JP2015140405A5 - - Google Patents
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- Publication number
- JP2015140405A5 JP2015140405A5 JP2014014636A JP2014014636A JP2015140405A5 JP 2015140405 A5 JP2015140405 A5 JP 2015140405A5 JP 2014014636 A JP2014014636 A JP 2014014636A JP 2014014636 A JP2014014636 A JP 2014014636A JP 2015140405 A5 JP2015140405 A5 JP 2015140405A5
- Authority
- JP
- Japan
- Prior art keywords
- ethyl
- epoxycyclohexyl
- glycidoxypropyl
- diethoxysilane
- dimethylsilane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- -1 γ-glycidoxypropyl Chemical group 0.000 description 8
- SOGIFFQYRAXTDR-UHFFFAOYSA-N diethoxy(methyl)silane Chemical compound CCO[SiH](C)OCC SOGIFFQYRAXTDR-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- YDZXUMQBSRQXIN-UHFFFAOYSA-N diethoxy(ethyl)silane Chemical compound CCO[SiH](CC)OCC YDZXUMQBSRQXIN-UHFFFAOYSA-N 0.000 description 1
- CHBHIAULMYNWBG-UHFFFAOYSA-N diethoxy-ethyl-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](CC)(OCC)OCC)CCC2OC21 CHBHIAULMYNWBG-UHFFFAOYSA-N 0.000 description 1
- DGXPASZXUJQWLQ-UHFFFAOYSA-N diethyl(methoxy)silane Chemical compound CC[SiH](CC)OC DGXPASZXUJQWLQ-UHFFFAOYSA-N 0.000 description 1
- LKZLQNPMYAFYFM-UHFFFAOYSA-N diethyl-methoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](CC)(CC)OC)CCC2OC21 LKZLQNPMYAFYFM-UHFFFAOYSA-N 0.000 description 1
- UCXUKTLCVSGCNR-UHFFFAOYSA-N diethylsilane Chemical compound CC[SiH2]CC UCXUKTLCVSGCNR-UHFFFAOYSA-N 0.000 description 1
- WOUUFVMQNDKHSY-UHFFFAOYSA-N dimethoxy(methyl)silane Chemical compound CO[SiH](C)OC WOUUFVMQNDKHSY-UHFFFAOYSA-N 0.000 description 1
- SLQTWNAJXFHMHM-UHFFFAOYSA-N dimethoxy-methyl-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](C)(OC)OC)CCC2OC21 SLQTWNAJXFHMHM-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- XSAUEOCQIPDIQK-UHFFFAOYSA-N ethoxy(diethyl)silane Chemical compound CCO[SiH](CC)CC XSAUEOCQIPDIQK-UHFFFAOYSA-N 0.000 description 1
- XZFFGKZBTQABBO-UHFFFAOYSA-N ethoxy(dimethyl)silane Chemical compound CCO[SiH](C)C XZFFGKZBTQABBO-UHFFFAOYSA-N 0.000 description 1
- WHBCLAYELHHRNR-UHFFFAOYSA-N ethoxy-dimethyl-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](C)(C)OCC)CCC2OC21 WHBCLAYELHHRNR-UHFFFAOYSA-N 0.000 description 1
- YSLVSGVAVRTLAV-UHFFFAOYSA-N ethyl(dimethoxy)silane Chemical compound CC[SiH](OC)OC YSLVSGVAVRTLAV-UHFFFAOYSA-N 0.000 description 1
- HROVXMRQCKFDTL-UHFFFAOYSA-N ethyl-dimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](CC)(OC)OC)CCC2OC21 HROVXMRQCKFDTL-UHFFFAOYSA-N 0.000 description 1
- VJOOEHFQQLYDJI-UHFFFAOYSA-N methoxy(dimethyl)silane Chemical compound CO[SiH](C)C VJOOEHFQQLYDJI-UHFFFAOYSA-N 0.000 description 1
