JP2015502418A - レーザーダイレクトストラクチャード基板を形成する際に使用するための熱可塑性組成物 - Google Patents
レーザーダイレクトストラクチャード基板を形成する際に使用するための熱可塑性組成物 Download PDFInfo
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- JP2015502418A JP2015502418A JP2014539981A JP2014539981A JP2015502418A JP 2015502418 A JP2015502418 A JP 2015502418A JP 2014539981 A JP2014539981 A JP 2014539981A JP 2014539981 A JP2014539981 A JP 2014539981A JP 2015502418 A JP2015502418 A JP 2015502418A
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- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
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- DTIFFPXSSXFQCJ-UHFFFAOYSA-N tetrahexylazanium Chemical compound CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC DTIFFPXSSXFQCJ-UHFFFAOYSA-N 0.000 description 1
- 230000001225 therapeutic effect Effects 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
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- UNXRWKVEANCORM-UHFFFAOYSA-I triphosphate(5-) Chemical compound [O-]P([O-])(=O)OP([O-])(=O)OP([O-])([O-])=O UNXRWKVEANCORM-UHFFFAOYSA-I 0.000 description 1
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
- C09K19/38—Polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Bは、価数3をもつ金属カチオン、たとえばクロム、鉄、アルミニウム、ニッケル、マンガン、スズなど、並びにその組み合わせである。
[0049]熱可塑性組成物を形成するのに使用される材料は、当業界で公知のように様々な技術のいずれかを使用して混和することができる。特定の一態様において、たとえば液晶ポリマー、誘電材料、レーザー活性化可能な添加剤、繊維充填材、及び他の任意選択の添加剤を押出機内で混合物として溶融加工して、熱可塑性組成物を形成する。混合物は、約250℃〜約450℃の温度で一軸または多軸押出機で溶融混練することができる。一態様において、混合物は、多数の温度ゾーンを含む押出機で溶融加工することができる。個々のゾーンの温度は、液晶ポリマーの融解温度に対して約−60℃〜約25℃で通常設定される。たとえば、混合物は、Leistritz 18mm共回転完全噛み合い二軸押出機(co-rotating fully intermeshing twin screw extruder)などの二軸押出機を使用して溶融加工することができる。混合物を溶融加工するために、汎用スクリューデザインを使用することができる。一態様において、成分を全て含む混合物を、定量供給機(volumetric feeder)により第一のバレルの供給口に供給することができる。別の態様では、公知のように、押出機の別の添加点で別の成分を加えることができる。液晶ポリマーを供給口に適用し、それより下流に配置されている同一または異なる温度ゾーンで、特定の添加剤(たとえば、誘電材料、レーザー活性化可能な添加剤、及び繊維充填材)を供給することができる。いずれにせよ、得られた混合物を溶融し、混合し、次いでダイを通して押し出すことができる。次いで押し出された熱可塑性組成物は水浴中でクエンチして固化し、ペレタイザーで造粒し、続いて乾燥することができる。
fr=操作周波数
εr=基板の比誘電率(またはDk)。
[0058]溶融粘度:溶融粘度(Pa・s)は、Dynisco 7001キャピラリーレオメーターを使用して、350℃及び剪断速度1000s-1で、ISO試験No.11443に従って測定した。レオメーターオリフィス(ダイ)は、直径1mm、長さ20mm、L/D比20.1、及び入口角180°を有していた。バレルの直径は9.55mm±0.005mmで、ロッド長さは233.4mmであった。
