JP2015170676A - Wiring board and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board including a base layer contributing to the improvement of production efficiency and cost reduction and formed with highly reliable vertical-direction conductors thereon and a manufacturing method thereof.SOLUTION: A wiring board includes: a base layer which is made from an inorganic material and is provided with a plurality of holes passing through from a first surface to a second surface; vertical-direction conductors which are made from a conductive composition and are disposed inside each hole of the base layer so as to have lower surfaces connected to the first surface and upper surfaces connected to the second surface; first and second wiring patterns which are provided on each of the first surface and the second surface of the base layer and the lower surfaces and the upper surfaces of the vertical-direction conductors to cover all boundaries between the second surface on the lower surfaces and the upper surfaces of the vertical-direction conductors and the first surface and not to cover partial regions of the lower surfaces and the upper surfaces; and first and second insulation layers located in a laminar form on each of the first surface side and the second surface side of the base layer so as to cover regions which are not covered with the first and second wiring patterns of the lower surfaces and the upper surfaces of the vertical-direction conductors and bury the first and second wiring patterns.

Description

  The present invention relates to a wiring board for mounting an electronic device and a manufacturing method thereof, and more particularly to a wiring board having an inorganic material layer as a base layer and a manufacturing method thereof.

  In recent years, the use of an inorganic material as a wiring board has been expanded in place of a general material in which a substrate material is an organic material such as an epoxy resin. One example is an interposer that converts terminal arrangements to a coarse pitch, which is used to simplify the mounting of semiconductor chip components on a large wiring board (such as a mother board).

  The interposer is mounted with a semiconductor chip as an electronic device on its surface, and in that form, the interposer is further mounted via a wiring board larger than the interposer, or this form of the interposer is directly mounted on a large wiring board. The interposer also has an action to relieve stress caused by the difference in thermal expansion coefficient between the semiconductor chip itself and the wiring substrate, and it is advantageous to use an inorganic material for the plate material.

  As an example of an interposer, there is a substrate material using silicon similar to a semiconductor chip. In the case of silicon, the technology cultivated in the semiconductor manufacturing process can be utilized as a method for forming fine wiring, so that it is very useful. Another example of an interposer is one that uses glass, which is also an inorganic material, as a substrate material. Although it is not possible to use the processing technology for semiconductors as it is for glass, it is very cheap and promising in terms of cost compared to silicon as a material.

  A point to be noted when using a substrate material made of an inorganic material is how to configure the through conductor based on the difference between the material and the substrate made of an organic material. The main viewpoint is generally reliability and cost, but as a premise, a configuration that contributes to refinement so as to take advantage of the inorganic material is preferable.

JP 2010-171377 A

  The present invention relates to a wiring board having an inorganic material layer as at least a base layer for mounting an electronic device, and a method for manufacturing the wiring board, and a longitudinal conductor that contributes to improvement in production efficiency and contributes to cost reduction and high reliability. It aims at providing the wiring board containing the formed base layer, and its manufacturing method.

  In order to solve the above problems, a wiring board according to an aspect of the present invention has a first surface and a second surface opposite to the first surface, and the first surface extends to the second surface. The hole of the base layer having a base layer made of an inorganic material provided with a plurality of through-holes, a lower surface continuous with the first surface of the base layer, and an upper surface continuous with the second surface of the base layer While covering the entire boundary line between the longitudinal conductor made of a conductive composition and filled in each interior, and the lower surface of the longitudinal conductor and the first surface of the base layer, A first wiring pattern provided on the first surface of the base layer and on the lower surface of the vertical conductor so as not to cover a partial region of the lower surface; Covering a region of the lower surface that is not covered with the first wiring pattern and the first wiring pattern Cover the entire boundary line between the first insulating layer positioned in a stacked manner on the first surface side of the base layer and the upper surface of the longitudinal conductor and the second surface of the base layer so as to be embedded. On the other hand, a second wiring pattern provided on the second surface of the base layer and the upper surface of the vertical conductor so as not to cover a part of the upper surface, and the vertical conductor A second insulating layer positioned on the second surface side of the base layer so as to cover a region of the upper surface of the base layer that is not covered with the second wiring pattern and to be embedded in the second wiring pattern. A layer.

