JP2015511258A5 - - Google Patents
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- Publication number
- JP2015511258A5 JP2015511258A5 JP2014556155A JP2014556155A JP2015511258A5 JP 2015511258 A5 JP2015511258 A5 JP 2015511258A5 JP 2014556155 A JP2014556155 A JP 2014556155A JP 2014556155 A JP2014556155 A JP 2014556155A JP 2015511258 A5 JP2015511258 A5 JP 2015511258A5
- Authority
- JP
- Japan
- Prior art keywords
- composition according
- cmp composition
- saccharide
- monosaccharide
- tetrasaccharide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000002772 monosaccharides Chemical class 0.000 claims 2
- -1 penta - saccharide Chemical class 0.000 claims 2
- 150000002016 disaccharides Chemical class 0.000 claims 1
- 150000004676 glycans Chemical class 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229920001542 oligosaccharide Polymers 0.000 claims 1
- 150000002482 oligosaccharides Chemical class 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 229920001282 polysaccharide Polymers 0.000 claims 1
- 239000005017 polysaccharide Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 150000004044 tetrasaccharides Chemical class 0.000 claims 1
- 150000004043 trisaccharides Chemical class 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261597210P | 2012-02-10 | 2012-02-10 | |
| US61/597,210 | 2012-02-10 | ||
| PCT/IB2013/050647 WO2013118015A1 (en) | 2012-02-10 | 2013-01-25 | Chemical mechanical polishing (cmp) composition comprising a protein |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015511258A JP2015511258A (ja) | 2015-04-16 |
| JP2015511258A5 true JP2015511258A5 (https=) | 2016-03-10 |
| JP6114312B2 JP6114312B2 (ja) | 2017-04-12 |
Family
ID=48946960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014556155A Expired - Fee Related JP6114312B2 (ja) | 2012-02-10 | 2013-01-25 | タンパク質を含有する化学機械研磨（ｃｍｐ）組成物 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US9777192B2 (https=) |
| EP (1) | EP2812911B1 (https=) |
| JP (1) | JP6114312B2 (https=) |
| KR (1) | KR20140122271A (https=) |
| CN (1) | CN104081501B (https=) |
| IL (1) | IL233797A0 (https=) |
| MY (1) | MY171093A (https=) |
| RU (1) | RU2631875C2 (https=) |
| SG (1) | SG11201404747UA (https=) |
| TW (1) | TWI606102B (https=) |
| WO (1) | WO2013118015A1 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013122061A1 (ja) * | 2012-02-13 | 2013-08-22 | 国立大学法人京都工芸繊維大学 | 窒化ケイ素（Ｓｉ３Ｎ４）親和性ペプチド、及びその利用 |
| US9340706B2 (en) | 2013-10-10 | 2016-05-17 | Cabot Microelectronics Corporation | Mixed abrasive polishing compositions |
| US9551075B2 (en) * | 2014-08-04 | 2017-01-24 | Sinmat, Inc. | Chemical mechanical polishing of alumina |
| KR102605140B1 (ko) * | 2015-12-17 | 2023-11-24 | 솔브레인 주식회사 | 화학 기계적 연마 슬러리 조성물 및 이를 이용한 연마 방법 |
| US11326076B2 (en) * | 2019-01-25 | 2022-05-10 | Versum Materials Us, Llc | Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with low abrasive concentration and a combination of chemical additives |
| US11608451B2 (en) * | 2019-01-30 | 2023-03-21 | Versum Materials Us, Llc | Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with tunable silicon oxide and silicon nitride removal rates |
| KR20210076571A (ko) * | 2019-12-16 | 2021-06-24 | 주식회사 케이씨텍 | Sti 공정용 연마 슬러리 조성물 |
| WO2021231090A1 (en) * | 2020-05-11 | 2021-11-18 | Versum Materials Us, Llc | Novel pad-1 n-a-bottle (pib) technology for advanced chemical-mechanical planarization (cmp) slurries and processes |
