JP2015511773A5 - - Google Patents

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Publication number
JP2015511773A5
JP2015511773A5 JP2015502519A JP2015502519A JP2015511773A5 JP 2015511773 A5 JP2015511773 A5 JP 2015511773A5 JP 2015502519 A JP2015502519 A JP 2015502519A JP 2015502519 A JP2015502519 A JP 2015502519A JP 2015511773 A5 JP2015511773 A5 JP 2015511773A5
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JP
Japan
Prior art keywords
light emitting
wavelength conversion
emitting device
semiconductor light
conversion member
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JP2015502519A
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English (en)
Japanese (ja)
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JP6435258B2 (ja
JP2015511773A (ja
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Priority claimed from PCT/IB2013/052390 external-priority patent/WO2013144834A1/en
Publication of JP2015511773A publication Critical patent/JP2015511773A/ja
Publication of JP2015511773A5 publication Critical patent/JP2015511773A5/ja
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JP2015502519A 2012-03-30 2013-03-26 波長変換側面被覆を具備する発光装置 Active JP6435258B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261617903P 2012-03-30 2012-03-30
US61/617,903 2012-03-30
PCT/IB2013/052390 WO2013144834A1 (en) 2012-03-30 2013-03-26 Light emitting device with wavelength converting side coat

Publications (3)

Publication Number Publication Date
JP2015511773A JP2015511773A (ja) 2015-04-20
JP2015511773A5 true JP2015511773A5 (enExample) 2018-02-15
JP6435258B2 JP6435258B2 (ja) 2018-12-05

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JP2015502519A Active JP6435258B2 (ja) 2012-03-30 2013-03-26 波長変換側面被覆を具備する発光装置

Country Status (7)

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US (2) US10043952B2 (enExample)
EP (1) EP2831932B1 (enExample)
JP (1) JP6435258B2 (enExample)
KR (1) KR20150004818A (enExample)
CN (1) CN104205374B (enExample)
RU (1) RU2639565C2 (enExample)
WO (1) WO2013144834A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015176960A (ja) * 2014-03-14 2015-10-05 株式会社東芝 発光装置
CN104953014B (zh) 2014-03-28 2019-01-29 深圳光峰科技股份有限公司 一种多层结构玻璃荧光粉片及其制备方法及发光装置
KR20150116986A (ko) * 2014-04-08 2015-10-19 삼성디스플레이 주식회사 퀀텀 도트 시트 및 이를 포함하는 라이트 유닛과 액정 표시 장치
CN106575693B (zh) * 2014-06-19 2020-07-31 亮锐控股有限公司 具有小源尺寸的波长转换发光设备
US9373761B2 (en) * 2014-09-23 2016-06-21 Osram Sylvania Inc. Patterned thin-film wavelength converter and method of making same
JP6484982B2 (ja) 2014-09-30 2019-03-20 日亜化学工業株式会社 発光装置の製造方法
CN104465540A (zh) * 2014-12-22 2015-03-25 永新电子常熟有限公司 稳定性好的电子芯片
KR20170026801A (ko) * 2015-08-28 2017-03-09 삼성전자주식회사 반도체 발광소자 패키지 및 이를 이용한 광원모듈
CN107068841A (zh) * 2017-04-11 2017-08-18 安徽芯瑞达科技股份有限公司 一种五面发光的量子点夹层csp背光源及其制作方法
CN111213249B (zh) * 2017-08-18 2023-10-03 奥斯兰姆奥普托半导体有限责任公司 半导体器件的生产
TWI658610B (zh) * 2017-09-08 2019-05-01 Maven Optronics Co., Ltd. 應用量子點色彩轉換之發光裝置及其製造方法
KR102593592B1 (ko) * 2018-05-04 2023-10-25 엘지이노텍 주식회사 조명 장치
JP7057508B2 (ja) * 2019-03-28 2022-04-20 日亜化学工業株式会社 発光装置
JP7283327B2 (ja) 2019-09-20 2023-05-30 セイコーエプソン株式会社 波長変換素子、光源装置及びプロジェクター
KR20220112908A (ko) 2021-02-04 2022-08-12 삼성전자주식회사 반도체 발광장치

