JP2015135966A - ヘテロ接合バイポーラトランジスタ用のエミッタコンタクトエピタキシャル構造およびオーミックコンタクト形成 - Google Patents
ヘテロ接合バイポーラトランジスタ用のエミッタコンタクトエピタキシャル構造およびオーミックコンタクト形成 Download PDFInfo
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- 230000015572 biosynthetic process Effects 0.000 title description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 74
- 238000000034 method Methods 0.000 claims abstract description 54
- 238000009792 diffusion process Methods 0.000 claims abstract description 41
- 239000010936 titanium Substances 0.000 claims abstract description 30
- 238000001465 metallisation Methods 0.000 claims abstract description 21
- 239000010931 gold Substances 0.000 claims abstract description 20
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 10
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052737 gold Inorganic materials 0.000 claims abstract description 5
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 60
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 claims description 60
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 54
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 48
- 239000000463 material Substances 0.000 claims description 25
- FTWRSWRBSVXQPI-UHFFFAOYSA-N alumanylidynearsane;gallanylidynearsane Chemical compound [As]#[Al].[As]#[Ga] FTWRSWRBSVXQPI-UHFFFAOYSA-N 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 229910052738 indium Inorganic materials 0.000 claims description 8
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 8
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 claims description 6
- 229910005540 GaP Inorganic materials 0.000 claims description 5
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 claims description 5
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 15
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000003877 atomic layer epitaxy Methods 0.000 description 2
- 238000004871 chemical beam epitaxy Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 230000005404 monopole Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- WNUPENMBHHEARK-UHFFFAOYSA-N silicon tungsten Chemical compound [Si].[W] WNUPENMBHHEARK-UHFFFAOYSA-N 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Abstract
【解決手段】ICデバイス300は、エミッタエピタキシャル構造の一部としての拡散制御層312を含む。ICデバイス300は、エミッタコンタクト及びベースコンタクトを同時に形成するための共通メタライズ手法を用いる。共通メタライズ構造は、第1白金(Pt)層316、326と、チタン(Ti)層318、328と、第2白金(Pt)層320、330と、金(Au)層322、332とを備える。
【選択図】図3
Description
Claims (21)
- ガリウム砒素(GaAs)ベース層と、
前記GaAsベース層の上に形成されるインジウムガリウム燐(InGaP)エミッタ層と、
インジウムガリウム砒素(InGaAs)層と、前記InGaAs層の上に形成される拡散制御層とを含み、前記InGaPエミッタ層の上に形成されるエミッタエピタキシャル構造と、
前記GaAsベース層および前記InGaPエミッタ層の少なくとも一方に結合されるベースコンタクトと、
前記拡散制御層に結合されるエミッタコンタクトと、を備える装置。 - 前記ベースコンタクトおよび前記エミッタコンタクトは、共通メタライズ構造を有する請求項1に記載の装置。
- 前記共通メタライズ構造は、
第1白金(Pt)層と、
前記第1Pt層の上に形成されるチタン(Ti)層と、
前記Ti層の上に形成される第2白金(Pt)層と、
前記第2Pt層の上に形成される金(Au)層と、
を備える請求項2に記載の装置。 - 前記エミッタコンタクトの前記第1Pt層は、前記拡散制御層を通じて前記InGaAs層の一部まで延びる請求項3に記載の装置。
- 前記拡散制御層は、InGaP、GaAs、インジウム燐(InP)、インジウムアルミニウム砒素(InAlAs)、アルミニウムガリウム砒素(AlGaAs)およびInGaAsの少なくとも一つを備える請求項1に記載の装置。
- 前記拡散制御層は、約300〜500Åの厚さを有するInGaP層である請求項5に記載の装置。
- 前記拡散制御層は、前記InGaPエミッタ層の厚さにほぼ等しい厚さを有するInGaP層である請求項5に記載の装置。
- 前記拡散制御層は、第1材料と第2材料とが交互に積層された層を有する超格子構造を備える請求項1に記載の装置。
- 前記第1材料は、InGaAsであり、
前記第2材料は、GaAs、インジウム燐(InP)、インジウムアルミニウム砒素(InAlAs)、InGaPおよびアルミニウムガリウム砒素(AlGaAs)の一つである請求項8に記載の装置。 - 前記超格子構造は、少なくとも3周期を含み、各周期は、約20〜100Åの厚さを有する前記第1材料の層と、約20〜100Åの厚さを有する前記第2材料の層とを備える請求項8に記載の装置。
- 前記エミッタエピタキシャル構造は、
前記InGaPエミッタ層の上に形成されるGaAs層と、
前記GaAs層の上に形成される傾斜InGaAs層と、をさらに備え、
