1 (fr) * 2005-12-07 2008-02-29 Thales Sa Boitier d'appareillage electronique rigide et leger
US8009435B2 (en) * 2007-11-12 2011-08-30 Lockheed Martin Corp. Card level enclosure system having enhanced thermal transfer and improved EMI characteristics
US20100097767A1 (en) * 2008-10-18 2010-04-22 John David Jude Machine for passively removing heat generated by an electronic circuit board

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