JP2015536578A - 通過気流冷却技術および通過気流回路基板モジュール - Google Patents

通過気流冷却技術および通過気流回路基板モジュール Download PDF

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Publication number
JP2015536578A
JP2015536578A JP2015545514A JP2015545514A JP2015536578A JP 2015536578 A JP2015536578 A JP 2015536578A JP 2015545514 A JP2015545514 A JP 2015545514A JP 2015545514 A JP2015545514 A JP 2015545514A JP 2015536578 A JP2015536578 A JP 2015536578A
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JP
Japan
Prior art keywords
circuit board
cover
module
backplane
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015545514A
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English (en)
Japanese (ja)
Other versions
JP2015536578A5 (enExample
Inventor
ダリル ジェイ． マッキニー，
ダリル ジェイ． マッキニー，
ポール ズイデマ，
ポール ズイデマ，
ドナルド ブランシェ，
ドナルド ブランシェ，
ダニエル クーリッジ，
ダニエル クーリッジ，
Original Assignee
マーキュリー コンピューター システムズ， インコーポレイテッド
マーキュリー コンピューター システムズ， インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by マーキュリー コンピューター システムズ， インコーポレイテッド, マーキュリー コンピューター システムズ， インコーポレイテッド filed Critical マーキュリー コンピューター システムズ， インコーポレイテッド
Publication of JP2015536578A publication Critical patent/JP2015536578A/ja
Publication of JP2015536578A5 publication Critical patent/JP2015536578A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1452—Mounting of connectors; Switching; Reinforcing of back panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2015545514A 2012-12-03 2013-12-03 通過気流冷却技術および通過気流回路基板モジュール Pending JP2015536578A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261732794P 2012-12-03 2012-12-03
US61/732,794 2012-12-03
PCT/US2013/072869 WO2014089076A2 (en) 2012-12-03 2013-12-03 Air-flow-by cooling technology and air-flow-by circuit board modules

Publications (2)

Publication Number Publication Date
JP2015536578A true JP2015536578A (ja) 2015-12-21
JP2015536578A5 JP2015536578A5 (enExample) 2017-01-26

Family

ID=49918812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015545514A Pending JP2015536578A (ja) 2012-12-03 2013-12-03 通過気流冷却技術および通過気流回路基板モジュール

Country Status (6)

Country Link
US (1) US9389654B2 (enExample)
EP (1) EP2926636B1 (enExample)
JP (1) JP2015536578A (enExample)
AU (1) AU2013356269B2 (enExample)
CA (1) CA2893488C (enExample)
WO (1) WO2014089076A2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102512004B1 (ko) * 2018-02-01 2023-03-21 한온시스템 주식회사 전장부품 냉각기 및 그 제조 방법
CN111954438A (zh) * 2020-07-17 2020-11-17 中国航空无线电电子研究所 穿透式强迫风冷模块
CN120770205A (zh) * 2023-03-07 2025-10-10 瑞典爱立信有限公司 用于电子设备的冷却布置
CN119212362A (zh) * 2024-11-14 2024-12-27 南通红松科技有限公司 一种电子信息抗干扰设备

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4771365A (en) * 1987-10-30 1988-09-13 Honeywell Inc. Passive cooled electronic chassis
JPH05198961A (ja) * 1992-01-22 1993-08-06 Matsushita Electric Works Ltd カード型モジュール基板用アダプター
JP2000278202A (ja) * 1999-03-23 2000-10-06 Kokusai Electric Co Ltd 基地局用無線ユニット
JP2002223087A (ja) * 2000-11-22 2002-08-09 Fujitsu Ltd 通信装置及びプラグインユニット
JP2004140015A (ja) * 2002-10-15 2004-05-13 Nec Corp 通信機器の実装構造とその放熱方法
JP2009511350A (ja) * 2005-10-14 2009-03-19 ジーイー・アビエイション・システムズ・エルエルシー 改良型ｅｍｉ制御および少ない重量を有する電子機器冷却方法
US20100097767A1 (en) * 2008-10-18 2010-04-22 John David Jude Machine for passively removing heat generated by an electronic circuit board
US8009435B2 (en) * 2007-11-12 2011-08-30 Lockheed Martin Corp. Card level enclosure system having enhanced thermal transfer and improved EMI characteristics

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2173349B (en) * 1985-03-29 1988-12-07 Gec Avionics Electric circuit module arrangement
US6697255B1 (en) 2002-02-14 2004-02-24 Mercury Computer Systems, Inc. Circuit board assembly with integrated shaping and control of flow resistance curve
US6690575B1 (en) 2002-02-14 2004-02-10 Mercury Computer Systems, Inc. Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies
US6661657B1 (en) 2002-02-14 2003-12-09 Mercury Computer Systems, Inc. Circuit board assembly for use in a central inlet chassis configuration
US6781831B1 (en) 2002-02-14 2004-08-24 Mercury Computer Systems, Inc. Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers
US6759588B1 (en) 2002-02-14 2004-07-06 Mercury Computer Systems, Inc. Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover
US6879486B1 (en) 2002-02-14 2005-04-12 Mercury Computer Systems, Inc. Central inlet circuit board assembly
US6683787B1 (en) 2002-02-14 2004-01-27 Mercury Computer Systems, Inc. Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks
FR2894428B1 (fr) * 2005-12-07 2008-02-29 Thales Sa Boitier d'appareillage electronique rigide et leger

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4771365A (en) * 1987-10-30 1988-09-13 Honeywell Inc. Passive cooled electronic chassis
JPH05198961A (ja) * 1992-01-22 1993-08-06 Matsushita Electric Works Ltd カード型モジュール基板用アダプター
JP2000278202A (ja) * 1999-03-23 2000-10-06 Kokusai Electric Co Ltd 基地局用無線ユニット
JP2002223087A (ja) * 2000-11-22 2002-08-09 Fujitsu Ltd 通信装置及びプラグインユニット
JP2004140015A (ja) * 2002-10-15 2004-05-13 Nec Corp 通信機器の実装構造とその放熱方法
JP2009511350A (ja) * 2005-10-14 2009-03-19 ジーイー・アビエイション・システムズ・エルエルシー 改良型ｅｍｉ制御および少ない重量を有する電子機器冷却方法
US8009435B2 (en) * 2007-11-12 2011-08-30 Lockheed Martin Corp. Card level enclosure system having enhanced thermal transfer and improved EMI characteristics
US20100097767A1 (en) * 2008-10-18 2010-04-22 John David Jude Machine for passively removing heat generated by an electronic circuit board

Also Published As

Publication number Publication date
WO2014089076A3 (en) 2014-10-30
EP2926636A2 (en) 2015-10-07
CA2893488A1 (en) 2014-06-12
CA2893488C (en) 2021-02-16
US20140160670A1 (en) 2014-06-12
AU2013356269B2 (en) 2017-11-23
WO2014089076A2 (en) 2014-06-12
AU2013356269A1 (en) 2015-07-16
US9389654B2 (en) 2016-07-12
EP2926636B1 (en) 2021-06-02

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