JP2015170662A - 半導体製造装置及び半導体装置の製造方法 - Google Patents
半導体製造装置及び半導体装置の製造方法 Download PDFInfo
- Publication number
- JP2015170662A JP2015170662A JP2014043220A JP2014043220A JP2015170662A JP 2015170662 A JP2015170662 A JP 2015170662A JP 2014043220 A JP2014043220 A JP 2014043220A JP 2014043220 A JP2014043220 A JP 2014043220A JP 2015170662 A JP2015170662 A JP 2015170662A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- microwave
- chamber
- heating means
- manufacturing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 49
- 238000010438 heat treatment Methods 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 230000001678 irradiating effect Effects 0.000 claims description 9
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 150000002367 halogens Chemical class 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 32
- 239000013078 crystal Substances 0.000 description 25
- 239000002184 metal Substances 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 19
- 229910021417 amorphous silicon Inorganic materials 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 239000010453 quartz Substances 0.000 description 10
- 238000011109 contamination Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000007769 metal material Substances 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- 150000003377 silicon compounds Chemical class 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/02447—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/6447—Method of operation or details of the microwave heating apparatus related to the use of detectors or sensors
- H05B6/645—Method of operation or details of the microwave heating apparatus related to the use of detectors or sensors using temperature sensors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/70—Feed lines
- H05B6/707—Feed lines using waveguides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/80—Apparatus for specific applications
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Recrystallisation Techniques (AREA)
- Constitution Of High-Frequency Heating (AREA)
Abstract
【解決手段】本実施形態に係る半導体製造装置は、支持部と、チャンバと、マイクロ波発生器と、導波管と、補助加熱手段とを備える。支持部は、ウエハを支持する。チャンバは、支持部を収容する。マイクロ波発生器は、マイクロ波を発生させる。導波管は、ウエハの表面にマイクロ波が照射されるようにチャンバに取り付けられる。補助加熱手段は、マイクロ波より短い波長の電磁波によりウエハを加熱する。
【選択図】図1
Description
図1は、第1実施形態に係る半導体製造装置を示す概略構成図である。図1の半導体製造装置は、支持部11と、チャンバ12と、マイクロ波発生器13と、導波管14と、温度計15と、冷却器16と、補助加熱手段17と、を備えている。
次に、第2実施形態に係る半導体製造装置について図3,図4を参照して説明する。本実施形態に係る半導体製造装置は、第1のチャンバ112と第2のチャンバ212とを備える。ここで、図3は第1のチャンバ112を示す概略構成図であり、図4は第2のチャンバ212を示す概略構成図である。
Claims (9)
- ウエハを支持する支持部と、
前記支持部を収容するチャンバと、
マイクロ波を発生させるマイクロ波発生器と、
前記ウエハの表面又は裏面に前記マイクロ波が照射されるように前記チャンバに取り付けられた導波管と、
前記マイクロ波より短い波長の電磁波により前記ウエハを加熱する補助加熱手段と、
を備える半導体製造装置。 - 前記補助加熱手段は、ホットプレート、ハロゲンランプ、アークランプ、及びレーザ装置のいずれか1つである
請求項1に記載の半導体製造装置。 - 前記導波管は、前記ウエハの表面又は裏面に対して非垂直な方向に前記マイクロ波を照射する
請求項1又は請求項2に記載の半導体製造装置。 - 前記チャンバの内壁は、非金属材料により被覆された
請求項1〜請求項3のいずれか1項に記載の半導体製造装置。 - チャンバ内の支持部上にウエハを設置し、
マイクロ波発生器からマイクロ波を発生させ、前記チャンバに取り付けられた導波管から、前記ウエハの表面又は裏面に前記マイクロ波を照射するとともに、補助加熱手段から前記マイクロ波より波長が短い電磁波を前記ウエハに照射することにより、前記ウエハを加熱する
ことを含む半導体装置の製造方法。 - 前記マイクロ波及び前記マイクロ波より波長が短い電磁波により、前記ウエハを700℃以上の温度まで加熱する
請求項5に記載の半導体装置の製造方法。 - 前記マイクロ波及び前記マイクロ波より波長が短い電磁波により前記ウエハを加熱した後、前記マイクロ波より波長が短い電磁波の出力を低下させ、前記マイクロ波の照射を継続する
請求項5又は請求項6に記載の半導体装置の製造方法。 - 前記補助加熱手段は、ホットプレート、ハロゲンランプ、アークランプ、及びレーザ装置のいずれか1つである
請求項5〜請求項7のいずれか1項に記載の半導体装置の製造方法。 - チャンバ内にウエハを設置し、