[0066]熱可塑性組成物は、液晶ポリマー55.5重量%、タルク38.5重量%、及びShepherd 1GMなる名称のもとShepherd Color Co.より市販されている銅クロマイト充填材(CuCr2O4)6.0重量%から形成する。液晶ポリマーは、Leeらの米国特許第5,508,374号に記載されているように、4-ヒドロキシ安息香酸(HBA)、2,6-ヒドロキシナフトエ酸(HNA)、テレフタル酸(TA)、4,4’-ビフェノール(BP)、及びアセトアミノフェン(APAP)から形成する。HNA含有量は5モル%である。
[0067]熱可塑性組成物は、液晶ポリマー59.0重量%、タルク15.0重量%、ガラス繊維20.0重量%及び、銅クロマイト充填材(Shepherd IGM)6.0重量%から形成する。ガラス繊維は、Owens Corning Vetrotexより市販されているAdvantex(商標)Eガラスである。液晶ポリマーは実施例1で使用したものと同一ポリマーである。組成物を形成した後、ガラス繊維の重量平均長さを試験し測定すると、340マイクロメートルであった(1標準偏差160マイクロメートル)。
[0068]熱可塑性組成物は、液晶ポリマー59.0重量%、タルク15.0重量%、50〜80μmの重量平均長さをもつ粉砕ガラス繊維20.0重量%、及び銅クロマイト充填材(Shepherd IGM)6.0重量%から形成する。この液晶ポリマーは実施例1で使用したものと同一ポリマーである。
[0069]熱可塑性組成物は、液晶ポリマー59.0重量%、ルチル二酸化チタン(Tiona(商標)RCL-188、Millennium)15重量%、Advantex(商標)Eガラスガラス繊維20.0重量%、及び銅クロマイト充填材(Shepherd IGM)6.0重量%から形成する。液晶ポリマーは、実施例1で使用したものと同一ポリマーである。組成物を形成した後、ガラス繊維の重量平均長さを試験し測定すると、270マイクロメートルであった(1標準偏差130マイクロメートル)。
[0070]熱可塑性組成物は、第一の液晶ポリマー44.0重量%、第二の液晶ポリマー(全組成物の14重量%)及び銅クロマイト充填材(Shepherd IGM、全組成物の6.0重量%)を含むマスターバッチ20重量%、ルチル二酸化チタン(Tiona(商標)RCL-188、Millennium)15重量%、Advantex(商標)Eガラスガラス繊維20.0重量%、及びアルミナ三水和物1.0重量%から形成する。第一の液晶ポリマーは、Longらの米国特許第5,969,083号に記載のように、4-ヒドロキシ安息香酸(HBA)、ナフタレン-2,6-ジカルボン酸(NDA)、テレフタル酸、及びハイドロキノン(HQ)から形成する。NDA含有量は20モル%である。第二の液晶ポリマーは、実施例1で使用したものと同一ポリマーである。組成物を形成した後、ガラス繊維の重量平均長さを試験し測定すると、300マイクロメートルであった(1標準偏差150マイクロメートル)。
[0071]熱可塑性組成物は、第一の液晶ポリマー34.0重量%、第二の液晶ポリマー(組成物の14重量%)及び銅クロマイト充填材(Shepherd IGM、組成物の6.0重量%)を含むマスターバッチ20重量%、ルチル二酸化チタン(Tiona(商標)RCL-188、Millennium)25重量%、Advantex(商標)Eガラスガラス繊維20.0重量%、及びアルミナ三水和物1.0重量%から形成する。第一及び第二の液晶ポリマーは実施例5で使用したものと同一である。組成物を形成した後、ガラス繊維の重量平均長さを試験し測定すると、310マイクロメートルであった(1標準偏差120マイクロメートル)。
[0073]熱可塑性組成物は、LDSポリマー濃縮物(polymer concentrate)、液晶ポリマー、ルチル二酸化チタン(Tiona(商標)RCL-4、Millennium)、及びAdvantex(商標)Eガラス繊維から形成する。ポリマー濃縮物は、銅クロマイト充填材(Shepherd IGM)30.0重量%と液晶ポリマー70重量%を含んでいた。場合によっては、グラファイト25重量%と液晶ポリマー75重量%を含むポリマー濃縮物も使用する。組成物中で使用する液晶ポリマーは、実施例1で使用したポリマーと同一である。それぞれの実施例の構成成分を以下により詳細に示す。
[0075]熱可塑性組成物は、液晶ポリマー(アルミナ三水和物0.5重量%を含む)58.0重量%、ルチル二酸化チタン(Ti-pure(商標)R-104、DuPont)15重量%、Advantex(商標)Eガラスガラス繊維20.0重量%、銅クロマイト充填材(Shepherd IGM)6.0重量%、及びカーボンブラック1.0重量%から形成する。液晶ポリマーは、実施例5で使用したものと同一である。