- YKSZBBZEHPPESP-UHFFFAOYSA-N methoxy-dimethyl-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](C)(C)OC)CCC2OC21 YKSZBBZEHPPESP-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014014636A JP5888349B2 (ja) | 2014-01-29 | 2014-01-29 | 粘着剤組成物およびそれを用いた粘着シート |
| PCT/JP2015/051122 WO2015115212A1 (ja) | 2014-01-29 | 2015-01-16 | 粘着剤組成物およびそれを用いた粘着シート |
| US15/115,413 US10538689B2 (en) | 2014-01-29 | 2015-01-16 | Adhesive composition and adhesive sheet using the same |
| EP15743516.5A EP3101080B1 (en) | 2014-01-29 | 2015-01-16 | Adhesive agent composition and adhesive sheet produced using same |
| CN201580005868.3A CN105934492B (zh) | 2014-01-29 | 2015-01-16 | 粘合剂组合物和使用该粘合剂组合物的粘合片材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014014636A JP5888349B2 (ja) | 2014-01-29 | 2014-01-29 | 粘着剤組成物およびそれを用いた粘着シート |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015140405A JP2015140405A (ja) | 2015-08-03 |
| JP2015140405A5 true JP2015140405A5 (cg-RX-API-DMAC7.html) | 2016-01-21 |
| JP5888349B2 JP5888349B2 (ja) | 2016-03-22 |
Family
ID=53756789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014014636A Active JP5888349B2 (ja) | 2014-01-29 | 2014-01-29 | 粘着剤組成物およびそれを用いた粘着シート |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10538689B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP3101080B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5888349B2 (cg-RX-API-DMAC7.html) |
| CN (1) | CN105934492B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2015115212A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105860890A (zh) * | 2016-06-11 | 2016-08-17 | 南京晶云化工有限公司 | 一种金属黏结用胶黏剂及其制备方法 |
| CN106634718B (zh) * | 2016-12-29 | 2018-10-12 | 安徽浩丰特种电子材料有限公司 | 一种储存时间长且具有优异浸渗性的环氧树脂灌封胶 |
| US11123972B2 (en) * | 2017-10-27 | 2021-09-21 | Entrotech, Inc. | Method for applying a polymeric film to a substrate and resulting articles |
| JP7509683B2 (ja) | 2017-10-27 | 2024-07-02 | ピーピージー・アドバンスト・サーフェス・テクノロジーズ・エルエルシー | 高分子フィルムを下地に適用する方法および得られる物品 |
| CN109837032B (zh) * | 2017-11-27 | 2024-02-13 | 中国科学院大连化学物理研究所 | 一种金属表面用高拉伸强度快速固化胶黏剂的结构及应用 |
| JP7404912B2 (ja) * | 2019-03-26 | 2023-12-26 | Tdk株式会社 | 磁心用複合磁性材料前駆体、磁心用複合材料、磁心および電子部品 |
| JP7346887B2 (ja) * | 2019-04-15 | 2023-09-20 | 三菱ケミカル株式会社 | 粘接着剤組成物、粘接着剤、粘接着シート、及び積層体 |
| CN110484178A (zh) * | 2019-07-30 | 2019-11-22 | 安徽中科光电色选机械有限公司 | 一种应用于色选机电磁阀上的密封填充树脂胶水及其制备方法 |
| CN110764649A (zh) * | 2019-10-22 | 2020-02-07 | 广州视源电子科技股份有限公司 | 触控显示组件与其贴合方法 |
| JP7484557B2 (ja) * | 2020-08-18 | 2024-05-16 | 三菱ケミカル株式会社 | 粘接着剤組成物、粘接着シート及び積層体 |
| CN113322036B (zh) * | 2021-05-06 | 2023-05-05 | 广东风华高新科技股份有限公司 | 一种低温固化浆料及其制备方法和应用 |
| CN119731283A (zh) | 2022-09-05 | 2025-03-28 | 大日本印刷株式会社 | 粘接片、粘接剂组合物及结构体 |
| CN117415895B (zh) * | 2023-10-19 | 2024-12-20 | 上海拉迷家具有限公司 | 一种防霉抗压衣柜复合板材及其加工工艺 |
| CN119042423B (zh) * | 2024-08-22 | 2025-07-29 | 江苏联特消防科技有限公司 | 一种内衬薄壁不锈钢管钢丝骨架pe复合管及其生产工艺 |