前記InGaAs層は、前記傾斜InGaAs層の上に形成される請求項1に記載の装置。 - ガリウム砒素(GaAs)ベース層と、前記GaAsベース層上のインジウムガリウム燐(InGaP)エミッタ層と、インジウムガリウム砒素(InGaAs)層と、前記InGaAs層上の拡散制御層と、を含む基板を提供するステップと、
前記InGaPエミッタ層の少なくとも一部を露出させるために材料を選択的に除去するステップと、
ベースコンタクトおよびエミッタコンタクトを同時に形成するためのメタライズ工程を実行するステップと、を備える方法。 - 前記メタライズ工程を実行するステップは、
前記InGaPエミッタ層の露出した部分の上と、前記拡散制御層の少なくとも一部の上に第1白金(Pt)層を形成するステップと、
前記第1Pt層の上にチタン(Ti)層を形成するステップと、
前記Ti層の上に第2Pt層を形成するステップと、
前記第2Pt層の上に金(Au)層を形成するステップと、を備える請求項12に記載の方法。 - 前記メタライズ工程を実行するステップの前に、少なくともベースコンタクト領域およびエミッタコンタクト領域を規定するためのマスクを適用するステップをさらに備える請求項12に記載の方法。
- ガリウム砒素(GaAs)ベース層を形成するステップと、
前記GaAsベース層の上にインジウムガリウム燐(InGaP)エミッタ層を形成するステップと、
インジウムガリウム砒素(InGaAs)層を形成するステップと、
前記InGaAs層の上に拡散制御層を形成するステップと、を備える方法。 - 前記拡散制御層を形成するステップは、InGaP、GaAs、インジウム燐(InP)、インジウムアルミニウム砒素(InAlAs)、アルミニウムガリウム砒素(AlGaAs)およびInGaAsの少なくとも一つの層を形成するステップを含む請求項15に記載の方法。
- 前記拡散制御層を形成するステップは、前記InGaPエミッタ層の厚さにほぼ等しい厚さを有するInGaP層を形成するステップを含む請求項15に記載の方法。
- 前記拡散制御層を形成するステップは、第1材料および第2材料の層を交互に積層させて超格子構造を形成するステップをさらに備える請求項15に記載の方法。
- 前記第1材料は、InGaAsであり、前記第2材料は、GaAs、InP、InAlAs、InGaPおよびAlGaAsの一つである請求項16に記載の方法。
- 無線周波数(RF)信号を送信および受信するトランシーバと、
前記トランシーバ内に組み込まれ、または、前記トランシーバに結合されるヘテロ接合バイポーラトランジスタ(HBT)と、を備え、
前記HBTは、
ガリウム砒素(GaAs)ベース層と、
前記GaAsベース層の上に形成されるインジウムガリウム燐(InGaP)エミッタ層と、
インジウムガリウム砒素(InGaAs)層と、前記InGaAs層の上に形成される拡散制御層とを含み、前記InGaPエミッタ層の上に形成されるエミッタエピタキシャル構造と、
前記GaAsベース層および前記InGaPエミッタ層の少なくとも一方に結合されるベースコンタクトと、
前記拡散制御層に結合されるエミッタコンタクトと、を含むシステム。 - パワー増幅器およびパワーコンディショナの少なくとも一方をさらに備え、パワー増幅器およびパワーコンディショナの少なくとも一方が前記HBTを含む請求項20に記載のシステム。
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US14/157,096 US9231088B2 (en) | 2014-01-16 | 2014-01-16 | Emitter contact epitaxial structure and ohmic contact formation for heterojunction bipolar transistor |
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US9231088B2 (en) | 2014-01-16 | 2016-01-05 | Triquint Semiconductor, Inc. | Emitter contact epitaxial structure and ohmic contact formation for heterojunction bipolar transistor |
US10256329B2 (en) * | 2015-09-04 | 2019-04-09 | Win Semiconductors Corp. | Heterojunction bipolar transistor |
US9905678B2 (en) | 2016-02-17 | 2018-02-27 | Qorvo Us, Inc. | Semiconductor device with multiple HBTs having different emitter ballast resistances |
US10546852B2 (en) * | 2018-05-03 | 2020-01-28 | Qualcomm Incorporated | Integrated semiconductor devices and method of fabricating the same |
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JP2006210452A (ja) * | 2005-01-26 | 2006-08-10 | Sony Corp | 半導体装置 |
US9231088B2 (en) | 2014-01-16 | 2016-01-05 | Triquint Semiconductor, Inc. | Emitter contact epitaxial structure and ohmic contact formation for heterojunction bipolar transistor |
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JP2005260255A (ja) * | 1996-02-19 | 2005-09-22 | Sharp Corp | 化合物半導体装置及びその製造方法 |
JP2002525875A (ja) * | 1998-09-22 | 2002-08-13 | イギリス国 | 半導体装置 |
JP2003282583A (ja) * | 2002-03-26 | 2003-10-03 | Fujitsu Quantum Devices Ltd | ヘテロ接合バイポーラトランジスタ |
JP2006303244A (ja) * | 2005-04-21 | 2006-11-02 | Matsushita Electric Ind Co Ltd | ヘテロ接合バイポーラトランジスタ及びその製造方法 |
JP2007103925A (ja) * | 2005-09-12 | 2007-04-19 | Hitachi Cable Ltd | 半導体装置及びその製造方法 |
JP2007189200A (ja) * | 2005-12-13 | 2007-07-26 | Hitachi Cable Ltd | トランジスタ用エピタキシャルウエハおよびトランジスタ |
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JP6392128B2 (ja) | 2018-09-19 |
US20160049493A1 (en) | 2016-02-18 |
US9231088B2 (en) | 2016-01-05 |
DE102015000189A1 (de) | 2015-07-16 |
US20150200284A1 (en) | 2015-07-16 |
TWI655773B (zh) | 2019-04-01 |
US9608084B2 (en) | 2017-03-28 |
TW201530759A (zh) | 2015-08-01 |
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