前記チャンバ内に設けられた第1の加熱手段からマイクロ波より波長が短い電磁波を発生させ、当該電磁波を前記ウエハに照射した後、第2の加熱手段からからマイクロ波を発生させ、当該マイクロ波を前記ウエハの表面に照射する
半導体装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014043220A JP6163442B2 (ja) | 2014-03-05 | 2014-03-05 | 半導体製造装置及び半導体装置の製造方法 |
US14/465,247 US20150255317A1 (en) | 2014-03-05 | 2014-08-21 | Semiconductor manufacturing equipment and manufacturing method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014043220A JP6163442B2 (ja) | 2014-03-05 | 2014-03-05 | 半導体製造装置及び半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015170662A true JP2015170662A (ja) | 2015-09-28 |
JP6163442B2 JP6163442B2 (ja) | 2017-07-12 |
Family
ID=54018077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014043220A Active JP6163442B2 (ja) | 2014-03-05 | 2014-03-05 | 半導体製造装置及び半導体装置の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20150255317A1 (ja) |
JP (1) | JP6163442B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107706127A (zh) * | 2017-07-18 | 2018-02-16 | 中国科学院微电子研究所 | 一种混合退火装置及退火方法 |
JPWO2018163386A1 (ja) * | 2017-03-09 | 2019-12-26 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法およびプログラム |
JP2022176165A (ja) * | 2021-05-14 | 2022-11-25 | 日揚科技股▲分▼有限公司 | レーザーとマイクロ波を統合したアニールシステム及びアニール方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9129918B2 (en) * | 2013-10-30 | 2015-09-08 | Taiwan Semiconductor Manufacturing Company Limited | Systems and methods for annealing semiconductor structures |
JP6596285B2 (ja) | 2015-09-24 | 2019-10-23 | 東芝メモリ株式会社 | マイクロ波照射装置および基板処理方法 |
US20180142355A1 (en) * | 2016-11-18 | 2018-05-24 | Adnanotek Corp. | System integrating atomic layer deposition and reactive ion etching |
IT201700106479A1 (it) | 2017-09-22 | 2019-03-22 | Univ Degli Studi Roma La Sapienza | Gruppo per la deposizione di nanostrutture di silicio |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62229924A (ja) * | 1986-03-31 | 1987-10-08 | Canon Inc | 半導体の改質処理方法 |
JP2001523038A (ja) * | 1997-11-07 | 2001-11-20 | エーケーティー株式会社 | マイクロ波エネルギを使用したアモルファスフィルムのアニール方法 |
JP2005044822A (ja) * | 2003-07-22 | 2005-02-17 | Shibaura Mechatronics Corp | プラズマ処理装置 |
JP2006156995A (ja) * | 2004-11-04 | 2006-06-15 | Tokyo Electron Ltd | 絶縁膜形成方法およびコンピュータ記録媒体 |
JP2008243965A (ja) * | 2007-03-26 | 2008-10-09 | Toshiyuki Takamatsu | 半導体処理装置および半導体処理方法 |
JP2011066254A (ja) * | 2009-09-18 | 2011-03-31 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2011181842A (ja) * | 2010-03-03 | 2011-09-15 | Toshiba Corp | 半導体装置の製造方法 |
JP2013251361A (ja) * | 2012-05-31 | 2013-12-12 | Tokyo Electron Ltd | 半導体装置の製造方法およびアニール方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5103182A (en) * | 1990-04-02 | 1992-04-07 | Texas Instruments Incorporated | Electromagnetic wave measurement of conductive layers of a semiconductor wafer during processing in a fabrication chamber |
KR100382725B1 (ko) * | 2000-11-24 | 2003-05-09 | 삼성전자주식회사 | 클러스터화된 플라즈마 장치에서의 반도체소자의 제조방법 |
JP2006339253A (ja) * | 2005-05-31 | 2006-12-14 | Toshiba Corp | プラズマ処理装置及びプラズマ処理方法 |
WO2007088904A1 (ja) * | 2006-01-31 | 2007-08-09 | Tokyo Electron Limited | マイクロ波プラズマ処理装置 |
US7968383B2 (en) * | 2007-12-20 | 2011-06-28 | Konica Minolta Holdings, Inc. | Electronic device and method of manufacturing the same |
US20110254078A1 (en) * | 2008-09-30 | 2011-10-20 | Tokyo Electron Limited | Method for depositing silicon nitride film, computer-readable storage medium, and plasma cvd device |
JP2014032766A (ja) * | 2012-08-01 | 2014-02-20 | Tokyo Electron Ltd | マイクロ波照射装置 |