  That is, a conductive composition is used as a material for a longitudinal conductor provided in a hole formed through a base layer of an inorganic material. In general, the conductive composition contains a resin. If the conductive composition is used, for example, the filling process of the conductive composition prepared in a paste form with respect to the holes using screen printing can be performed efficiently, and a large cost reduction can be achieved.

  Then, the damage to the first (and second) insulating layer due to the thermal deformation due to the difference in material between the base layer that is an inorganic material and the longitudinal conductor that is a conductive composition is large. It has a configuration to reduce. Specifically, on the first surface of the base layer and in the longitudinal direction so that the lower surface of the vertical conductor covers the entire boundary line with the first surface of the base layer, but does not cover a part of the lower surface. A first wiring pattern is provided on the lower surface of the body. Such a first wiring pattern prevents thermal deformation of the longitudinal conductor from being directly applied as a shearing force to the first insulating layer. The same applies to the relationship between the second wiring pattern and the second insulating layer. Thereby, it is possible to prevent adverse effects such as a crack in the first (and second) insulating layer.

  Furthermore, since the first insulating layer is provided so as to cover a region of the lower surface of the vertical conductor that is not covered by the first wiring pattern, almost all of the periphery of the vertical conductor, including the base layer, is provided. Even if it is an inorganic material, a 1st insulating layer can be functioned as the escape route of the gas and water | moisture content which used the longitudinal direction conductor containing resin as a generation source, and can maintain reliability. The same applies to the second insulating layer. From the above, it is possible to obtain a wiring board including a base layer on which a longitudinal conductor is formed, which contributes to improvement in production efficiency, contributes to cost reduction, and has high reliability.

  Moreover, the method for manufacturing a wiring board according to another aspect of the present invention includes a step of forming a through hole in a base layer made of an inorganic material having a first surface and a second surface opposite to the first surface; A longitudinal conductor having a bottom surface that is continuous with the first surface of the base layer and a top surface that is continuous with the second surface of the base layer by filling the through hole of the base layer with a conductive composition. And covering the entire bottom line of the lower surface of the longitudinal conductor with the first surface of the base layer, while not covering a partial region of the lower surface. A step of providing a first wiring pattern on one surface and on the lower surface of the longitudinal conductor, and covering all of the boundary line between the upper surface of the longitudinal conductor and the second surface of the base layer, On the second surface of the base layer and the longitudinal direction so as not to cover a partial region of the upper surface A step of providing a second wiring pattern on the upper surface of the electric body, and a region of the lower surface of the vertical conductor that is not covered by the first wiring pattern and embedded in the first wiring pattern As described above, a step of forming a first insulating layer in a stacked manner on the first surface side of the base layer, and a region of the upper surface of the vertical conductor that is not covered with the second wiring pattern Forming a second insulating layer in a laminated form on the second surface side of the base layer so as to cover and embed the second wiring pattern.

  This manufacturing method is one aspect for manufacturing the wiring board.

  According to the present invention, in a wiring board having an inorganic material layer as at least a base layer for mounting an electronic device and a method for manufacturing the same, it contributes to improvement in production efficiency, contributes to cost reduction, and has high reliability. A wiring board including a base layer on which a body is formed and a method for manufacturing the wiring board can be provided.

Sectional drawing which shows the structure in the case of an interposer as an example of the wiring board which is one Embodiment, and the top view of the principal part. Explanatory drawing which shows the influence by the longitudinal direction conductor 31 deform | transforming in the interposer shown in FIG. Process drawing which shows the process in which the interposer shown in FIG. FIG. 4 is a continuation diagram of FIG. 3, and is a process diagram schematically showing a process of manufacturing the interposer shown in FIG. 1. Sectional drawing which shows the structure in the case of an interposer as an example of the wiring board which is another embodiment, and the top view of the principal part.

  As an embodiment of the present invention, the base layer may be made of glass. As an inorganic material, glass is very inexpensive and is advantageous in that respect compared to silicon, which is the same inorganic material.

