JP2015514864A - 基板にLiPON層を析出させる方法 - Google Patents
基板にLiPON層を析出させる方法 Download PDFInfo
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- JP2015514864A JP2015514864A JP2014559130A JP2014559130A JP2015514864A JP 2015514864 A JP2015514864 A JP 2015514864A JP 2014559130 A JP2014559130 A JP 2014559130A JP 2014559130 A JP2014559130 A JP 2014559130A JP 2015514864 A JP2015514864 A JP 2015514864A
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000000758 substrate Substances 0.000 title claims abstract description 21
- 229910012305 LiPON Inorganic materials 0.000 title claims abstract description 17
- 238000000151 deposition Methods 0.000 title claims abstract description 11
- 238000001704 evaporation Methods 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 26
- 230000008020 evaporation Effects 0.000 claims abstract description 22
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims abstract description 16
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 6
- 239000001301 oxygen Substances 0.000 claims abstract description 6
- 230000008021 deposition Effects 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 claims abstract description 5
- 230000000630 rising effect Effects 0.000 claims abstract description 5
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims abstract description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052729 chemical element Inorganic materials 0.000 claims abstract description 4
- 229910052744 lithium Inorganic materials 0.000 claims abstract description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 4
- 239000011574 phosphorus Substances 0.000 claims abstract description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 13
- 239000007789 gas Substances 0.000 claims description 12
- 230000005855 radiation Effects 0.000 claims description 11
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- 238000010891 electric arc Methods 0.000 claims description 3
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims 2
- 229910012258 LiPO Inorganic materials 0.000 claims 1
- 235000013842 nitrous oxide Nutrition 0.000 claims 1
- 238000002207 thermal evaporation Methods 0.000 abstract description 4
- 210000002381 plasma Anatomy 0.000 description 15
- 238000010894 electron beam technology Methods 0.000 description 11
- 229910001386 lithium phosphate Inorganic materials 0.000 description 7
- TWQULNDIKKJZPH-UHFFFAOYSA-K trilithium;phosphate Chemical compound [Li+].[Li+].[Li+].[O-]P([O-])([O-])=O TWQULNDIKKJZPH-UHFFFAOYSA-K 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000001552 radio frequency sputter deposition Methods 0.000 description 2
- 239000007784 solid electrolyte Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/056—Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes
- H01M10/0561—Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes the electrolyte being constituted of inorganic materials only
- H01M10/0562—Solid materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M2300/00—Electrolytes
- H01M2300/0017—Non-aqueous electrolytes
- H01M2300/0065—Solid electrolytes
- H01M2300/0068—Solid electrolytes inorganic
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Physical Vapour Deposition (AREA)
- Secondary Cells (AREA)
Abstract
Description
LiPONは、イオン伝導性を有すると同時に電子に対する非伝導性を有することに基づき、バッテリや二次電池用の固体電解質として適している。このために使用される典型的な層系では、約1μm〜1.5μmの層厚さを有するLiPON層が必要とされる。このようなLiPON層をRFスパッタリングによって析出させることが知られている(国際公開第99/57770号)。しかし、このような方法は、低い被覆速度を特徴としており、ひいては低い生産率を特徴としており、このことは比較的高価な製品を生む。
したがって、本発明の根底を成す技術的な問題は、公知先行技術の上記欠点を克服することのできるような、LiPON層を析出させる方法を提供することである。特に、本発明による方法を用いると、高い被覆速度を持って、しかも公知先行技術に比べて減じられたコスト手間をかけるだけでLiPON層を析出させることが可能となることが望まれる。