-
2014
- 2014-03-05 JP JP2014043220A patent/JP6163442B2/ja active Active
- 2014-08-21 US US14/465,247 patent/US20150255317A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62229924A (ja) * | 1986-03-31 | 1987-10-08 | Canon Inc | 半導体の改質処理方法 |
JP2001523038A (ja) * | 1997-11-07 | 2001-11-20 | エーケーティー株式会社 | マイクロ波エネルギを使用したアモルファスフィルムのアニール方法 |
JP2005044822A (ja) * | 2003-07-22 | 2005-02-17 | Shibaura Mechatronics Corp | プラズマ処理装置 |
JP2006156995A (ja) * | 2004-11-04 | 2006-06-15 | Tokyo Electron Ltd | 絶縁膜形成方法およびコンピュータ記録媒体 |
JP2008243965A (ja) * | 2007-03-26 | 2008-10-09 | Toshiyuki Takamatsu | 半導体処理装置および半導体処理方法 |
JP2011066254A (ja) * | 2009-09-18 | 2011-03-31 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2011181842A (ja) * | 2010-03-03 | 2011-09-15 | Toshiba Corp | 半導体装置の製造方法 |
JP2013251361A (ja) * | 2012-05-31 | 2013-12-12 | Tokyo Electron Ltd | 半導体装置の製造方法およびアニール方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2018163386A1 (ja) * | 2017-03-09 | 2019-12-26 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法およびプログラム |
US11264253B2 (en) | 2017-03-09 | 2022-03-01 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium |
CN107706127A (zh) * | 2017-07-18 | 2018-02-16 | 中国科学院微电子研究所 | 一种混合退火装置及退火方法 |
JP2022176165A (ja) * | 2021-05-14 | 2022-11-25 | 日揚科技股▲分▼有限公司 | レーザーとマイクロ波を統合したアニールシステム及びアニール方法 |
JP7402917B2 (ja) | 2021-05-14 | 2023-12-21 | 日揚科技股▲分▼有限公司 | レーザーとマイクロ波を統合したアニールシステム及びアニール方法 |
US11889609B2 (en) | 2021-05-14 | 2024-01-30 | Highlight Tech Corp. | Annealing system and annealing method integrated with laser and microwave |
Also Published As
Publication number | Publication date |
---|---|
US20150255317A1 (en) | 2015-09-10 |
JP6163442B2 (ja) | 2017-07-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6163442B2 (ja) | 半導体製造装置及び半導体装置の製造方法 | |
JP5738814B2 (ja) | マイクロ波アニール装置及び半導体装置の製造方法 | |
TWI401731B (zh) | 使用脈衝序列退火方法將薄膜固相再結晶的方法 | |
TW504845B (en) | Thin film processing method and thin film processing apparatus | |
TW201631194A (zh) | 矽化鎳奈米線的直接沉積 | |
JP6134274B2 (ja) | 半導体製造装置および半導体装置の製造方法 | |
TWI489554B (zh) | 在dsa類型系統中用於矽雷射退火的適合短波長光 | |
CN102668048A (zh) | 提升辐射加热基板的冷却的设备及方法 | |
CN107924825A (zh) | 半导体器件的制造方法、衬底处理装置及程序 | |
JP3493880B2 (ja) | 輻射加熱装置および加熱方法 | |
TW201421545A (zh) | 被處理體的處理方法 | |
TWI793283B (zh) | 熱處理系統中用於局部加熱的支承板 | |
TW200521416A (en) | Methods and apparatus for in situ substrate temperature monitoring | |
JPWO2020188675A1 (ja) | 半導体装置の製造方法、基板処理装置およびプログラム | |
KR102603029B1 (ko) | 열처리 방법 및 열처리 장치 | |
JP5021347B2 (ja) | 熱処理装置 | |
JP2009215116A (ja) | 化合物半導体単結晶の製造装置および製造方法 | |
TWI535901B (zh) | 矽晶圓及其製造方法 | |
JP2000173946A (ja) | 基板熱処理方法および基板熱処理装置 | |
JP2008243965A (ja) | 半導体処理装置および半導体処理方法 | |
CN109473340B (zh) | 一种低温多晶硅的制备方法及微波加热设备 | |
JP2010080537A (ja) | 基板処理装置 | |
JP2015122399A (ja) | 半導体製造装置および半導体装置の製造方法 | |
WO2019150549A1 (ja) | レーザ処理装置、レーザ処理方法及び半導体装置の製造方法 | |
JP2003100651A (ja) | 基板熱処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160216 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20161215 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170106 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170213 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170523 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170619 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6163442 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |