JP2015076418A5 - - Google Patents

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Publication number
JP2015076418A5
JP2015076418A5 JP2013209535A JP2013209535A JP2015076418A5 JP 2015076418 A5 JP2015076418 A5 JP 2015076418A5 JP 2013209535 A JP2013209535 A JP 2013209535A JP 2013209535 A JP2013209535 A JP 2013209535A JP 2015076418 A5 JP2015076418 A5 JP 2015076418A5
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JP
Japan
Prior art keywords
ether
glycol
acetate
examples
ether acetate
Prior art date
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Granted
Application number
JP2013209535A
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English (en)
Japanese (ja)
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JP6191372B2 (ja
JP2015076418A (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2013209535A external-priority patent/JP6191372B2/ja
Priority to JP2013209535A priority Critical patent/JP6191372B2/ja
Priority to PCT/JP2014/073660 priority patent/WO2015049956A1/ja
Priority to KR1020167006434A priority patent/KR102232715B1/ko
Priority to CN201480054698.3A priority patent/CN105612606B/zh
Priority to US15/026,722 priority patent/US10037882B2/en
Priority to TW103134090A priority patent/TWI625322B/zh
Publication of JP2015076418A publication Critical patent/JP2015076418A/ja
Publication of JP2015076418A5 publication Critical patent/JP2015076418A5/ja
Publication of JP6191372B2 publication Critical patent/JP6191372B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013209535A 2013-10-04 2013-10-04 ウェハの洗浄方法 Active JP6191372B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2013209535A JP6191372B2 (ja) 2013-10-04 2013-10-04 ウェハの洗浄方法
US15/026,722 US10037882B2 (en) 2013-10-04 2014-09-08 Method for cleaning wafer
KR1020167006434A KR102232715B1 (ko) 2013-10-04 2014-09-08 웨이퍼의 세정 방법
CN201480054698.3A CN105612606B (zh) 2013-10-04 2014-09-08 晶片的清洗方法
PCT/JP2014/073660 WO2015049956A1 (ja) 2013-10-04 2014-09-08 ウェハの洗浄方法
TW103134090A TWI625322B (zh) 2013-10-04 2014-09-30 晶圓之洗淨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013209535A JP6191372B2 (ja) 2013-10-04 2013-10-04 ウェハの洗浄方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017111481A Division JP2017157863A (ja) 2017-06-06 2017-06-06 ウェハの洗浄方法

Publications (3)

Publication Number Publication Date
JP2015076418A JP2015076418A (ja) 2015-04-20
JP2015076418A5 true JP2015076418A5 (enExample) 2016-10-27
JP6191372B2 JP6191372B2 (ja) 2017-09-06

Family

ID=52778552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013209535A Active JP6191372B2 (ja) 2013-10-04 2013-10-04 ウェハの洗浄方法

Country Status (6)

Country Link
US (1) US10037882B2 (enExample)
JP (1) JP6191372B2 (enExample)
KR (1) KR102232715B1 (enExample)
CN (1) CN105612606B (enExample)
TW (1) TWI625322B (enExample)
WO (1) WO2015049956A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4743340B1 (ja) * 2009-10-28 2011-08-10 セントラル硝子株式会社 保護膜形成用薬液
JP6533576B2 (ja) * 2015-07-13 2019-06-19 富士フイルム株式会社 パターン構造の処理方法、電子デバイスの製造方法およびパターン構造の倒壊抑制用処理液
JP6897985B2 (ja) 2015-10-09 2021-07-07 日本電気株式会社 専用コアネットワーク(dcn)選択
WO2018058341A1 (en) * 2016-09-28 2018-04-05 Dow Global Technologies Llc Sulfoxide/glycol ether based solvents for use in the electronics industry
JP7452782B2 (ja) 2017-03-24 2024-03-19 フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド 表面処理方法およびそのための組成物
JP6963166B2 (ja) * 2017-04-17 2021-11-05 セントラル硝子株式会社 ウェハの表面処理方法及び該方法に用いる組成物
KR102724850B1 (ko) 2018-01-05 2024-10-31 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 표면 처리 조성물 및 방법
JP7274919B2 (ja) * 2019-04-11 2023-05-17 東京応化工業株式会社 洗浄液、及び金属レジストを備えた支持体の洗浄方法
KR20230015959A (ko) * 2020-05-21 2023-01-31 샌트랄 글래스 컴퍼니 리미티드 반도체 기판의 표면 처리 방법, 및 표면처리제 조성물
JP7727202B2 (ja) * 2020-05-21 2025-08-21 セントラル硝子株式会社 半導体基板の表面処理方法、及び表面処理剤組成物
CN116970446B (zh) * 2023-09-22 2024-01-09 山东天岳先进科技股份有限公司 碳化硅单晶材料amb覆铜的前处理溶液、产品及应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7838425B2 (en) 2008-06-16 2010-11-23 Kabushiki Kaisha Toshiba Method of treating surface of semiconductor substrate
JP4743340B1 (ja) 2009-10-28 2011-08-10 セントラル硝子株式会社 保護膜形成用薬液
JP5630385B2 (ja) * 2010-06-30 2014-11-26 セントラル硝子株式会社 保護膜形成用薬液及びウェハ表面の洗浄方法
US20120164818A1 (en) 2010-12-28 2012-06-28 Central Glass Company, Limited Process for Cleaning Wafers
JP2013118347A (ja) * 2010-12-28 2013-06-13 Central Glass Co Ltd ウェハの洗浄方法
US8828144B2 (en) 2010-12-28 2014-09-09 Central Grass Company, Limited Process for cleaning wafers
JP2013102109A (ja) * 2011-01-12 2013-05-23 Central Glass Co Ltd 保護膜形成用薬液

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