  Further, as an embodiment, the base layer is a base layer provided with the holes so that the planar shapes of the first surface and the second surface of the holes are circular, respectively, and the first wiring pattern is Having a ring-like shape concentric with the circle in the first surface of the hole of the base layer having an outer contour and an inner contour, and the second wiring pattern has an outer contour and an inner contour; The base layer may have a ring shape concentric with the circular shape on the second surface of the hole.

  This is an example of the planar shape of the hole provided in the base layer, and is an example of the shape of the first and second wiring patterns in that case. If both the first surface and the second surface of the base layer are circular as the planar shape of the hole, it is considered that the hole processing is most easy. Further, if the first and second wiring patterns are formed in a ring shape according to the planar shape of the hole, the circular shape is considered to be a pattern suitable for miniaturization, which is convenient for refinement.

  Further, as an embodiment, further comprising a third wiring pattern provided so as to be in contact with the lower surface of the vertical conductor, further on the inner side away from the inner contour of the first wiring pattern, The first insulating layer is provided so as to embed the third wiring pattern, and is opposite to the side in contact with the longitudinal conductor so as to penetrate the first insulating layer. And a first insulating layer through conductor provided on the third wiring pattern.

  In this aspect, the third wiring pattern serves as a conductor that electrically assists the first wiring pattern. If such a third wiring pattern is provided, the first insulation is formed immediately above the third wiring pattern. A layer through conductor can be provided. Therefore, the degree of freedom of arrangement of the first insulating layer through conductor can be increased as the wiring board.

  Further, as an embodiment, further comprising a third wiring pattern provided so as to be in contact with the upper surface of the vertical conductor, further on the inner side away from the inner contour of the second wiring pattern, The second insulating layer is provided so as to embed the third wiring pattern, and is opposite to the side in contact with the longitudinal conductor so as to penetrate the second insulating layer. And a second insulating layer through conductor provided on the third wiring pattern.

  This aspect is the same as the above case. In this case, it becomes an advantage on the side of the base layer on which the second wiring pattern and the second insulating layer are provided.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view (FIG. 1 (a)) schematically showing a configuration in the case of an interposer as an example of a wiring board according to an embodiment and a plan view (FIG. 1 (b)) of a main part.

  As shown in the figure, this interposer includes a glass base layer 11, resin layers (interlayer insulating layers) 12, 13, wiring patterns 21a, 21c, 22a, 22c, via-hole plated vias 21b, 22b, nickel gold plated layer 21d, 22d, longitudinal conductors 31, wiring cover films (solder resist films) 41, 42, and solder balls 51. The cross section shown in FIG. 1A corresponds to the cross section at the position A-Aa shown in FIG. The illustration of FIG. 1B is a plan view of the main part depicting only the elements shown in the figure.

  As an outline, in this interposer, a semiconductor chip (not shown) is mounted by, for example, flip-chip bonding using a portion of the nickel gold plating layer 22d on the upper surface shown in FIG. The entire structure can be surface-mounted on another larger resin wiring board (not shown) using the solder balls 51 on the lower surface. The arrangement pitch of the lands having the nickel gold plating layer 22d is a narrow pitch corresponding to that of a terminal (not shown) of the semiconductor chip, and the solder balls 51 are arranged at a wider pitch.

  The interposer simplifies the mounting of semiconductor chip components with a narrow terminal pitch on a large wiring board (such as a mother board). In addition, the nickel gold plating layer 22d is not formed, but a form in which copper metal bumps are formed on the wiring pattern 22c instead is also conceivable. In this case, this metal bump is connected to another metal bump (terminal) provided on the surface of the semiconductor chip for mounting a semiconductor chip (not shown).

  The connection land having the nickel gold plating layer 22d is electrically connected to the wiring pattern 22c, the via hole plating via 22b, the wiring pattern 22a, the vertical conductor 31, the wiring pattern 21a, the via hole plating via 21b, the wiring pattern 21c, nickel. It is electrically connected to the solder ball 51 through the gold plating layer 21d.

