AU2013356269B2 - Air-flow-by cooling technology and air-flow-by circuit board modules - Google Patents

Air-flow-by cooling technology and air-flow-by circuit board modules Download PDF

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Publication number
AU2013356269B2
AU2013356269B2 AU2013356269A AU2013356269A AU2013356269B2 AU 2013356269 B2 AU2013356269 B2 AU 2013356269B2 AU 2013356269 A AU2013356269 A AU 2013356269A AU 2013356269 A AU2013356269 A AU 2013356269A AU 2013356269 B2 AU2013356269 B2 AU 2013356269B2
Authority
AU
Australia
Prior art keywords
cover
circuit board
fins
module
channels
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
AU2013356269A
Other languages
English (en)
Other versions
AU2013356269A1 (en
Inventor
Donald BLANCHET
Daniel COOLIDGE
Darryl J. Mckenney
Paul ZUIDEMA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mercury Systems Inc
Original Assignee
Mercury Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mercury Systems Inc filed Critical Mercury Systems Inc
Publication of AU2013356269A1 publication Critical patent/AU2013356269A1/en
Assigned to MERCURY SYSTEMS, INC. reassignment MERCURY SYSTEMS, INC. Alteration of Name(s) of Applicant(s) under S113 Assignors: MERCURY COMPUTER SYSTEMS, INC.
Application granted granted Critical
Publication of AU2013356269B2 publication Critical patent/AU2013356269B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1452—Mounting of connectors; Switching; Reinforcing of back panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
AU2013356269A 2012-12-03 2013-12-03 Air-flow-by cooling technology and air-flow-by circuit board modules Active AU2013356269B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261732794P 2012-12-03 2012-12-03
US61/732,794 2012-12-03
PCT/US2013/072869 WO2014089076A2 (en) 2012-12-03 2013-12-03 Air-flow-by cooling technology and air-flow-by circuit board modules

Publications (2)

Publication Number Publication Date
AU2013356269A1 AU2013356269A1 (en) 2015-07-16
AU2013356269B2 true AU2013356269B2 (en) 2017-11-23

Family

ID=49918812

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2013356269A Active AU2013356269B2 (en) 2012-12-03 2013-12-03 Air-flow-by cooling technology and air-flow-by circuit board modules

Country Status (6)

Country Link
US (1) US9389654B2 (enExample)
EP (1) EP2926636B1 (enExample)
JP (1) JP2015536578A (enExample)
AU (1) AU2013356269B2 (enExample)
CA (1) CA2893488C (enExample)
WO (1) WO2014089076A2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102512004B1 (ko) * 2018-02-01 2023-03-21 한온시스템 주식회사 전장부품 냉각기 및 그 제조 방법
CN111954438A (zh) * 2020-07-17 2020-11-17 中国航空无线电电子研究所 穿透式强迫风冷模块
CN120770205A (zh) * 2023-03-07 2025-10-10 瑞典爱立信有限公司 用于电子设备的冷却布置
CN119212362A (zh) * 2024-11-14 2024-12-27 南通红松科技有限公司 一种电子信息抗干扰设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692840A (en) * 1985-03-29 1987-09-08 Gec Avionics Limited Electric circuit module arrangements
US8009435B2 (en) * 2007-11-12 2011-08-30 Lockheed Martin Corp. Card level enclosure system having enhanced thermal transfer and improved EMI characteristics

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4771365A (en) * 1987-10-30 1988-09-13 Honeywell Inc. Passive cooled electronic chassis
JPH05198961A (ja) * 1992-01-22 1993-08-06 Matsushita Electric Works Ltd カード型モジュール基板用アダプター
JP2000278202A (ja) * 1999-03-23 2000-10-06 Kokusai Electric Co Ltd 基地局用無線ユニット
JP3905317B2 (ja) 2000-11-22 2007-04-18 富士通株式会社 通信装置
US6697255B1 (en) 2002-02-14 2004-02-24 Mercury Computer Systems, Inc. Circuit board assembly with integrated shaping and control of flow resistance curve
US6690575B1 (en) 2002-02-14 2004-02-10 Mercury Computer Systems, Inc. Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies
US6661657B1 (en) 2002-02-14 2003-12-09 Mercury Computer Systems, Inc. Circuit board assembly for use in a central inlet chassis configuration
US6781831B1 (en) 2002-02-14 2004-08-24 Mercury Computer Systems, Inc. Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers
US6759588B1 (en) 2002-02-14 2004-07-06 Mercury Computer Systems, Inc. Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover
US6879486B1 (en) 2002-02-14 2005-04-12 Mercury Computer Systems, Inc. Central inlet circuit board assembly
US6683787B1 (en) 2002-02-14 2004-01-27 Mercury Computer Systems, Inc. Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks
JP4042520B2 (ja) * 2002-10-15 2008-02-06 日本電気株式会社 通信機器の実装構造とその放熱方法
US7365974B2 (en) 2005-10-14 2008-04-29 Smiths Aerospace Llc Method for electronics equipment cooling having improved EMI control and reduced weight
FR2894428B1 (fr) * 2005-12-07 2008-02-29 Thales Sa Boitier d'appareillage electronique rigide et leger
US20100097767A1 (en) * 2008-10-18 2010-04-22 John David Jude Machine for passively removing heat generated by an electronic circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692840A (en) * 1985-03-29 1987-09-08 Gec Avionics Limited Electric circuit module arrangements
US8009435B2 (en) * 2007-11-12 2011-08-30 Lockheed Martin Corp. Card level enclosure system having enhanced thermal transfer and improved EMI characteristics

Also Published As

Publication number Publication date
WO2014089076A3 (en) 2014-10-30
EP2926636A2 (en) 2015-10-07
JP2015536578A (ja) 2015-12-21
CA2893488A1 (en) 2014-06-12
CA2893488C (en) 2021-02-16
US20140160670A1 (en) 2014-06-12
WO2014089076A2 (en) 2014-06-12
AU2013356269A1 (en) 2015-07-16
US9389654B2 (en) 2016-07-12
EP2926636B1 (en) 2021-06-02

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