JP2015070170A - 発光装置及びその製造方法 - Google Patents
発光装置及びその製造方法 Download PDFInfo
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- JP2015070170A JP2015070170A JP2013204413A JP2013204413A JP2015070170A JP 2015070170 A JP2015070170 A JP 2015070170A JP 2013204413 A JP2013204413 A JP 2013204413A JP 2013204413 A JP2013204413 A JP 2013204413A JP 2015070170 A JP2015070170 A JP 2015070170A
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- light emitting
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 73
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 238000000034 method Methods 0.000 claims description 9
- 238000004528 spin coating Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 description 20
- 239000011347 resin Substances 0.000 description 20
- 238000009434 installation Methods 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 235000011837 pasties Nutrition 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Manufacturing & Machinery (AREA)
Abstract
Description
(発光装置の構成)
図1は、第1の実施の形態に係る発光装置1の垂直断面図である。
以下に、発光装置1の製造工程の一例を示す。
第2の実施の形態は、ダイボンディング材が透明である点において第1の実施の形態と異なる。なお、第1の実施の形態と同様の点については、説明を省略又は簡略化する。
図4は、第2の実施の形態に係る発光装置2の垂直断面図である。
ダイボンディング材21上に固定された複数の発光素子12と、発光素子12を囲むダム13と、ダム13の内側に充填され、発光素子12を封止する封止樹脂14とを有する。
上記の第1及び第2の実施の形態によれば、1つのダイボンディング材が複数の発光素子に共通して用いられるため、複数の発光素子が互いに近接している場合であっても、それらの設置位置がずれにくい。また、ダイボンディング材は光反射材としての機能を併せ持つことができる。
10 基板
11、21 ダイボンディング材
12 発光素子
Claims (6)
- 配線を有する基板上に設置されたシート状のダイボンディング材と、
前記ダイボンディング材上に固定された複数の発光素子と、
を有する発光装置。 - 前記ダイボンディング材は白色である、
請求項1に記載の発光装置。 - 前記基板と前記ダイボンディング材との間に光反射材を有し、
前記ダイボンディング材は透明である、
請求項1に記載の発光装置。 - 請求項1〜3のいずれか1項に記載された発光装置の製造方法であって、
前記基板上にペースト状の前記ダイボンディング材を塗布する工程と、
前記ペースト状のダイボンディング材上に前記複数の発光素子を設置する工程と、
前記複数の発光素子が設置された後、前記ダイボンディング材を硬化させ、前記複数の発光素子を固定する工程と、
を含む、発光装置の製造方法。 - 印刷により前記ペースト状のダイボンディング材を前記基板上に塗布する、
請求項4に記載の発光装置の製造方法。 - スピンコーティングにより前記ペースト状のダイボンディング材を前記基板上に塗布する、
請求項4に記載の発光装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013204413A JP2015070170A (ja) | 2013-09-30 | 2013-09-30 | 発光装置及びその製造方法 |
US14/290,737 US20150091025A1 (en) | 2013-09-30 | 2014-05-29 | Light-emitting device and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013204413A JP2015070170A (ja) | 2013-09-30 | 2013-09-30 | 発光装置及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2015070170A true JP2015070170A (ja) | 2015-04-13 |
Family
ID=52739224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013204413A Pending JP2015070170A (ja) | 2013-09-30 | 2013-09-30 | 発光装置及びその製造方法 |
Country Status (2)
Country | Link |
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US (1) | US20150091025A1 (ja) |
JP (1) | JP2015070170A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017112288A (ja) * | 2015-12-18 | 2017-06-22 | シチズン電子株式会社 | 発光装置 |
JP7386714B2 (ja) | 2019-01-11 | 2023-11-27 | シチズン時計株式会社 | Led発光装置及びその製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106356442A (zh) * | 2016-11-21 | 2017-01-25 | 莆田莆阳照明有限公司 | 一种led倒装晶片的全周光led灯 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11220179A (ja) * | 1998-02-03 | 1999-08-10 | Rohm Co Ltd | 半導体発光装置 |