  While the above-described vertical and horizontal conductor portions exist, the glass base layer 11, the resin layers 12 and 13, and the wiring cover films 41 and 42 are insulators. Can be arranged (or protected) as desired. Among the insulators, the glass base layer 11 is a layer corresponding to a core layer using glass as the name suggests, and since the coefficient of thermal expansion is considerably smaller than that of a resin material, a semiconductor chip (non-conductive) attached to the interposer is used. It is possible to greatly reduce the stress caused by the difference in coefficient of thermal expansion from that shown in the figure.

  The vertical conductor 31 provided through the glass base layer 11 is a conductor made of a conductive composition disposed in a via hole 11 a formed through the glass base layer 11. The longitudinal conductor 31 is provided by filling the inside of each via hole 11 a so as to have a lower surface and an upper surface that are continuous with both surfaces of the base layer 11. If a conductive composition is used, the filling process of the conductive composition prepared in a paste form with respect to the via hole 11a using, for example, screen printing can be efficiently performed, and a large cost reduction can be achieved.

  In addition, the vertical conductor 31 and the wiring patterns 21a and 22a are related to the resin layers 12 and 13 due to their thermal deformation caused by the difference in material between the glass base layer 11 and the vertical conductor 31. It has a configuration that greatly reduces the damage. Specifically, the wiring pattern 21a (22a) covers all of the lower surface (upper surface) of the vertical conductor 31 on the boundary line with the surface of the base layer 11, while covering a part of the lower surface (upper surface). It is provided on the surface of the base layer 11 and on the lower surface (upper surface) of the longitudinal conductor 31 (see FIG. 1B).

  With such a configuration, the thermal deformation of the longitudinal conductor 31 is prevented from being directly applied as a shearing force to the resin layer 12 (13). Therefore, the wiring pattern 21a (22a) is embedded on the base layer 11. Adverse effects such as the occurrence of cracks in the laminated resin layer 12 (13) can be prevented. FIG. 2 supplementarily illustrates this point.

  FIG. 2 is an explanatory diagram showing the influence of deformation of the longitudinal conductor 31 in the interposer shown in FIG. 1, and the reference numerals used in FIG. 1 are not changed. Since the thermal expansion coefficient of the vertical conductor 31 is several times greater than that of the glass base layer 11, the glass base layer 11 is expanded on the upper and lower surfaces of the vertical conductor 31 by expansion due to heat generated by surrounding electronic devices during use. Attempts to deform in a direction that protrudes. Therefore, as shown in FIG. 2, by providing the wiring patterns 21a and 22a at the above-described positions, the deformation of the vertical conductor 31 is prevented from being directly applied as the shearing force to the resin layers 12 and 13. Is done.

  The wiring patterns 21a and 22a are provided so as not to cover the entire area of the lower and upper surfaces of the vertical conductor 31 for the following reason. In other words, there are inorganic materials such as the base layer 11 and the wiring patterns 21a and 22a around the vertical conductor 31, and these inorganic materials contain gas or moisture that originates from the vertical conductor 31 containing resin. Does not function as an escape route. Therefore, by configuring the lower surface and a part of the upper surface of the vertical conductor 31 to be covered with the resin layers 12 and 13, the resin layer 12 and 13 may be gas or moisture using the vertical conductor 31 as a source. To function as an escape route. Thereby, it is possible to maintain a large reliability as the vertical conductor 31.

  As described above, according to this embodiment, the interposer can be configured so as to include the base layer 11 on which the longitudinal conductors 31 that contribute to the improvement of production efficiency and contribute to cost reduction and high reliability are formed.

  In the present embodiment, more specifically, the planar shape of the via hole 11a on the surface of the base layer 11 is circular, and the wiring patterns 21a and 22a have the outer contour and the inner contour, and the via hole 11a on the surface of the base layer 11 has. It has a ring shape concentric with the shape. If the via hole 11a has a circular shape on the surface of the base layer 11 as the planar shape, the hole is most easily processed, and if the wiring patterns 21a and 22a have a ring shape in accordance with the planar shape of the via hole 11a, a circular shape is obtained. Since the shape is considered to be a pattern suitable for miniaturization, it is considered convenient for refinement.