| US12009339B2 (en) * | 2020-08-18 | 2024-06-11 | Seoul National University R&Db Foundation | Electronic device and method of transferring electronic element using stamping and magnetic field alignment |
| KR102928760B1 (ko) | 2023-10-10 | 2026-02-20 | 주식회사 케이씨텍 | 표면 개질된 나노 세리아 입자를 포함하는 cmp 슬러리 조성물 |
| CN118240485B (zh) * | 2024-05-27 | 2024-08-16 | 嘉兴市小辰光伏科技有限公司 | 一种具有云朵状塔基硅片碱抛添加剂及其使用方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW510917B (en) * | 1998-02-24 | 2002-11-21 | Showa Denko Kk | Abrasive composition for polishing semiconductor device and method for manufacturing semiconductor device using same |
| JP3560484B2 (ja) * | 1998-08-05 | 2004-09-02 | 昭和電工株式会社 | Ｌｓｉデバイス研磨用研磨材組成物及び研磨方法 |
| WO2001033620A1 (fr) | 1999-11-04 | 2001-05-10 | Seimi Chemical Co., Ltd. | Compose a polir pour semi-conducteur contenant un peptide |
| JP2002110596A (ja) * | 2000-10-02 | 2002-04-12 | Mitsubishi Electric Corp | 半導体加工用研磨剤およびこれに用いる分散剤、並びに上記半導体加工用研磨剤を用いた半導体装置の製造方法 |
| TWI281493B (en) * | 2000-10-06 | 2007-05-21 | Mitsui Mining & Smelting Co | Polishing material |
| US20040175942A1 (en) | 2003-01-03 | 2004-09-09 | Chang Song Y. | Composition and method used for chemical mechanical planarization of metals |
| US7241734B2 (en) * | 2004-08-18 | 2007-07-10 | E. I. Du Pont De Nemours And Company | Thermophilic hydrophobin proteins and applications for surface modification |
| JP4027929B2 (ja) | 2004-11-30 | 2007-12-26 | 花王株式会社 | 半導体基板用研磨液組成物 |
| US20060216935A1 (en) * | 2005-03-28 | 2006-09-28 | Ferro Corporation | Composition for oxide CMP in CMOS device fabrication |
| KR20080033514A (ko) | 2005-08-05 | 2008-04-16 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 금속막 평탄화를 위한 고 처리량의 화학적 기계적 연마조성물 |
| WO2007130350A1 (en) * | 2006-05-02 | 2007-11-15 | Cabot Microelectronics Corporation | Compositions and methods for cmp of semiconductor materials |
| WO2008069781A1 (en) * | 2006-12-04 | 2008-06-12 | Basf Se | Planarization composition for metal surfaces comprising an alumina hydrate abrasive |
| JP4784614B2 (ja) * | 2008-02-25 | 2011-10-05 | Ｊｓｒ株式会社 | 化学機械研磨用水系分散体 |
| WO2010037730A1 (en) | 2008-10-03 | 2010-04-08 | Basf Se | Chemical mechanical polishing (cmp) polishing solution with enhanced performance |
| BRPI1010003A2 (pt) * | 2009-03-09 | 2018-06-12 | Basf Se | uso de uma mistura, e, composição |
| JP2012028747A (ja) | 2010-06-24 | 2012-02-09 | Hitachi Chem Co Ltd | Ｃｍｐ研磨液及び基板の研磨方法 |
-
2013
- 2013-01-25 SG SG11201404747UA patent/SG11201404747UA/en unknown
- 2013-01-25 US US14/377,648 patent/US9777192B2/en not_active Expired - Fee Related
- 2013-01-25 EP EP13746024.2A patent/EP2812911B1/en not_active Not-in-force
- 2013-01-25 WO PCT/IB2013/050647 patent/WO2013118015A1/en not_active Ceased
- 2013-01-25 CN CN201380006888.3A patent/CN104081501B/zh not_active Expired - Fee Related
- 2013-01-25 KR KR1020147024959A patent/KR20140122271A/ko not_active Ceased
- 2013-01-25 MY MYPI2014002325A patent/MY171093A/en unknown
- 2013-01-25 RU RU2014136534A patent/RU2631875C2/ru not_active IP Right Cessation
- 2013-01-25 JP JP2014556155A patent/JP6114312B2/ja not_active Expired - Fee Related
- 2013-02-07 TW TW102105003A patent/TWI606102B/zh not_active IP Right Cessation
-
2014
- 2014-07-24 IL IL233797A patent/IL233797A0/en unknown
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