JP2015171740A5 - - Google Patents

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Publication number
JP2015171740A5
JP2015171740A5 JP2014048448A JP2014048448A JP2015171740A5 JP 2015171740 A5 JP2015171740 A5 JP 2015171740A5 JP 2014048448 A JP2014048448 A JP 2014048448A JP 2014048448 A JP2014048448 A JP 2014048448A JP 2015171740 A5 JP2015171740 A5 JP 2015171740A5
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JP
Japan
Prior art keywords
insulating film
forming
conductor
mems device
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2014048448A
Other languages
English (en)
Japanese (ja)
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JP2015171740A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014048448A priority Critical patent/JP2015171740A/ja
Priority claimed from JP2014048448A external-priority patent/JP2015171740A/ja
Priority to CN201510094983.4A priority patent/CN104909329B/zh
Priority to US14/640,886 priority patent/US9499394B2/en
Publication of JP2015171740A publication Critical patent/JP2015171740A/ja
Publication of JP2015171740A5 publication Critical patent/JP2015171740A5/ja
Withdrawn legal-status Critical Current

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JP2014048448A 2014-03-12 2014-03-12 Ｍｅｍｓデバイス及びその製造方法 Withdrawn JP2015171740A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014048448A JP2015171740A (ja) 2014-03-12 2014-03-12 Ｍｅｍｓデバイス及びその製造方法
CN201510094983.4A CN104909329B (zh) 2014-03-12 2015-03-03 微机电系统设备及其制造方法
US14/640,886 US9499394B2 (en) 2014-03-12 2015-03-06 MEMS device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014048448A JP2015171740A (ja) 2014-03-12 2014-03-12 Ｍｅｍｓデバイス及びその製造方法

Publications (2)

Publication Number Publication Date
JP2015171740A JP2015171740A (ja) 2015-10-01
JP2015171740A5 true JP2015171740A5 (enExample) 2017-03-09

Family

ID=54068172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014048448A Withdrawn JP2015171740A (ja) 2014-03-12 2014-03-12 Ｍｅｍｓデバイス及びその製造方法

Country Status (3)

Country Link
US (1) US9499394B2 (enExample)
JP (1) JP2015171740A (enExample)
CN (1) CN104909329B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6314568B2 (ja) * 2014-03-18 2018-04-25 セイコーエプソン株式会社 Ｍｅｍｓデバイス及びその製造方法
JP6331552B2 (ja) * 2014-03-25 2018-05-30 セイコーエプソン株式会社 Ｍｅｍｓデバイス及びその製造方法
CN109541319B (zh) * 2018-10-10 2023-09-01 金华职业技术学院 一种液体介电常数测量方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6012336A (en) * 1995-09-06 2000-01-11 Sandia Corporation Capacitance pressure sensor
US5798283A (en) * 1995-09-06 1998-08-25 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
JP4772302B2 (ja) * 2003-09-29 2011-09-14 パナソニック株式会社 微小電気機械システムおよびその製造方法
US7585744B2 (en) * 2003-12-08 2009-09-08 Freescale Semiconductor, Inc. Method of forming a seal for a semiconductor device
JP2006289520A (ja) * 2005-04-06 2006-10-26 Toshiba Corp Ｍｅｍｓ技術を使用した半導体装置
JP2008188711A (ja) * 2007-02-05 2008-08-21 Oki Electric Ind Co Ltd 半導体装置製造方法
JP2009272477A (ja) * 2008-05-08 2009-11-19 Rohm Co Ltd Ｍｅｍｓセンサおよびその製造方法
WO2010052682A2 (en) * 2008-11-10 2010-05-14 Nxp B.V. Mems with poly-silicon cap layer
JP5630243B2 (ja) * 2010-11-30 2014-11-26 セイコーエプソン株式会社 電子装置、電子機器及び電子装置の製造方法
CN103248994A (zh) * 2012-02-06 2013-08-14 苏州敏芯微电子技术有限公司 集成电路与电容式微硅麦克风单片集成的制作方法及芯片
CN103373698B (zh) * 2012-04-26 2015-09-16 张家港丽恒光微电子科技有限公司 制作mems惯性传感器的方法及mems惯性传感器

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