[0076]熱可塑性組成物は、液晶ポリマー47.5重量%(アルミナ三水和物0.5重量%を含む)、ルチル二酸化チタン(Ti-pure(商標)R-104、DuPont)25重量%、Advantex(商標)Eガラスガラス繊維20.0重量%、銅クロマイト充填材(Shepherd IGM)6.0重量%、及びカーボンブラック1.5重量%から形成する。液晶ポリマーは実施例5で使用したものと同一である。
[0078]熱可塑性組成物は、LDSポリマー濃縮物、液晶ポリマー、ルチル二酸化チタン(Tiona(商標)RCL-4、Millennium)、及びAdvantex(商標)Eガラス繊維から形成する。ポリマー濃縮物は、銅クロマイト充填材(Shepherd IGM)30.0重量%と、液晶ポリマー70重量%とを含んでいた。場合によっては、グラファイト25重量%と液晶ポリマー75重量%とを含むポリマー濃縮物も使用する。実施例13と14のポリマーは、実施例1で使用したものと同一であり、実施例15と16のポリマーは、実施例5で使用したものと同一である。
Claims (39)
- 少なくとも一つのサーモトロピック液晶ポリマー約20重量%〜約80重量%;
少なくとも一つのレーザー活性化可能な添加剤約0.1重量%〜約30重量%、ここで前記レーザー活性化可能な添加剤はスピネル結晶を含む;
少なくとも一つの誘電材料約1重量%〜約50重量%;及び
少なくとも一つの繊維充填材約5重量%〜約50重量%、ここで前記繊維充填材対レーザー活性化可能な添加剤と誘電材料の混和量の重量比は約0.4〜約2.0である、を含む熱可塑性組成物であって、前記熱可塑性組成物は、2GHzの周波数で測定して、約4.4を超える比誘電率を示し、さらに前記熱可塑性組成物の融解温度は、約250℃〜約440℃であり、前記組成物は、荷重撓み温度対融解温度の比が約0.67〜約1.00であるような荷重撓み温度を示し、前記荷重撓み温度は、1.8メガパスカルの荷重で、ISO試験No.75-2に従って測定される、前記組成物。 - ナフテン系ヒドロキシカルボン酸及び/またはナフテン系ジカルボン酸から誘導した繰り返し単位の合計量約10モル%以上をもつサーモトロピック液晶ポリマー、レーザー活性化可能な添加剤、誘電材料及び繊維充填材を含む熱可塑性組成物であって、前記レーザー活性化可能な添加剤はスピネル結晶を含む、前記組成物。
- 前記組成物が、サーモトロピック液晶ポリマー約20重量%〜約80重量%;レーザー活性化可能な添加剤約0.1重量%〜約30重量%;誘電材料約1重量%〜約50重量%;及び繊維充填材約5重量%〜約50重量%を含む、請求項2に記載の熱可塑性組成物。
- 前記繊維充填材対レーザー活性化可能な添加剤及び誘電材料の混和量の重量比が、約0.4〜約2.0である、請求項2または3に記載の熱可塑性組成物。
- 前記組成物が、2GHzの周波数で測定して、約4.4を超える比誘電率を示す、請求項2、3または4に記載の熱可塑性組成物。
- 前記熱可塑性組成物の融解温度が、約250℃〜約440℃である、請求項2〜5のいずれかに記載の熱可塑性組成物。
- 前記組成物は、荷重撓み温度対融解温度の比が約0.67〜約1.00であるような、荷重撓み温度を示し、前記荷重撓み温度は、1.8メガパスカルの荷重で、ISO試験No.75-2に従って測定する、請求項2〜6のいずれかに記載の熱可塑性組成物。
- 前記サーモトロピック液晶ポリマーが、4-ヒドロキシ安息香酸から誘導した繰り返し単位を含む芳香族ポリエステルである、請求項1〜7のいずれかに記載の熱可塑性組成物。
- 前記芳香族ポリエステルが、テレフタル酸、イソフタル酸、ハイドロキノン、4,4-ビフェノールまたはそれらの組み合わせから誘導される繰り返し単位をさらに含む、請求項8に記載の熱可塑性組成物。
- 前記スピネル結晶が、MgAl2O4、ZnAl2O4、FeAl2O4、CuFe2O4、CuCr2O4、MnFe2O4、NiFe2O4、TiFe2O4、FeCr2O4、MgCr2O4またはその組み合わせを含む、請求項10に記載の熱可塑性組成物。
- 前記誘電材料が、強誘電材料を含む、請求項1〜11のいずれかに記載の熱可塑性組成物。
- 前記強誘電材料が、BaTiO3、SrTiO3、CaTiO3、MgTiO3、SrBaTi2O6、NaBa2Nb5O15、KBa2Nb5O15またはその組み合わせを含む、請求項12に記載の熱可塑性組成物。
- 前記誘電材料が、常誘電性材料を含む、請求項1〜13のいずれかに記載の熱可塑組成物。
- 前記常誘電性材料が、TiO2、Ta2O5、HfO2、Nb2O5、Al2O3またはその組み合わせ含む、請求項14の熱可塑性組成物。
- 前記誘電材料が、表面処理を含むセラミック粒子を含む、請求項1〜15のいずれかに記載の熱可塑性組成物。
- 前記表面処理が、有機リン化合物を含む、請求項16に記載の熱可塑性組成物。
