JP2015517923A - ケミカルメカニカル平坦化前バフ研磨モジュールのための方法及び装置 - Google Patents

ケミカルメカニカル平坦化前バフ研磨モジュールのための方法及び装置 Download PDF

Info

Publication number
JP2015517923A
JP2015517923A JP2015509019A JP2015509019A JP2015517923A JP 2015517923 A JP2015517923 A JP 2015517923A JP 2015509019 A JP2015509019 A JP 2015509019A JP 2015509019 A JP2015509019 A JP 2015509019A JP 2015517923 A JP2015517923 A JP 2015517923A
Authority
JP
Japan
Prior art keywords
substrate
polishing pad
pad assembly
rotating
motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015509019A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015517923A5 (enExample
Inventor
フイ チェン，
フイ チェン，
フン チェン，
フン チェン，
ジム アトキンソン，
ジム アトキンソン，
アレン エル． ダンブラ，
アレン エル． ダンブラ，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2015517923A publication Critical patent/JP2015517923A/ja
Publication of JP2015517923A5 publication Critical patent/JP2015517923A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2015509019A 2012-04-28 2013-04-16 ケミカルメカニカル平坦化前バフ研磨モジュールのための方法及び装置 Pending JP2015517923A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/459,177 US8968055B2 (en) 2012-04-28 2012-04-28 Methods and apparatus for pre-chemical mechanical planarization buffing module
US13/459,177 2012-04-28
PCT/US2013/036764 WO2013162950A1 (en) 2012-04-28 2013-04-16 Methods and apparatus for pre-chemical mechanical planarization of buffing module

Publications (2)

Publication Number Publication Date
JP2015517923A true JP2015517923A (ja) 2015-06-25
JP2015517923A5 JP2015517923A5 (enExample) 2016-06-16

Family

ID=49477715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015509019A Pending JP2015517923A (ja) 2012-04-28 2013-04-16 ケミカルメカニカル平坦化前バフ研磨モジュールのための方法及び装置

Country Status (6)

Country Link
US (1) US8968055B2 (enExample)
JP (1) JP2015517923A (enExample)
KR (1) KR102128393B1 (enExample)
CN (1) CN104303272B (enExample)
TW (1) TWI573660B (enExample)
WO (1) WO2013162950A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017087399A (ja) * 2015-11-17 2017-05-25 株式会社荏原製作所 バフ処理装置および基板処理装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMO20130231A1 (it) * 2013-08-06 2015-02-07 Cms Spa Attrezzatura per tenere un pezzo
KR102666494B1 (ko) * 2016-03-25 2024-05-17 어플라이드 머티어리얼스, 인코포레이티드 국부 영역 연마 시스템 및 연마 시스템용 연마 패드 조립체들
CN109075054B (zh) * 2016-03-25 2023-06-09 应用材料公司 具有局部区域速率控制及振荡模式的研磨系统
CN107520717A (zh) * 2017-08-11 2017-12-29 王臻 一种风能发电叶片用打磨装置
CN109702625A (zh) * 2018-12-28 2019-05-03 天津洙诺科技有限公司 一种硅片单面抛光装置及其方法
CN110977680B (zh) * 2019-12-24 2021-04-16 丹阳广丰光学器材有限公司 一种光学镜片加工用抛光装置
US20210323117A1 (en) 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
US12224186B2 (en) 2023-04-03 2025-02-11 Applied Materials, Inc. Apparatus and method of brush cleaning using periodic chemical treatments

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09168968A (ja) * 1995-10-27 1997-06-30 Applied Materials Inc ケミカルメカニカルポリシング装置のキャリアヘッドのデザイン
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5762544A (en) * 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
JPH11291166A (ja) * 1998-04-07 1999-10-26 Nikon Corp 研磨装置及び研磨方法
US6416616B1 (en) * 1999-04-02 2002-07-09 Micron Technology, Inc. Apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
US20020132561A1 (en) * 2001-03-19 2002-09-19 Speedfam-Ipec Corporation Low amplitude, high speed polisher and method
JP2004507097A (ja) * 2000-08-22 2004-03-04 ラム　リサーチ　コーポレーション ウエハと逆方向に回転する振動研磨パッドを備えたｃｍｐ装置
JP2004148479A (ja) * 2002-11-01 2004-05-27 Fuji Seiki Seisakusho:Kk 研磨装置
WO2005016595A1 (ja) * 2003-08-19 2005-02-24 Nikon Corporation 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
US20060003677A1 (en) * 2004-07-01 2006-01-05 Moo-Yong Park Polishing pad and chemical mechanical polishing apparatus comprising the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804507A (en) 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
JPH10329011A (ja) * 1997-03-21 1998-12-15 Canon Inc 精密研磨装置及び方法
US6095905A (en) * 1998-07-01 2000-08-01 Molecular Optoelectronics Corporation Polishing fixture and method
JP2001044157A (ja) 1999-07-16 2001-02-16 Promos Technol Inc 化学機械研磨終点を検出する方法と装置
US6435941B1 (en) 2000-05-12 2002-08-20 Appllied Materials, Inc. Apparatus and method for chemical mechanical planarization
JP2002100593A (ja) * 2000-09-21 2002-04-05 Nikon Corp 研磨装置、これを用いた半導体デバイスの製造方法及びこの製造方法により製造された半導体デバイス
US8524035B2 (en) * 2009-11-30 2013-09-03 Corning Incorporated Method and apparatus for conformable polishing