| CN120865835B (zh) * | 2025-09-28 | 2025-12-26 | 杭州之江有机硅化工有限公司 | 一种脱醇型有机硅密封胶及其制备方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01215818A (ja) * | 1988-02-23 | 1989-08-29 | Hitachi Chem Co Ltd | 耐熱性樹脂組成物 |
| JPH05112631A (ja) * | 1991-10-22 | 1993-05-07 | Hitachi Chem Co Ltd | 冷凍機モートルコイル含浸用ワニス |
| TW572964B (en) * | 2000-09-21 | 2004-01-21 | Chang Chun Plastics Co Ltd | Flame retarded epoxy resin composition |
| JP2003082034A (ja) | 2001-09-13 | 2003-03-19 | Hitachi Chem Co Ltd | アクリル樹脂、これを用いた接着剤及び接着フィルム |
| JP2003277591A (ja) * | 2002-03-26 | 2003-10-02 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物、プリプレグ及び積層板 |
| US7883766B2 (en) * | 2005-07-13 | 2011-02-08 | Mitsubishi Rayon Co., Ltd. | Prepreg |
| JP4985920B2 (ja) * | 2006-06-16 | 2012-07-25 | Ｊｓｒ株式会社 | 熱硬化性樹脂組成物および光半導体用接着剤 |
| CN102604333B (zh) * | 2006-06-30 | 2016-10-05 | 东丽株式会社 | 环氧树脂组合物、预浸料及纤维增强复合材料 |
| US20090068596A1 (en) * | 2007-08-06 | 2009-03-12 | Ren Yang | Negative-tone,Ultraviolet Photoresists for Fabricating High Aspect Ratio Microstructures |
| EP2253666B1 (en) * | 2008-02-15 | 2012-05-23 | Kuraray Co., Ltd. | Curable resin composition and cured resin |
| TWI435887B (zh) * | 2008-02-26 | 2014-05-01 | Toray Industries | 環氧樹脂組成物、預浸透物及纖維強化複合材料 |
| BRPI0913791A2 (pt) * | 2008-09-29 | 2019-09-24 | Toray Industries | composição de resina epóxi, resina epóxi curda, compósito pré-impregnado e material compósito reforçado com fibra |
| US7843244B1 (en) * | 2009-07-02 | 2010-11-30 | Apple Inc. | Low latency synchronizer circuit |
| JP5716339B2 (ja) | 2010-01-08 | 2015-05-13 | 大日本印刷株式会社 | 粘接着シートおよびそれを用いた接着方法 |
| US20110253943A1 (en) | 2010-04-19 | 2011-10-20 | Trillion Science, Inc. | One part epoxy resin including a low profile additive |
| EP2620460A4 (en) * | 2010-09-24 | 2017-04-05 | Toray Industries, Inc. | Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material |
| JP2013006974A (ja) * | 2011-06-24 | 2013-01-10 | Dainippon Printing Co Ltd | 接着剤組成物およびそれを用いた接着シート |
| RU2605985C2 (ru) * | 2012-09-17 | 2017-01-10 | 3М Инновейтив Пропертиз Компани | Порошковые эпоксидные композиции для покрытий, способы и изделия |
| JP6044243B2 (ja) * | 2012-10-02 | 2016-12-14 | 大日本印刷株式会社 | 接着剤組成物およびそれを用いた接着シート |
| WO2014103040A1 (ja) * | 2012-12-28 | 2014-07-03 | 大日本印刷株式会社 | 接着剤組成物およびそれを用いた接着シート |
| KR102472818B1 (ko) * | 2014-11-28 | 2022-12-02 | 다이니폰 인사츠 가부시키가이샤 | 점착제 조성물, 및 그것을 사용한 점착 시트 |
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2014
- 2014-01-29 JP JP2014014636A patent/JP5888349B2/ja active Active
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2015
- 2015-01-16 US US15/115,413 patent/US10538689B2/en active Active
- 2015-01-16 CN CN201580005868.3A patent/CN105934492B/zh active Active
- 2015-01-16 EP EP15743516.5A patent/EP3101080B1/en active Active
- 2015-01-16 WO PCT/JP2015/051122 patent/WO2015115212A1/ja not_active Ceased