JP2015534281A - 発光ダイオード組立体、モジュール及び発光ダイオード組立体の製造方法 - Google Patents
発光ダイオード組立体、モジュール及び発光ダイオード組立体の製造方法 Download PDFInfo
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- JP2015534281A JP2015534281A JP2015538356A JP2015538356A JP2015534281A JP 2015534281 A JP2015534281 A JP 2015534281A JP 2015538356 A JP2015538356 A JP 2015538356A JP 2015538356 A JP2015538356 A JP 2015538356A JP 2015534281 A JP2015534281 A JP 2015534281A
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- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 230000000712 assembly Effects 0.000 claims abstract description 4
- 238000000429 assembly Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 40
- 238000009966 trimming Methods 0.000 claims description 5
- 239000010408 film Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 239000011368 organic material Substances 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000009429 electrical wiring Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Laminated Bodies (AREA)
Abstract
Description
2 発光ダイオード
3 ESD保護デバイス
4 第1の接続端子
5 第2の接続端子
6 分離線
7 第1の接点
8 第2の接点
9 第1の配線
10 第2の配線
11 第3の配線
12 第1の配線の破断
13 第2の配線の破断
14 第3の配線の破断
15 基板
16 最上層
17 更なる層
18 ビア
19 接続部
20 接続部
21 上面
22 下面
RC コーディング抵抗
R1 第1の抵抗
R2 第2の抵抗
R3 第3の抵抗
Claims (15)
- 発光ダイオード(2)と、当該発光ダイオード(2)のコーディングのためのコーディング抵抗(RC)とを備える発光ダイオード組立体であって、
当該コーディング抵抗(RC)は、スター結線の複数の抵抗(R1,R2,R3)として形成されていることを特徴とする発光ダイオード組立体。 - 前記コーディング抵抗(RC)は、薄膜抵抗または厚膜抵抗として形成された少なくとも1つの抵抗(R1,R2,R3)を備えることを特徴とする、請求項1に記載の発光ダイオード組立体。
- 請求項1または2に記載の発光ダイオード組立体において、
基板(15)を備え、
前記コーディング抵抗(RC)は、当該基板(15)に埋め込まれた少なくとも1つの抵抗(R1,R2,R3)を備えることを特徴とする発光ダイオード組立体。 - 請求項1乃至3のいずれか1項に記載の発光ダイオード組立体において、
基板(15)を備え、
前記コーディング抵抗(RC)は、当該基板(15)の外面上に配設された少なくとも1つの抵抗(R1,R2,R3)を備えることを特徴とする発光ダイオード組立体。 - 請求項1乃至4のいずれか1項に記載の発光ダイオード組立体において、
前記コーディング抵抗(RC)は、少なくとも1つの配線(12,13,14)を備え、前記コーディングは、当該配線(12,13,14)の破断の実施ないし不実施により行われていることを特徴とする発光ダイオード組立体。 - 請求項1乃至5のいずれか1項に記載の発光ダイオード組立体において、
前記コーディング抵抗(RC)は、コーディングのためにトリミングされた少なくとも1つの抵抗(R1,R2,R3)を備えることを特徴とする発光ダイオード組立体。 - 請求項1乃至6のいずれか1項に記載の発光ダイオード組立体において、
前記コーディング抵抗(RC)は、前記LED(2)の温度測定用に形成された少なくとも1つの抵抗(R1,R2,R3)を備えることを特徴とする発光ダイオード組立体。 - 請求項1乃至7のいずれか1項に記載の発光ダイオード組立体において、
セラミック材料または有機材料を含む基板(15)を備えることを特徴とする発光ダイオード組立体。 - 多層構造に形成された基板(15)を備えることを特徴とする、請求項1乃至8のいずれか1項に記載の発光ダイオード組立体。
- 複数の請求項1乃至9のいずれか1項に記載の発光ダイオード組立体(1)がもう1つの基板上に配設されているモジュール。
- 発光ダイオード組立体(1)の製造方法であって、
A)発光ダイオード(2)を準備するステップと、
B)前記発光ダイオード(2)のコーディングのためのコーディング抵抗(RC)であって、スター結線の複数の抵抗(R1,R2,R3)として形成されたコーディング抵抗(RC)を準備するステップと、
C)前記発光ダイオード(2)の特性を検出するステップと、
D)検出された前記特性に依存して前記コーディング抵抗(RC)をコーディングするステップと、
を備えることを特徴とする方法。 - 前記発光ダイオード(2)は、前記ステップD)の前に基板(15)に配設されることを特徴とする、請求項11に記載の方法。
- 前記基板(15)は、前記コーディング抵抗(RC)を備えることを特徴とする、請求項12に記載の方法。
- 前記コーディング抵抗(RC)が少なくとも1つの配線(12,13,14)を備え、前記コーディングは、当該配線(12,13,14)の破断の実施ないし不実施により行われることを特徴とする、請求項11乃至13のいずれか1項に記載の方法。
- 前記コーディングは、前記コーディング抵抗(RC)のトリミングによって行われることを特徴とする、請求項11乃至14のいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012110397.6A DE102012110397A1 (de) | 2012-10-30 | 2012-10-30 | Leuchtdiodenanordnung, Modul und Verfahren zur Herstellung einer Leuchtdiodenanordnung |
DE102012110397.6 | 2012-10-30 | ||