- 前記表面処理が、リン酸化ポリエンを含む、請求項17に記載の熱可塑性組成物。
- 誘電材料とレーザー活性化可能な添加剤の混和量が、約5重量%〜約50重量%の範囲内である、請求項1〜18のいずれかに記載の熱可塑性組成物。
- 前記誘電材料が炭素粒子を含む、請求項1〜19のいずれかに記載の熱可塑性組成物。
- 前記繊維充填材がガラス繊維を含む、請求項1〜20のいずれかに記載の熱可塑性組成物。
- 前記ガラス繊維が、約5〜約50のアスペクト比をもつ、請求項21に記載の熱可塑性組成物。
- 前記ガラス繊維が、約100〜約800マイクロメートルの重量平均長さをもつ、請求項21に記載の熱可塑性組成物。
- 前記組成物は、ASTM試験No.1238-70に従って、1000秒-1の剪断速度及び温度350℃で測定して、約5〜約100Pa・sの溶融粘度をもつ、請求項1〜23のいずれかに記載の熱可塑性組成物。
- 前記組成物が、2GHzの周波数で測定して、約0.0001〜約0.0055の誘電正接を示す、請求項1〜24のいずれかに記載の熱可塑性組成物。
- 請求項1〜25のいずれかに記載の熱可塑性組成物を含む成形品。
- 前記部品が約5ミリメートル以下の厚さをもつ、請求項26に記載の成形品。
- 前記部品が、23℃において、ISO試験No.179-1に従って測定して、約6kJ/m2を超えるシャルピーノッチ付き衝撃強さを示す、請求項26に記載の成形品。
- 前記部品が、UL94に従って測定して、0.8mmの厚さでV0評価を示す、請求項26に記載の成形品。
- 部品の表面をレーザーに暴露し、その後、その暴露した表面を金属化することを含む方法により、一つ以上の導体素子が部品表面上に形成される、請求項26に記載の成形品。
- 請求項26に記載の成形品を含む、電子部品。
- 請求項26に記載の成形品を含む、移植可能な医療機器。
- 少なくとも一つのサーモトロピック液晶ポリマー、スピネル結晶を含む少なくとも一つのレーザー活性化可能な添加剤、少なくとも一つの誘電材料、及び少なくとも一つの繊維充填材を含む熱可塑性組成物を含む基板、ここで前記繊維充填材対前記レーザー活性化可能な充填材及び前記誘電材料の混和量の重量比は約0.4〜約2.0である;及び
前記基板上に形成された一つ以上のアンテナを含む、アンテナ構造体。 - 前記繊維充填材がガラス繊維を含む、請求項33に記載のアンテナ構造体。
- 前記サーモトロピック液晶ポリマーが、10モル%を超えるナフテン系ヒドロキシカルボン酸及び/またはナフテン系ジカルボン酸から誘導された繰り返し単位の合計量を有する、請求項33に記載のアンテナ構造体。
- 前記熱可塑性組成物が、2GHzの周波数で測定して、約4.4を超える比誘電率を示す、請求項33に記載のアンテナ構造体。
- 前記組成物が、2GHzの周波数で測定して、約0.0001〜約0.0055の誘電正接を示す、請求項33に記載のアンテナ構造体。
- 請求項33に記載のアンテナ構造体を含む、電子部品。
- 前記部品が携帯電話である、請求項38に記載の電子部品。
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WO2019167854A1 (ja) * | 2018-02-27 | 2019-09-06 | 三菱エンジニアリングプラスチックス株式会社 | 熱可塑性樹脂組成物、成形品、熱可塑性樹脂組成物の製造方法、および、メッキ付成形品の製造方法 |
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WO2021095914A1 (ko) * | 2019-11-13 | 2021-05-20 | 주식회사 동성코퍼레이션 | 안테나 기구, 이의 제조방법 및 이를 포함하는 샤크 안테나 |
Also Published As
Publication number | Publication date |
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CN103906803B (zh) | 2016-05-25 |
CN103906803A (zh) | 2014-07-02 |
JP6152114B2 (ja) | 2017-06-21 |
US9074070B2 (en) | 2015-07-07 |
TWI582152B (zh) | 2017-05-11 |
WO2013066663A3 (en) | 2013-12-12 |
WO2013066663A2 (en) | 2013-05-10 |
TW201323503A (zh) | 2013-06-16 |
US20130106659A1 (en) | 2013-05-02 |
KR20140091029A (ko) | 2014-07-18 |
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