JP2015512153A - 処理モジュール - Google Patents
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- JP2015512153A JP2015512153A JP2014556153A JP2014556153A JP2015512153A JP 2015512153 A JP2015512153 A JP 2015512153A JP 2014556153 A JP2014556153 A JP 2014556153A JP 2014556153 A JP2014556153 A JP 2014556153A JP 2015512153 A JP2015512153 A JP 2015512153A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
- C23C16/463—Cooling of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Abstract
Description
本発明の別の実施例では、支持ローラ16の領域に、凹型の加熱板11を設けることもまた可能である。側方からみた処理チャンバポンプユニット15は、明確に図2において見ることができ、それは図1の背景に、長方形として示されるだけのものである。使用されたガスは、処理チャンバ2から処理チャンバポンプユニット15を介して排出され、この実施例では、その流れの方向は、流れ調節装置によって最適化される。
Claims (29)
- 処理モジュール(1、1A、1B、1C、1D)内に備えられた少なくとも一つの排気可能な処理チャンバ(2、2A、2B)と、前記処理チャンバ(2、2A、2B)の中で処理されるべき少なくとも一つの平坦な基盤(4)をそれぞれ収容するために少なくとも一つの基盤の搬送方向に沿って、前記処理モジュール(1、1A、1B、1C、1D)を通って水平方向に移動可能な少なくとも一つの支持装置(3)とを有する処理モジュール(1、1A、1B、1C、1D)において、
前記少なくとも一つの処理チャンバ(2、2A、2B)が前記支持装置(3)によって、物理的に閉鎖可能であって、前記支持装置(3)の位置は、前記処理モジュール(1、1A、1B、1C、1D)に対して、基盤の搬送方向を横切る少なくとも一つの閉じる方向に可変であって、前記少なくとも一つの支持装置(3)が前記少なくとも一つの処理チャンバ(2、2A、2B)の底を形成することを特徴とする処理モジュール。 - 前記少なくとも一つの支持装置(3)が電子的に導電性であるか、少なくとも、電子的に導電性の表面を含むことを特徴とする請求項1記載の処理モジュール。
- ガス、液体、および/または電子媒体のための前記処理チャンバ(2、2A、2B)の接続部が、前記処理チャンバ(2、2A、2B)の天井、および/または少なくとも一方の側壁に配置されていることを特徴とする請求項1または2に記載の処理モジュール。
- 前記処理モジュール(1、1A、1B、1C、1D)および/または前記処理チャンバ(2、2A、2B)は、少なくとも一つのポンプ接続部(17、 17A、 17B)を含むことを特徴とする請求項1から3のいずれか一項に記載の処理モジュール。
- 前記処理モジュール(1、1A、1B、1C、1D)は、前記処理チャンバ(2、2A、2B)の天井、および/または少なくとも一つの側壁を調整するための少なくとも一つの調整要素(21)を含み、前記調整要素(21)は加熱装置(30)、および/または冷却装置である請求項1から4のいずれか一項に記載の処理モジュール。
- 前記処理チャンバ(2、2A、2B)は、前記支持装置(3)のための少なくとも一つのHF対応の接続部または接触部(6)を含むことを特徴とする請求項1から5のいずれか一項に記載の処理モジュール。
- 前記HF対応の接続部または接触部(6)は、アース接続であることを特徴とする請求項6に記載の処理モジュール。
- 前記処理モジュール(1、1A、1B、1C、1D)は、前記処理チャンバ(2、 2A、2B)に向けて前記支持装置(3)を搬送するための、および/または前記処理チャンバ(2、 2A、2B)から前記支持装置(3)を搬送するための搬送システム(8)を備え、搬送レベルにおける供給、および/または排出が、前記処理チャンバ(2、2A、2B)の水平延長に対して平行に行われることを特徴とする請求項1から7のいずれか一項に記載の処理モジュール。
- 前記搬送システム(8)は、搬送ローラ(9)、リニアモータ駆動および/または搬送アームを備えることを特徴とする請求項8に記載の処理モジュール。
- 前記搬送システム(8)のすべての駆動部品が、前記処理チャンバ(2、 2A、 2B)の外部にあることを特徴とする請求項8または9に記載の処理モジュール。