PCT/EP2013/069944 WO2014067717A1 (de) | 2012-10-30 | 2013-09-25 | Leuchtdiodenanodrnung, modul und verfahren zur herstellung einer leuchtdiodenanordnung |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018048892A Division JP2018139289A (ja) | 2012-10-30 | 2018-03-16 | 発光ダイオード組立体、モジュール及び発光ダイオード組立体の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2015534281A true JP2015534281A (ja) | 2015-11-26 |
JP6310468B2 JP6310468B2 (ja) | 2018-04-11 |
Family
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2015538356A Active JP6310468B2 (ja) | 2012-10-30 | 2013-09-25 | 発光ダイオード組立体、モジュール及び発光ダイオード組立体の製造方法 |
JP2018048892A Pending JP2018139289A (ja) | 2012-10-30 | 2018-03-16 | 発光ダイオード組立体、モジュール及び発光ダイオード組立体の製造方法 |
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JP2018048892A Pending JP2018139289A (ja) | 2012-10-30 | 2018-03-16 | 発光ダイオード組立体、モジュール及び発光ダイオード組立体の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9287247B2 (ja) |
EP (1) | EP2915192B8 (ja) |
JP (2) | JP6310468B2 (ja) |
DE (1) | DE102012110397A1 (ja) |
WO (1) | WO2014067717A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190080460A (ko) * | 2017-12-28 | 2019-07-08 | 에스엘 주식회사 | 차량용 램프 led 구동장치 |
Families Citing this family (4)
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FR3026600A1 (fr) * | 2014-09-29 | 2016-04-01 | Valeo Vision | Carte de circuit imprime a led |
DE102015117317A1 (de) * | 2015-10-12 | 2017-04-27 | Hella Kgaa Hueck & Co. | Scheinwerfer mit Diebstahlschutz, Fahrzeug mit Scheinwerfer und Verfahren zur Aktivierung einer Diebstahlschutzfunktion |
DE102016220198B3 (de) * | 2016-10-17 | 2018-02-15 | Continental Automotive Gmbh | Verfahren zum Regeln eines Betriebsstroms einer Leuchteinheit sowie Steuergerät und Kraftfahrzeug |
EP3448132A1 (en) * | 2017-08-22 | 2019-02-27 | Vestel Elektronik Sanayi ve Ticaret A.S. | Printed circuit board and method of manufacture |
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2012
- 2012-10-30 DE DE102012110397.6A patent/DE102012110397A1/de not_active Withdrawn
-
2013
- 2013-09-25 US US14/437,785 patent/US9287247B2/en active Active
- 2013-09-25 EP EP13770878.0A patent/EP2915192B8/de active Active
- 2013-09-25 WO PCT/EP2013/069944 patent/WO2014067717A1/de active Application Filing
- 2013-09-25 JP JP2015538356A patent/JP6310468B2/ja active Active
-
2018
- 2018-03-16 JP JP2018048892A patent/JP2018139289A/ja active Pending
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DE102009051866A1 (de) * | 2009-11-04 | 2011-05-05 | Automotive Lighting Reutlingen Gmbh | Verfahren zum Herstellen einer Lichtquellenanordnung und Lichtquellenanordnung |
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KR20190080460A (ko) * | 2017-12-28 | 2019-07-08 | 에스엘 주식회사 | 차량용 램프 led 구동장치 |
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Also Published As
Publication number | Publication date |
---|---|
JP2018139289A (ja) | 2018-09-06 |
DE102012110397A1 (de) | 2014-04-30 |
US9287247B2 (en) | 2016-03-15 |
EP2915192B1 (de) | 2022-08-24 |
JP6310468B2 (ja) | 2018-04-11 |
EP2915192B8 (de) | 2022-11-16 |
EP2915192A1 (de) | 2015-09-09 |
WO2014067717A1 (de) | 2014-05-08 |
US20150287703A1 (en) | 2015-10-08 |
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