JP2015171740A - Ｍｅｍｓデバイス及びその製造方法 - Google Patents

Ｍｅｍｓデバイス及びその製造方法 Download PDF

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Publication number
JP2015171740A
JP2015171740A JP2014048448A JP2014048448A JP2015171740A JP 2015171740 A JP2015171740 A JP 2015171740A JP 2014048448 A JP2014048448 A JP 2014048448A JP 2014048448 A JP2014048448 A JP 2014048448A JP 2015171740 A JP2015171740 A JP 2015171740A
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JP
Japan
Prior art keywords
insulating film
lid
cavity
external connection
connection electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2014048448A
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English (en)
Japanese (ja)
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JP2015171740A5 (enExample
Inventor
隆彦 吉澤
Takahiko Yoshizawa
隆彦 吉澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2014048448A priority Critical patent/JP2015171740A/ja
Priority to CN201510094983.4A priority patent/CN104909329B/zh
Priority to US14/640,886 priority patent/US9499394B2/en
Publication of JP2015171740A publication Critical patent/JP2015171740A/ja
Publication of JP2015171740A5 publication Critical patent/JP2015171740A5/ja
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/015—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being integrated on the same substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Pressure Sensors (AREA)
JP2014048448A 2014-03-12 2014-03-12 Ｍｅｍｓデバイス及びその製造方法 Withdrawn JP2015171740A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014048448A JP2015171740A (ja) 2014-03-12 2014-03-12 Ｍｅｍｓデバイス及びその製造方法
CN201510094983.4A CN104909329B (zh) 2014-03-12 2015-03-03 微机电系统设备及其制造方法
US14/640,886 US9499394B2 (en) 2014-03-12 2015-03-06 MEMS device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014048448A JP2015171740A (ja) 2014-03-12 2014-03-12 Ｍｅｍｓデバイス及びその製造方法

Publications (2)

Publication Number Publication Date
JP2015171740A true JP2015171740A (ja) 2015-10-01
JP2015171740A5 JP2015171740A5 (enExample) 2017-03-09

Family

ID=54068172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014048448A Withdrawn JP2015171740A (ja) 2014-03-12 2014-03-12 Ｍｅｍｓデバイス及びその製造方法

Country Status (3)

Country Link
US (1) US9499394B2 (enExample)
JP (1) JP2015171740A (enExample)
CN (1) CN104909329B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6314568B2 (ja) * 2014-03-18 2018-04-25 セイコーエプソン株式会社 Ｍｅｍｓデバイス及びその製造方法
JP6331552B2 (ja) * 2014-03-25 2018-05-30 セイコーエプソン株式会社 Ｍｅｍｓデバイス及びその製造方法
CN109541319B (zh) * 2018-10-10 2023-09-01 金华职业技术学院 一种液体介电常数测量方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5798283A (en) * 1995-09-06 1998-08-25 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
JP2005125484A (ja) * 2003-09-29 2005-05-19 Matsushita Electric Ind Co Ltd 微小電気機械システムおよびその製造方法
US20050124089A1 (en) * 2003-12-08 2005-06-09 Gogoi Bishnu P. Method of forming a seal for a semiconductor device
JP2008188711A (ja) * 2007-02-05 2008-08-21 Oki Electric Ind Co Ltd 半導体装置製造方法
JP2009272477A (ja) * 2008-05-08 2009-11-19 Rohm Co Ltd Ｍｅｍｓセンサおよびその製造方法
WO2010052682A2 (en) * 2008-11-10 2010-05-14 Nxp B.V. Mems with poly-silicon cap layer
JP2012119820A (ja) * 2010-11-30 2012-06-21 Seiko Epson Corp 電子装置、電子機器及び電子装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6012336A (en) * 1995-09-06 2000-01-11 Sandia Corporation Capacitance pressure sensor
JP2006289520A (ja) * 2005-04-06 2006-10-26 Toshiba Corp Ｍｅｍｓ技術を使用した半導体装置
CN103248994A (zh) * 2012-02-06 2013-08-14 苏州敏芯微电子技术有限公司 集成电路与电容式微硅麦克风单片集成的制作方法及芯片
CN103373698B (zh) * 2012-04-26 2015-09-16 张家港丽恒光微电子科技有限公司 制作mems惯性传感器的方法及mems惯性传感器

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5798283A (en) * 1995-09-06 1998-08-25 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
JP2005125484A (ja) * 2003-09-29 2005-05-19 Matsushita Electric Ind Co Ltd 微小電気機械システムおよびその製造方法
US20050124089A1 (en) * 2003-12-08 2005-06-09 Gogoi Bishnu P. Method of forming a seal for a semiconductor device
JP2008188711A (ja) * 2007-02-05 2008-08-21 Oki Electric Ind Co Ltd 半導体装置製造方法
JP2009272477A (ja) * 2008-05-08 2009-11-19 Rohm Co Ltd Ｍｅｍｓセンサおよびその製造方法
WO2010052682A2 (en) * 2008-11-10 2010-05-14 Nxp B.V. Mems with poly-silicon cap layer
JP2012119820A (ja) * 2010-11-30 2012-06-21 Seiko Epson Corp 電子装置、電子機器及び電子装置の製造方法

Also Published As

Publication number Publication date
CN104909329B (zh) 2018-03-06
US20150259193A1 (en) 2015-09-17
US9499394B2 (en) 2016-11-22
CN104909329A (zh) 2015-09-16

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