- 前記処理モジュール(1、1A、1B、1C、1D)は、処理レベルに前記支持装置(3)を持ち上げるためと、搬送レベルに下げるためのハブシステム(10)を備え、前記処理レベルにおける前記支持装置(3)が前記処理チャンバ(2、 2A、2B)の底部を形成するものであることを特徴とする請求項1から10のいずれか一項に記載の処理モジュール。
- 前記ハブシステム(10)は、少なくとも1つの加熱板(11)または放射加熱器(23)を備えることを特徴とする請求項11に記載の処理モジュール。
- 前記加熱板(11)または前記放射加熱器(23)は、上昇可能または下降可能であることを特徴とする請求項12に記載の処理モジュール。
- 前記加熱板(11)と前記支持装置(3)との間の熱伝達がガス粒子によって可能であるような小さい距離に、前記加熱板(11)と前記支持装置(3)との間の距離が設定されていることを特徴とする請求項12または13に記載の処理モジュール。
- サポート機器(3)のキャリアが熱分離ブロック25断熱ブロック(25)上で提供される、前記ハブシステム(10)は、熱分離ブロック(25)を含んで構成され、前記支持装置(3)のキャリアが前記熱分離ブロック(25)の上に設けられていることを特徴とする請求項11から14のいずれか一項に記載の処理モジュール。
- 前記ハブシステム(10)は、前記支持装置(3)をその保持する側で保持している昇降フレーム12を備えることを特徴とする請求項11から15のいずれか一項に記載の処理モジュール。
- 平坦なキャリア表面を有する熱絶縁圧力コンポーネントが、前記昇降フレーム(12)のためのキャリアとして備えられることを特徴とする請求項16に記載の処理モジュール。
- 前記処理チャンバ(2、 2A、2B)は、少なくとも一つのシールを備え、前記支持装置(3)が、前記処理チャンバ(2、 2A、2B)を閉鎖するために前記シールに対して押し付けられることを特徴とする請求項1から17のいずれか一項に記載の処理モジュール。
- 前記処理モジュール(1、1A、1B、1C、1D)は、前記支持装置(3)の支持のためのなくとも一つの支持ローラ(16)を備えることを特徴とする請求項1から18のいずれか一項に記載の処理モジュール。
- ガスによって充填可能である前記処理モジュール(1、1A、1B、1C、1D)であることを特徴とする請求項1から19のいずれか一項に記載の処理モジュール。
- 前記処理モジュール(1、1A、1B、1C、1D)は、前記処理チャンバ(2、 2A、2B)を取り囲み、少なくとも一つの排気可能な絶縁チャンバ(20、20A)を含み、前記絶縁チャンバ(20、20A)が、少なくとも一つの絶縁チャンバドア(26)を備えることを特徴とする請求項1から20のいずれか一項に記載の処理モジュール。
- 前記処理モジュール(1、1A、1B、1C、1D)は、前記処理チャンバ(2、 2A、2B)と隣接している排気可能な絶縁室(28、29)を含んで構成されていることを特徴とする請求項1から21のいずれか一項に記載の処理モジュール。
- 前記処理チャンバ(2、 2A、2B)は、アルミニウムまたはアルミニウム合金で製造されるか、その内部がアルミニウムまたはアルミニウム合金によって覆われていることを特徴とする請求項1から22のいずれか一項に記載の処理モジュール。
- 少なくとも2つの処理チャンバ(2、 2A、2B)は、前記処理モジュール(1、1A、1B、1C、1D)の中に、垂直に積み重ねられた配置で設けられることを特徴とする請求項1から23のいずれか一項に記載の処理モジュール。
- 前記処理モジュール(1、1A、1B、1C、1D)は、少なくとも2つの搬送レベルで前記支持装置(3)の垂直な搬送のためのリフトを含んで構成されていることを特徴とする請求項24に記載の処理モジュール。
- 前記処理チャンバ(2、 2A、2B)は、プラズマチャンバであり、このプラズマチャンバは、第1のHF電極としてのガスシャワーを有しており、前記ガスシャワーは、前記支持装置(3)に対して平行な平板配置を形成していることを特徴とする請求項1から25のいずれか一項に記載の処理モジュール。
- 前記処理チャンバ(2、 2A、2B)は、プラズマチャンバであり、このプラズマチャンバは、いくつかのプラズマ源の配置を含んで構成されていることを特徴とする請求項1から25のいずれか一項に記載の処理モジュール。
- 前記処理モジュール(1、1A、1B、1C、1D)は、磁場配置が固定されるか、可動となっている磁場の配置を前記処理チャンバ(2、 2A、2B)内に少なくとも一つ備えることを特徴とする請求項26または27のいずれか一項に記載の処理モジュール。
- 前記処理モジュール(1、1A、1B、1C、1D)は、基盤処理装置に前記処理モジュール(1、1A、1B、1C、1D)を統合するためのモジュールドア(13)を有する少なくとも一つのモジュールインタフェースを含んで構成されていることを特徴とする請求項1から28のいずれか一項に記載の処理モジュール。