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5959316A (en) 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6351069B1 (en) 1999-02-18 2002-02-26 Lumileds Lighting, U.S., Llc Red-deficiency-compensating phosphor LED
US6680569B2 (en) 1999-02-18 2004-01-20 Lumileds Lighting U.S. Llc Red-deficiency compensating phosphor light emitting device
TW455908B (en) 1999-04-20 2001-09-21 Koninkl Philips Electronics Nv Lighting system
US6504301B1 (en) 1999-09-03 2003-01-07 Lumileds Lighting, U.S., Llc Non-incandescent lightbulb package using light emitting diodes
AT410266B (de) * 2000-12-28 2003-03-25 Tridonic Optoelectronics Gmbh Lichtquelle mit einem lichtemittierenden element
JP4081985B2 (ja) 2001-03-02 2008-04-30 日亜化学工業株式会社 発光装置およびその製造方法
JPWO2003034508A1 (ja) * 2001-10-12 2005-02-03 日亜化学工業株式会社 発光装置及びその製造方法
US6791116B2 (en) * 2002-04-30 2004-09-14 Toyoda Gosei Co., Ltd. Light emitting diode
KR101030068B1 (ko) * 2002-07-08 2011-04-19 니치아 카가쿠 고교 가부시키가이샤 질화물 반도체 소자의 제조방법 및 질화물 반도체 소자
JP4337574B2 (ja) 2003-09-25 2009-09-30 日亜化学工業株式会社 発光装置およびその形成方法
US7052152B2 (en) 2003-10-03 2006-05-30 Philips Lumileds Lighting Company, Llc LCD backlight using two-dimensional array LEDs
US7102152B2 (en) * 2004-10-14 2006-09-05 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Device and method for emitting output light using quantum dots and non-quantum fluorescent material
US7250715B2 (en) 2004-02-23 2007-07-31 Philips Lumileds Lighting Company, Llc Wavelength converted semiconductor light emitting devices
US7361938B2 (en) * 2004-06-03 2008-04-22 Philips Lumileds Lighting Company Llc Luminescent ceramic for a light emitting device
JP4756841B2 (ja) * 2004-09-29 2011-08-24 スタンレー電気株式会社 半導体発光装置の製造方法
US7858408B2 (en) * 2004-11-15 2010-12-28 Koninklijke Philips Electronics N.V. LED with phosphor tile and overmolded phosphor in lens
JP4845370B2 (ja) 2004-11-26 2011-12-28 京セラ株式会社 発光装置および照明装置
JP2006352036A (ja) * 2005-06-20 2006-12-28 Rohm Co Ltd 白色半導体発光素子
RU2303833C2 (ru) 2005-07-26 2007-07-27 Самсунг Электро-Меканикс Ко., Лтд. Осветительное устройство
JP2009512178A (ja) * 2005-11-04 2009-03-19 パナソニック株式会社 発光モジュールとこれを用いた表示装置及び照明装置
WO2007077869A1 (ja) * 2006-01-04 2007-07-12 Rohm Co., Ltd. 薄型発光ダイオードランプとその製造方法
US7521862B2 (en) 2006-11-20 2009-04-21 Philips Lumileds Lighting Co., Llc Light emitting device including luminescent ceramic and light-scattering material
US8232564B2 (en) * 2007-01-22 2012-07-31 Cree, Inc. Wafer level phosphor coating technique for warm light emitting diodes
JP4920497B2 (ja) * 2007-05-29 2012-04-18 株式会社東芝 光半導体装置
US7942556B2 (en) 2007-06-18 2011-05-17 Xicato, Inc. Solid state illumination device
EP2191517B1 (en) * 2007-08-31 2017-11-29 LG Innotek Co., Ltd. Light emitting device package
US7984999B2 (en) 2007-10-17 2011-07-26 Xicato, Inc. Illumination device with light emitting diodes and moveable light adjustment member
WO2010017523A1 (en) 2008-08-08 2010-02-11 Xicato, Inc. Color tunable light source
JP5284006B2 (ja) 2008-08-25 2013-09-11 シチズン電子株式会社 発光装置
US7973327B2 (en) * 2008-09-02 2011-07-05 Bridgelux, Inc. Phosphor-converted LED
CN101673787B (zh) * 2008-09-12 2012-12-12 晶元光电股份有限公司 半导体发光装置及其封装结构
WO2010035206A1 (en) 2008-09-25 2010-04-01 Koninklijke Philips Electronics N.V. Coated light emitting device and method for coating thereof
US7804103B1 (en) 2009-01-07 2010-09-28 Lednovation, Inc. White lighting device having short wavelength semiconductor die and trichromatic wavelength conversion layers
KR101172143B1 (ko) * 2009-08-10 2012-08-07 엘지이노텍 주식회사 백색 발광다이오드 소자용 시온계 산화질화물 형광체, 그의 제조방법 및 그를 이용한 백색 ｌｅｄ 소자
KR101163902B1 (ko) * 2010-08-10 2012-07-09 엘지이노텍 주식회사 발광 소자
US8104908B2 (en) 2010-03-04 2012-01-31 Xicato, Inc. Efficient LED-based illumination module with high color rendering index
WO2011139538A2 (en) 2010-04-26 2011-11-10 Xicato, Inc. Led-based illumination module attachment to a light fixture
DE102010021011A1 (de) * 2010-05-21 2011-11-24 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung einer Abdeckschicht
US20110317397A1 (en) 2010-06-23 2011-12-29 Soraa, Inc. Quantum dot wavelength conversion for hermetically sealed optical devices
DE102010035490A1 (de) * 2010-08-26 2012-03-01 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden Bauelements
DE102010053362B4 (de) 2010-12-03 2021-09-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterchips, strahlungsemittierender Halbleiterchip und strahlungsemittierendes Bauelement
JP5895598B2 (ja) 2012-02-29 2016-03-30 日亜化学工業株式会社 発光装置
US9071981B2 (en) 2012-09-21 2015-06-30 Htc Corporation Method of monitoring search space of enhanced downlink control channel in orthogonal frequency-division multiple access system

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