以下に、本発明の実施形態を図面につき詳しく説明する。図1には、本発明による方法を実施する装置が概略的に図示されている。図1には図示されていない真空チャンバ内で、帯状のポリマシート基板1にLiPON層を析出させることが望まれる。このためには、基板1が、1m/分の移動速度で真空チャンバを通って運動させられる。基板1の下方には、グラファイト坩堝2が配置されており、このグラファイト坩堝2内には、LiPO顆粒が蒸発材料3として存在する。グラファイト坩堝2の上方には、2つの放射線ヒータ4a,4bが配置されており、この場合、これらの放射線ヒータ4a,4bの放射方向は、蒸発材料3の方向に向けられている。放射線ヒータ4a,4bは、それぞれ15kWの加熱出力で作動させられ、その結果、グラファイト坩堝2内に存在するLiPOは加熱され、かつ最終的に蒸発させられる。垂直方向で見てグラファイト坩堝2と放射線ヒータ4a,4bとの間に配置されている流入部5を通じて、反応性ガスである窒素が1000sccmで真空チャンバ内に導入される。放射線ヒータ4a,4bと基板1との間には、ホロー陰極として形成されたプラズマ源6が配置されている。このプラズマ源6は、150Aの放電電流を用いて作動されるホロー陰極アーク放電に基づき、プラズマ7を発生させる。このプラズマ7は、蒸発材料3から立ち上がった蒸気粒子雲を貫通する。LiPO蒸気粒子は、プラズマによって活性化され、そして真空チャンバ内部に導入された窒素と反応励起される。その結果、500nmの層厚さを有するLiPON層が、基板1の下側に析出される。
Claims (11)
- 基板(1)にLiPON層を析出させる方法であって、少なくとも化学的な元素リチウム、リンおよび酸素を含む、容器(2)内に存在する蒸発材料(3)を真空チャンバ内部で蒸発させる方法において、蒸発材料(3)を、少なくとも1つの熱的な蒸発装置(4a;4b)によって加熱し、それと同時に、窒素含有の成分を真空チャンバ内に導入するか、または窒素含有の材料を同時蒸発させ、容器(2)から立ち上がる蒸気粒子雲を、基板への析出前にプラズマ(7)によって貫通させることを特徴とする、基板(1)にLiPON層を析出させる方法。
- 蒸発装置として少なくとも1つの放射線ヒータ(4a;4b)を使用する、請求項1記載の方法。
- 蒸発装置として、電流通電によって加熱される少なくとも1つのボート型蒸発器を使用する、請求項1記載の方法。
- 蒸発装置として、誘導式に加熱される少なくとも1つのボート型蒸発器を使用する、請求項1記載の方法。
- 蒸発材料(3)としてLiPOを使用する、請求項1から4までのいずれか1項記載の方法。
- プラズマを発生させるために、ホロー陰極アーク放電を使用する、請求項1から5までのいずれか1項記載の方法。
- プラズマを発生させるために、磁界重畳されたグロー放電を使用する、請求項1から5までのいずれか1項記載の方法。
- プラズマを発生させるために、マイクロ波を使用する、請求項1から5までのいずれか1項記載の方法。
- プラズマを発生させる装置へのエネルギ供給をパルス式に行う、請求項1から8までのいずれか1項記載の方法。
- 窒素含有の成分として、窒素含有の反応性ガスを真空チャンバ内に導入する、請求項1から9までのいずれか1項記載の方法。
- 反応性ガスとして窒素、アンモニアまたは笑気を使用する、請求項10記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012003594.2 | 2012-02-27 | ||
DE102012003594A DE102012003594A1 (de) | 2012-02-27 | 2012-02-27 | Verfahren zum Abscheiden einer LiPON-Schicht auf einem Substrat |
PCT/EP2013/050720 WO2013127558A1 (de) | 2012-02-27 | 2013-01-16 | Verfahren zum abscheiden einer lipon-schicht auf einem substrat |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015514864A true JP2015514864A (ja) | 2015-05-21 |
JP6147280B2 JP6147280B2 (ja) | 2017-06-14 |
Family
ID=47722219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014559130A Expired - Fee Related JP6147280B2 (ja) | 2012-02-27 | 2013-01-16 | 基板にLiPON層を析出させる方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20140374241A1 (ja) |
EP (1) | EP2820165B1 (ja) |
JP (1) | JP6147280B2 (ja) |
KR (1) | KR20140131916A (ja) |
DE (1) | DE102012003594A1 (ja) |
WO (1) | WO2013127558A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021132238A1 (ja) | 2019-12-26 | 2021-07-01 | 株式会社アルバック | 成膜装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10147655B2 (en) * | 2016-03-22 | 2018-12-04 | Tokyo Electron Limited | System and method for temperature control in plasma processing system |
TWI719346B (zh) * | 2018-09-18 | 2021-02-21 | 行政院原子能委員會核能研究所 | 反應性陰極電弧蒸鍍系統鍍製鋰化合物薄膜之裝置與方法 |
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2012
- 2012-02-27 DE DE102012003594A patent/DE102012003594A1/de not_active Ceased
-
2013
- 2013-01-16 KR KR20147021634A patent/KR20140131916A/ko not_active Application Discontinuation
- 2013-01-16 US US14/377,120 patent/US20140374241A1/en not_active Abandoned
- 2013-01-16 EP EP13704721.3A patent/EP2820165B1/de not_active Revoked
- 2013-01-16 JP JP2014559130A patent/JP6147280B2/ja not_active Expired - Fee Related
- 2013-01-16 WO PCT/EP2013/050720 patent/WO2013127558A1/de active Application Filing
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021132238A1 (ja) | 2019-12-26 | 2021-07-01 | 株式会社アルバック | 成膜装置 |
KR20210096199A (ko) | 2019-12-26 | 2021-08-04 | 가부시키가이샤 아루박 | 성막 장치 |
TWI812911B (zh) * | 2019-12-26 | 2023-08-21 | 日商愛發科股份有限公司 | 成膜裝置 |
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US20140374241A1 (en) | 2014-12-25 |
KR20140131916A (ko) | 2014-11-14 |
EP2820165A1 (de) | 2015-01-07 |
DE102012003594A1 (de) | 2013-08-29 |
JP6147280B2 (ja) | 2017-06-14 |
EP2820165B1 (de) | 2017-04-19 |
WO2013127558A1 (de) | 2013-09-06 |
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