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DE102012100927A DE102012100927A1 (de) | 2012-02-06 | 2012-02-06 | Prozessmodul |
DE102012100927.9 | 2012-02-06 | ||
PCT/IB2013/050416 WO2013118004A1 (de) | 2012-02-06 | 2013-01-17 | Prozessmodul |
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JP2015512153A true JP2015512153A (ja) | 2015-04-23 |
JP6418573B2 JP6418573B2 (ja) | 2018-11-07 |
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US (2) | US20150152555A1 (ja) |
EP (1) | EP2812916B1 (ja) |
JP (1) | JP6418573B2 (ja) |
KR (1) | KR102035833B1 (ja) |
CN (1) | CN104106130B (ja) |
DE (1) | DE102012100927A1 (ja) |
ES (1) | ES2767297T3 (ja) |
HU (1) | HUE048935T2 (ja) |
TW (1) | TWI564430B (ja) |
WO (1) | WO2013118004A1 (ja) |
Cited By (1)
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JP2020136540A (ja) * | 2019-02-21 | 2020-08-31 | 東京エレクトロン株式会社 | 水蒸気処理装置及び水蒸気処理方法 |
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DE102015113962A1 (de) * | 2015-08-24 | 2017-03-02 | Meyer Burger (Germany) Ag | Substratbehandlungsvorrichtung |
US11031252B2 (en) * | 2016-11-30 | 2021-06-08 | Taiwan Semiconductor Manufacturing Compant, Ltd. | Heat shield for chamber door and devices manufactured using same |
US10590535B2 (en) * | 2017-07-26 | 2020-03-17 | Asm Ip Holdings B.V. | Chemical treatment, deposition and/or infiltration apparatus and method for using the same |
US11107708B2 (en) | 2017-11-14 | 2021-08-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Heating platform, thermal treatment and manufacturing method |
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US20190390344A1 (en) | 2019-12-26 |
TW201343960A (zh) | 2013-11-01 |
JP6418573B2 (ja) | 2018-11-07 |
EP2812916A1 (de) | 2014-12-17 |
ES2767297T3 (es) | 2020-06-17 |
HUE048935T2 (hu) | 2020-09-28 |
DE102012100927A1 (de) | 2013-08-08 |
TWI564430B (zh) | 2017-01-01 |
CN104106130B (zh) | 2018-01-23 |
CN104106130A (zh) | 2014-10-15 |
KR20140129126A (ko) | 2014-11-06 |
KR102035833B1 (ko) | 2019-10-23 |
WO2013118004A1 (de) | 2013-08-15 |
US20150152555A1 (en) | 2015-06-04 |
EP2812916B1 (de) | 2019-12-18 |
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