JP2006179862A (ja) * | 2004-12-22 | 2006-07-06 | Opto Tech Corp | 発光ダイオードアレイパッケージ構造およびその方法 |
JP2009076516A (ja) * | 2007-09-19 | 2009-04-09 | Toshiba Lighting & Technology Corp | 照明装置 |
JP2010226099A (ja) * | 2009-02-27 | 2010-10-07 | Toshiba Lighting & Technology Corp | 発光モジュール |
JP2010251763A (ja) * | 2009-04-20 | 2010-11-04 | Yiguang Electronic Ind Co Ltd | 発光デバイス、電子デバイス及び発光装置 |
US20110089443A1 (en) * | 2009-10-15 | 2011-04-21 | Forward Electronics Co., Ltd. | Packaging Structure of AC light-emitting diodes |
WO2011099384A1 (ja) * | 2010-02-09 | 2011-08-18 | 日亜化学工業株式会社 | 発光装置および発光装置の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW567714B (en) * | 2001-07-09 | 2003-12-21 | Nippon Sheet Glass Co Ltd | Light-emitting unit and illumination device and image reading device using light-emitting unit |
JP4811927B2 (ja) * | 2006-03-23 | 2011-11-09 | ローム株式会社 | Led発光装置およびその製造方法 |
JP5158472B2 (ja) * | 2007-05-24 | 2013-03-06 | スタンレー電気株式会社 | 半導体発光装置 |
US8212271B2 (en) * | 2007-10-11 | 2012-07-03 | Hitachi Chemical Co., Ltd. | Substrate for mounting an optical semiconductor element, manufacturing method thereof, an optical semiconductor device, and manufacturing method thereof |
JP5289835B2 (ja) * | 2008-06-25 | 2013-09-11 | シャープ株式会社 | 発光装置およびその製造方法 |
US8773612B2 (en) * | 2009-02-27 | 2014-07-08 | Toshiba Lighting & Technology Corporation | Light emitting module and illumination apparatus |
JP5623062B2 (ja) * | 2009-11-13 | 2014-11-12 | シャープ株式会社 | 発光装置およびその製造方法 |
US8608340B2 (en) * | 2010-06-28 | 2013-12-17 | Toshiba Lighting & Technology Corporation | Light-emitting module and lighting apparatus with the same |
-
2013
- 2013-09-30 JP JP2013204413A patent/JP2015070170A/ja active Pending
-
2014
- 2014-05-29 US US14/290,737 patent/US20150091025A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11220179A (ja) * | 1998-02-03 | 1999-08-10 | Rohm Co Ltd | 半導体発光装置 |
JP2006179862A (ja) * | 2004-12-22 | 2006-07-06 | Opto Tech Corp | 発光ダイオードアレイパッケージ構造およびその方法 |
JP2009076516A (ja) * | 2007-09-19 | 2009-04-09 | Toshiba Lighting & Technology Corp | 照明装置 |
JP2010226099A (ja) * | 2009-02-27 | 2010-10-07 | Toshiba Lighting & Technology Corp | 発光モジュール |
JP2010251763A (ja) * | 2009-04-20 | 2010-11-04 | Yiguang Electronic Ind Co Ltd | 発光デバイス、電子デバイス及び発光装置 |
US20110089443A1 (en) * | 2009-10-15 | 2011-04-21 | Forward Electronics Co., Ltd. | Packaging Structure of AC light-emitting diodes |
WO2011099384A1 (ja) * | 2010-02-09 | 2011-08-18 | 日亜化学工業株式会社 | 発光装置および発光装置の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017112288A (ja) * | 2015-12-18 | 2017-06-22 | シチズン電子株式会社 | 発光装置 |
JP7386714B2 (ja) | 2019-01-11 | 2023-11-27 | シチズン時計株式会社 | Led発光装置及びその製造方法 |
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US20150091025A1 (en) | 2015-04-02 |
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