  More specifically, the relationship between the diameter of the via hole 11a and the diameter of the inner contour of the wiring patterns 21a and 22a is set to about 2 to 1, and the diameter of the via hole 11a and the outer contour of the wiring patterns 21a and 22a Setting the relationship of 2 to 3 is a well-balanced layout. In this way, the above-described effects can be maintained and refinement can be realized while sufficiently dealing with the formation position deviation between the via hole 11a and the wiring pattern 21a.

  Although one embodiment has been described above, supplementary explanation will be given below. The structure of the resin layers 12 and 13 which are wiring interlayer insulation layers, and conductors connected to or electrically connected to the longitudinal conductor 31 (wiring pattern 21a, via hole plating via 21b, wiring pattern 21c, wiring pattern 22a, via hole plating) Various known configurations can be used for the configuration of the via 22b and the wiring pattern 22c). The number of insulating layers and wiring patterns can be arbitrarily selected as necessary.

  For example, the via-hole plated via may be replaced with a via made of a conductive composition. For the wiring pattern, in addition to subtractive formation by etching a metal foil (for example, copper foil), additive formation such as application of a conductive paste (for example, metal nanopaste) or formation by plating can be employed. Various known materials can be used for the specific material of the resin layer and the specific material of each conductor.

  In addition, with respect to the via hole 11a, a metal (for example, copper) plating layer is formed on the inner wall surface, in addition to the longitudinal conductor 31 made of the conductive composition facing the glass material of the inner wall surface as it is. Alternatively, the longitudinal conductor 31 may be formed by filling the conductive composition. In this way, a lower resistance can be formed as the longitudinal conductor. In this case, since the vertical conductor is increased in size in the horizontal direction by the formation thickness of the plating layer, the plating layer is formed thinner to prevent the arrangement density of the vertical conductors 31 from being lowered. pay attention to.

  Moreover, about the raw material of the glass base layer 11, it is preferable to use glass like this form from the viewpoint of low cost. However, it is possible to use not only glass but also other inorganic materials, for example, a semiconductor plate such as silicon. In the case of using silicon, for example, after forming a via hole 11a in the silicon base layer, this silicon base layer is subjected to a thermal oxidation process, and a thermal oxide film (= insulation) is formed on the entire surface including the inner wall surface of the via hole 11a. Film). According to this, even if a conductor is positioned in the via hole 11a, insulation between these conductors can be ensured, and even if the wiring patterns 21a and 22a are formed at the illustrated positions, no trouble occurs.

  Next, an example of a process for manufacturing the interposer shown in FIG. 1 will be described below. 3 and 4 are process diagrams showing a main manufacturing process of the interposer substrate shown in FIG. 3 and 4, the same or equivalent parts as those shown in FIG. 1 are denoted by the same reference numerals.

  First, as shown in FIG. 3A, a glass base layer 11 (assumed thickness is, for example, 50 μm to 1000 μm, typically 300 μm) before processing is prepared, and via holes 11a ( The hole diameter is, for example, 10 μm to 100 μm (typically, for example, 60 μm). In addition to laser processing, etching may be performed to expand or smooth the inner wall of the hole with hydrofluoric acid. Further, when a photoreactive glass such as a photosensitive glass is used as the glass base layer 11, the drilling process becomes easier. Instead of laser processing, hole formation by a known method such as sand blasting may be employed.

  Next, the formed via hole 11a is filled with a conductive composition to be the longitudinal conductor 31 by using, for example, screen printing. The screen plate used at this time is provided with printing holes (pits) at positions corresponding to the positions of the via holes 11a. The conductive composition to be printed is a well-known composition having fine metal particles (for example, silver particles) dispersed in a thermosetting resin and having conductivity as a whole.

  Once the via hole 11a is filled with the conductive composition, the conductive composition is then dried and further thermally cured. When the conductive composition is dried and cured, the vertical conductor 31 is formed (see FIG. 3B). The manufacturing process related to the glass base layer 11 has been described above.

  Next, as shown in FIG. 3C, wiring patterns 21a and 22a are formed on the upper and lower surfaces of the glass base layer 11 after the vertical conductors 31 are formed. As a forming method, for example, (1) a metal foil (copper foil) is stacked and etched, and (2) a metal (copper) pattern is formed using processes such as sputtering, vapor deposition, and plating. (3) A conductive pattern is formed by applying a conductive paste (for example, a metal nano paste), and the like.