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09168968A (ja) * 1995-10-27 1997-06-30 Applied Materials Inc ケミカルメカニカルポリシング装置のキャリアヘッドのデザイン
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5762544A (en) * 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
JPH11291166A (ja) * 1998-04-07 1999-10-26 Nikon Corp 研磨装置及び研磨方法
US6416616B1 (en) * 1999-04-02 2002-07-09 Micron Technology, Inc. Apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
JP2004507097A (ja) * 2000-08-22 2004-03-04 ラム　リサーチ　コーポレーション ウエハと逆方向に回転する振動研磨パッドを備えたｃｍｐ装置
US20020132561A1 (en) * 2001-03-19 2002-09-19 Speedfam-Ipec Corporation Low amplitude, high speed polisher and method
JP2004148479A (ja) * 2002-11-01 2004-05-27 Fuji Seiki Seisakusho:Kk 研磨装置
WO2005016595A1 (ja) * 2003-08-19 2005-02-24 Nikon Corporation 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
US20060003677A1 (en) * 2004-07-01 2006-01-05 Moo-Yong Park Polishing pad and chemical mechanical polishing apparatus comprising the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017087399A (ja) * 2015-11-17 2017-05-25 株式会社荏原製作所 バフ処理装置および基板処理装置
WO2017086055A1 (ja) * 2015-11-17 2017-05-26 株式会社荏原製作所 バフ処理装置および基板処理装置
KR20180083856A (ko) * 2015-11-17 2018-07-23 가부시키가이샤 에바라 세이사꾸쇼 버프 처리 장치 및 기판 처리 장치
US11103972B2 (en) 2015-11-17 2021-08-31 Ebara Corporation Buff processing device and substrate processing device
KR102307209B1 (ko) 2015-11-17 2021-10-01 가부시키가이샤 에바라 세이사꾸쇼 버프 처리 장치 및 기판 처리 장치

Also Published As

Publication number Publication date
KR20150005680A (ko) 2015-01-14
US8968055B2 (en) 2015-03-03
CN104303272B (zh) 2017-06-16
WO2013162950A1 (en) 2013-10-31
KR102128393B1 (ko) 2020-06-30
TWI573660B (zh) 2017-03-11
CN104303272A (zh) 2015-01-21
TW201402273A (zh) 2014-01-16
US20130288578A1 (en) 2013-10-31

Similar Documents

Publication Publication Date Title
JP2015517923A (ja) ケミカルメカニカル平坦化前バフ研磨モジュールのための方法及び装置
KR102263992B1 (ko) 기판 처리 장치 및 처리 방법
TWI441250B (zh) 半導體基板之平坦化加工裝置及平坦化加工方法
US10256120B2 (en) Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning
CN116872088A (zh) 化学机械研磨机中的耗材部件监控
JP2004066450A (ja) 化学的機械研磨およびパッドドレッシング方法
CN102962763B (zh) 磨粒埋入装置、抛光装置和抛光方法
JP2011224680A (ja) 研磨方法及び研磨装置
JP2016043471A (ja) 基板処理装置
CN106233432B (zh) 用于化学机械平面化后的基板清洁的系统、方法及设备
TW201618177A (zh) ＳｉＣ基板之硏磨方法
KR101658250B1 (ko) 기판 이면 연마 장치, 기판 이면 연마 시스템 및 기판 이면 연마 방법 및 기판 이면 연마 프로그램을 기록한 기록 매체
JP5433968B2 (ja) 保持装置、研磨装置および保持方法
JPH1126404A (ja) 研磨装置
WO2022149346A1 (ja) 基板処理装置および基板処理方法
JPWO2013118578A1 (ja) 研磨パッド及び研磨装置
JP2001150311A (ja) 薄肉円盤の円周加工方法および加工装置
JP2006351618A (ja) 半導体基板研磨装置および半導体基板研磨方法
JP2006062023A (ja) 研磨方法および研磨装置
JP2016043472A (ja) 基板処理装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160414

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160414

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170228

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20171003