JP2015076418A5 - - Google Patents

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Publication number
JP2015076418A5
JP2015076418A5 JP2013209535A JP2013209535A JP2015076418A5 JP 2015076418 A5 JP2015076418 A5 JP 2015076418A5 JP 2013209535 A JP2013209535 A JP 2013209535A JP 2013209535 A JP2013209535 A JP 2013209535A JP 2015076418 A5 JP2015076418 A5 JP 2015076418A5
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JP
Japan
Prior art keywords
ether
glycol
acetate
examples
ether acetate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013209535A
Other languages
English (en)
Japanese (ja)
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JP6191372B2 (ja
JP2015076418A (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2013209535A external-priority patent/JP6191372B2/ja
Priority to JP2013209535A priority Critical patent/JP6191372B2/ja
Priority to PCT/JP2014/073660 priority patent/WO2015049956A1/ja
Priority to US15/026,722 priority patent/US10037882B2/en
Priority to KR1020167006434A priority patent/KR102232715B1/ko
Priority to CN201480054698.3A priority patent/CN105612606B/zh
Priority to TW103134090A priority patent/TWI625322B/zh
Publication of JP2015076418A publication Critical patent/JP2015076418A/ja
Publication of JP2015076418A5 publication Critical patent/JP2015076418A5/ja
Publication of JP6191372B2 publication Critical patent/JP6191372B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013209535A 2013-10-04 2013-10-04 ウェハの洗浄方法 Active JP6191372B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2013209535A JP6191372B2 (ja) 2013-10-04 2013-10-04 ウェハの洗浄方法
CN201480054698.3A CN105612606B (zh) 2013-10-04 2014-09-08 晶片的清洗方法
US15/026,722 US10037882B2 (en) 2013-10-04 2014-09-08 Method for cleaning wafer
KR1020167006434A KR102232715B1 (ko) 2013-10-04 2014-09-08 웨이퍼의 세정 방법
PCT/JP2014/073660 WO2015049956A1 (ja) 2013-10-04 2014-09-08 ウェハの洗浄方法
TW103134090A TWI625322B (zh) 2013-10-04 2014-09-30 晶圓之洗淨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013209535A JP6191372B2 (ja) 2013-10-04 2013-10-04 ウェハの洗浄方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017111481A Division JP2017157863A (ja) 2017-06-06 2017-06-06 ウェハの洗浄方法

Publications (3)

Publication Number Publication Date
JP2015076418A JP2015076418A (ja) 2015-04-20
JP2015076418A5 true JP2015076418A5 (enExample) 2016-10-27
JP6191372B2 JP6191372B2 (ja) 2017-09-06

Family

ID=52778552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013209535A Active JP6191372B2 (ja) 2013-10-04 2013-10-04 ウェハの洗浄方法

Country Status (6)

Country Link
US (1) US10037882B2 (enExample)
JP (1) JP6191372B2 (enExample)
KR (1) KR102232715B1 (enExample)
CN (1) CN105612606B (enExample)
TW (1) TWI625322B (enExample)
WO (1) WO2015049956A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4743340B1 (ja) * 2009-10-28 2011-08-10 セントラル硝子株式会社 保護膜形成用薬液
KR102056139B1 (ko) * 2015-07-13 2019-12-16 후지필름 가부시키가이샤 패턴 구조의 처리 방법, 전자 디바이스의 제조 방법 및 패턴 구조의 붕괴 억제용 처리액
JP6897985B2 (ja) 2015-10-09 2021-07-07 日本電気株式会社 専用コアネットワーク(dcn)選択
WO2018058341A1 (en) * 2016-09-28 2018-04-05 Dow Global Technologies Llc Sulfoxide/glycol ether based solvents for use in the electronics industry
KR102519448B1 (ko) 2017-03-24 2023-04-07 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 표면 처리 방법 및 이를 위한 조성물
JP6963166B2 (ja) * 2017-04-17 2021-11-05 セントラル硝子株式会社 ウェハの表面処理方法及び該方法に用いる組成物
SG11202005938SA (en) 2018-01-05 2020-07-29 Fujifilm Electronic Materials Usa Inc Surface treatment compositions and methods
JP7274919B2 (ja) * 2019-04-11 2023-05-17 東京応化工業株式会社 洗浄液、及び金属レジストを備えた支持体の洗浄方法
CN115668459B (zh) * 2020-05-21 2025-12-16 中央硝子株式会社 半导体基板的表面处理方法及表面处理剂组合物
EP4155375A4 (en) * 2020-05-21 2024-07-24 Central Glass Company, Limited SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATES AND SURFACE TREATMENT AGENT COMPOSITION
CN116970446B (zh) * 2023-09-22 2024-01-09 山东天岳先进科技股份有限公司 碳化硅单晶材料amb覆铜的前处理溶液、产品及应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7838425B2 (en) 2008-06-16 2010-11-23 Kabushiki Kaisha Toshiba Method of treating surface of semiconductor substrate
JP4743340B1 (ja) 2009-10-28 2011-08-10 セントラル硝子株式会社 保護膜形成用薬液
JP5630385B2 (ja) * 2010-06-30 2014-11-26 セントラル硝子株式会社 保護膜形成用薬液及びウェハ表面の洗浄方法
JP2013118347A (ja) * 2010-12-28 2013-06-13 Central Glass Co Ltd ウェハの洗浄方法
US8828144B2 (en) 2010-12-28 2014-09-09 Central Grass Company, Limited Process for cleaning wafers
US20120164818A1 (en) 2010-12-28 2012-06-28 Central Glass Company, Limited Process for Cleaning Wafers
JP2013102109A (ja) 2011-01-12 2013-05-23 Central Glass Co Ltd 保護膜形成用薬液

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