  For example, when the wiring patterns 21a and 22a are formed by a plating process, for example, the following steps are performed. First, a seed layer (for example, a copper layer after a chromium layer (chromium nickel layer)) is formed by sputtering, for example, on the upper and lower surfaces of the glass base layer 11 after the vertical conductor 31 is formed. Next, a resist film is selectively formed on the seed layer, and an electrolytic copper plating process is performed in that state. Then, the resist film is removed, and the seed layer appearing under the resist film is removed by etching. Thereby, the wiring patterns 21a and 22a can be formed according to the missing pattern by the resist film.

  After the wiring patterns 21a and 22a are formed, the resin layers 12 and 13 are stacked and formed on them. The resin layers 12 and 13 can be formed by, for example, using a thermosetting resin, laminating an uncured state at first, fluidizing it by heating and pressing, and then curing it. Next, via holes 21h and 22h are formed in the formed resin layers 12 and 13 by laser processing, for example, corresponding to the position of via-hole plating to be formed (see FIG. 4A).

  Then, a plating process is performed so that the via holes 21b and 22b are formed by filling the via holes and the wiring patterns 21c and 22c are formed (see FIG. 4B). Note that the wiring patterns 21c and 22c can be provided by a process or method different from that of the vias 21b and 22b (similar to the description of the wiring patterns 21a and 22a).

  After completing the formation of the wiring patterns 21c and 22c, next, the wiring cover films 41 and 42 are formed, and then the nickel gold plating layers 21d and 22d are formed. From the above, the interposer shown in FIG. 1 can be manufactured. The solder ball 51 is actually attached in many cases after mounting a semiconductor chip (not shown) on a connection land on which the nickel gold plating layer 22d is formed.

  Next, with reference to FIG. 5, the case of an interposer will be described as an example of a wiring board according to another embodiment. FIG. 5 is a cross-sectional view schematically showing a configuration in the case of an interposer as an example of a wiring board according to another embodiment, and a plan view of the main part. The same reference numerals are given to the objects. The description is omitted unless there is a matter to be added. In addition, the cross section shown to Fig.5 (a) is corresponded in the cross section in the B-Ba position shown in FIG.5 (b). The illustration of FIG. 5B is a plan view of the main part depicting only the elements shown in the figure.

  The difference in configuration of this interposer from that shown in FIG. 1 is that the interposer is further away from the inner contours of the wiring patterns 21a and 22a and further inwardly in contact with the upper and lower surfaces of the vertical conductor 31. Are provided with conductors (wiring patterns 21a1, 22a1) respectively. The wiring patterns 22a1 and 22a1 are the same projected figures in the direction in which the glass base layer 11 is viewed in plan. Electrically, the new wiring pattern 21a1 can be regarded as a conductor that assists the original wiring pattern 21a, and the new wiring pattern 22a1 can be regarded as a conductor that assists the original wiring pattern 22a. It is also possible to adopt a configuration in which only one of the new wiring patterns 22a1 and 22a1 is newly provided.

  In this interposer, since the wiring patterns 21a1 and 22a1 are newly provided, via holes 21b and 22b in the via holes can be provided immediately above the wiring patterns 21a1 and 22a1, respectively. Therefore, the degree of freedom of via arrangement as an interposer is increased. In other words, the arrangement of the via-hole plated vias 21b and 22b can be maintained at the same position as that in the interposer shown in FIG.

  The wiring patterns 21a, 21a1, 22a, and 22a1 are the same as those shown in FIG. 1 in that the wiring patterns 21a, 21a1, 22a, and 22a1 are provided so as not to cover all of the lower and upper surface regions of the vertical conductor 31. The effect by this is maintained. Although the manufacturing process of the interposer shown in FIG. 5 is not particularly described, it can be easily grasped from the description of the above configuration and the manufacturing process described with reference to FIGS.

  In the above description of the embodiment, the case of an interposer is given as an example. However, the present invention is not limited to an interposer, and even in the case of a general wiring board, it contributes to an improvement in production efficiency and contributes to cost reduction and reliability. The effect of having a base layer on which a highly conductive vertical conductor is formed remains the same.

  DESCRIPTION OF SYMBOLS 11 ... Glass base layer, 11a ... Via hole, 12, 13, 14, 15 ... Resin layer (interconnection layer insulation layer), 21a, 21a1, 21c, 22a, 22a1, 22c ... Wiring pattern, 21b, 22b ... Plating via in via hole 21d, 22d ... nickel gold plating layer, 21h, 22h ... via hole, 31 ... longitudinal conductor, 41, 42 ... wiring cover film (solder resist film), 51 ... solder ball.

Claims (6)

A base layer made of an inorganic material having a first surface and a second surface opposite to the first surface, and a plurality of holes penetrating from the first surface to the second surface;
A conductive composition arranged to fill the inside of each of the holes of the base layer so as to have a lower surface continuous with the first surface of the base layer and an upper surface continuous with the second surface of the base layer. A longitudinal conductor made of
The lower surface of the vertical conductor covers the entire boundary line with the first surface of the base layer, but does not cover a part of the lower surface. A first wiring pattern provided on the lower surface of the longitudinal conductor;
Positioned in a stacked manner on the first surface side of the base layer so as to cover a region of the lower surface of the vertical conductor that is not covered by the first wiring pattern and to embed the first wiring pattern. A first insulating layer that
The upper surface of the longitudinal conductor covers the entire boundary line with the second surface of the base layer, but does not cover a part of the upper surface, and covers the second surface of the base layer and the A second wiring pattern provided on the upper surface of the vertical conductor;
Positioned in a stacked manner on the second surface side of the base layer so as to cover a region of the upper surface of the vertical conductor that is not covered with the second wiring pattern and to embed the second wiring pattern. A wiring board comprising: a second insulating layer.   The wiring board according to claim 1, wherein the base layer is made of glass. The base layer is a base layer provided with the holes so that the planar shapes of the first surface and the second surface of the holes are respectively circular;
The first wiring pattern has an outer contour and an inner contour, and has a ring-like shape concentric with the circle in the first surface of the hole of the base layer;
The wiring board according to claim 1, wherein the second wiring pattern has an outer contour and an inner contour, and has a ring shape concentric with the circle in the second surface of the hole of the base layer. A third wiring pattern provided so as to be in contact with the lower surface of the longitudinal conductor further inside and spaced from the inner contour of the first wiring pattern;
The first insulating layer is provided to embed the third wiring pattern;
The first insulating layer through conductor provided on the third wiring pattern on the side opposite to the side in contact with the longitudinal conductor so as to penetrate the first insulating layer. 3. The wiring board according to 3. A third wiring pattern provided to be in contact with the upper surface of the vertical conductor further inside and spaced from the inner contour of the second wiring pattern;
The second insulating layer is provided to embed the third wiring pattern;
The semiconductor device further includes a second insulating layer through conductor provided on the third wiring pattern on a side opposite to the side in contact with the longitudinal conductor so as to penetrate the second insulating layer. 3. The wiring board according to 3. Forming a through hole in a base layer made of an inorganic material having a first surface and a second surface opposite to the first surface;
A longitudinal conductor having a bottom surface that is continuous with the first surface of the base layer and a top surface that is continuous with the second surface of the base layer by filling the through hole of the base layer with a conductive composition. Forming, and
The lower surface of the vertical conductor covers the entire boundary line with the first surface of the base layer, but does not cover a part of the lower surface. Providing a first wiring pattern on the lower surface of the longitudinal conductor;
The upper surface of the longitudinal conductor covers the entire boundary line with the second surface of the base layer, but does not cover a part of the upper surface, and covers the second surface of the base layer and the Providing a second wiring pattern on the upper surface of the longitudinal conductor;
The base layer is stacked on the first surface side so as to cover a region of the lower surface of the vertical conductor that is not covered by the first wiring pattern and to embed the first wiring pattern. Forming an insulating layer of 1;
The upper surface of the vertical conductor is stacked on the second surface side of the base layer so as to cover a region not covered by the second wiring pattern and to embed the second wiring pattern. And a step of forming an insulating layer.

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