JP2015046534A5 - - Google Patents

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Publication number
JP2015046534A5
JP2015046534A5 JP2013177773A JP2013177773A JP2015046534A5 JP 2015046534 A5 JP2015046534 A5 JP 2015046534A5 JP 2013177773 A JP2013177773 A JP 2013177773A JP 2013177773 A JP2013177773 A JP 2013177773A JP 2015046534 A5 JP2015046534 A5 JP 2015046534A5
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JP
Japan
Prior art keywords
light emitting
light
emitting device
emitting element
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013177773A
Other languages
English (en)
Japanese (ja)
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JP6236999B2 (ja
JP2015046534A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2013177773A external-priority patent/JP6236999B2/ja
Priority to JP2013177773A priority Critical patent/JP6236999B2/ja
Priority to TW103127339A priority patent/TWI680592B/zh
Priority to KR1020140109369A priority patent/KR102161069B1/ko
Priority to CN201410424943.7A priority patent/CN104425701B/zh
Priority to US14/468,755 priority patent/US10109779B2/en
Priority to EP14182481.3A priority patent/EP2843718B1/en
Publication of JP2015046534A publication Critical patent/JP2015046534A/ja
Publication of JP2015046534A5 publication Critical patent/JP2015046534A5/ja
Publication of JP6236999B2 publication Critical patent/JP6236999B2/ja
Application granted granted Critical
Priority to US16/138,536 priority patent/US10622529B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013177773A 2013-08-29 2013-08-29 発光装置 Active JP6236999B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2013177773A JP6236999B2 (ja) 2013-08-29 2013-08-29 発光装置
TW103127339A TWI680592B (zh) 2013-08-29 2014-08-08 發光裝置
KR1020140109369A KR102161069B1 (ko) 2013-08-29 2014-08-22 발광 장치
US14/468,755 US10109779B2 (en) 2013-08-29 2014-08-26 Light emitting device
CN201410424943.7A CN104425701B (zh) 2013-08-29 2014-08-26 发光装置
EP14182481.3A EP2843718B1 (en) 2013-08-29 2014-08-27 Light emitting device
US16/138,536 US10622529B2 (en) 2013-08-29 2018-09-21 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013177773A JP6236999B2 (ja) 2013-08-29 2013-08-29 発光装置

Publications (3)

Publication Number Publication Date
JP2015046534A JP2015046534A (ja) 2015-03-12
JP2015046534A5 true JP2015046534A5 (enExample) 2016-09-23
JP6236999B2 JP6236999B2 (ja) 2017-11-29

Family

ID=51417185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013177773A Active JP6236999B2 (ja) 2013-08-29 2013-08-29 発光装置

Country Status (6)

Country Link
US (2) US10109779B2 (enExample)
EP (1) EP2843718B1 (enExample)
JP (1) JP6236999B2 (enExample)
KR (1) KR102161069B1 (enExample)
CN (1) CN104425701B (enExample)
TW (1) TWI680592B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10374134B2 (en) * 2015-05-29 2019-08-06 Nichia Corporation Light emitting device, method of manufacturing covering member, and method of manufacturing light emitting device
KR102674066B1 (ko) * 2016-11-11 2024-06-13 삼성전자주식회사 발광 소자 패키지
KR102406913B1 (ko) * 2017-03-27 2022-06-10 서울반도체 주식회사 발광 모듈
DE102017116279B4 (de) 2017-07-19 2023-08-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer Vielzahl von Konversionselementen und optoelektronisches Bauelement
CN112490224B (zh) * 2020-11-27 2025-04-08 广东晶科电子股份有限公司 一种发光装置及制作方法
TWI821731B (zh) * 2021-08-23 2023-11-11 啟端光電股份有限公司 底部發光型發光二極體顯示器

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI292961B (en) * 2002-09-05 2008-01-21 Nichia Corp Semiconductor device and an optical device using the semiconductor device
DE102004021233A1 (de) 2004-04-30 2005-12-01 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung
JP2006269448A (ja) * 2005-03-22 2006-10-05 Stanley Electric Co Ltd Ｌｅｄ
CN100486397C (zh) * 2005-04-19 2009-05-06 皇家飞利浦电子股份有限公司 包括红色发射陶瓷发光转换器的照明系统
TWI302041B (en) * 2006-01-19 2008-10-11 Everlight Electronics Co Ltd Light emitting diode packaging structure
JP4857791B2 (ja) * 2006-02-01 2012-01-18 日亜化学工業株式会社 半導体装置の製造方法
TWI331815B (en) * 2006-03-17 2010-10-11 Seoul Semiconductor Co Ltd Side-view light emitting diode package having a reflector
JP4952215B2 (ja) * 2006-08-17 2012-06-13 日亜化学工業株式会社 発光装置
JP5205773B2 (ja) 2006-11-07 2013-06-05 日亜化学工業株式会社 発光装置
JP2008187030A (ja) * 2007-01-30 2008-08-14 Stanley Electric Co Ltd 発光装置
JP5132961B2 (ja) * 2007-03-19 2013-01-30 ハリソン東芝ライティング株式会社 光半導体装置及びその製造方法
KR101374895B1 (ko) * 2007-03-31 2014-03-17 서울반도체 주식회사 측면 발광형 ｌｅｄ 패키지 및 그 제조방법
JP2009032746A (ja) * 2007-07-24 2009-02-12 Harison Toshiba Lighting Corp 発光装置及び発光ユニット
JP2009038184A (ja) * 2007-08-01 2009-02-19 Harison Toshiba Lighting Corp 半導体発光装置、光源装置及び面状発光装置
DE112008002540B4 (de) * 2007-09-28 2024-02-08 Seoul Semiconductor Co., Ltd. LED-Gehäuse und Hintergrundbeleuchtungseinheit unter Verwendung desselben
JP5277610B2 (ja) * 2007-10-29 2013-08-28 日亜化学工業株式会社 発光装置及び面発光装置並びに発光装置用パッケージ
WO2009075530A2 (en) 2007-12-13 2009-06-18 Amoleds Co., Ltd. Semiconductor and manufacturing method thereof
EP2246409B1 (en) * 2008-01-21 2014-04-16 Nichia Corporation Light emitting apparatus
JP2010003743A (ja) * 2008-06-18 2010-01-07 Toshiba Corp 発光装置
KR101537797B1 (ko) * 2008-06-26 2015-07-22 서울반도체 주식회사 발광장치
JP5294741B2 (ja) 2008-07-14 2013-09-18 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
TWI456784B (zh) 2008-07-29 2014-10-11 日亞化學工業股份有限公司 發光裝置
DE102008049399B4 (de) * 2008-09-29 2021-09-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement, optoelektronische Vorrichtung und Verfahren zur Herstellung eines optoelektronischen Bauelements
JP4808244B2 (ja) 2008-12-09 2011-11-02 スタンレー電気株式会社 半導体発光装置およびその製造方法
US8097894B2 (en) * 2009-07-23 2012-01-17 Koninklijke Philips Electronics N.V. LED with molded reflective sidewall coating
JP5496570B2 (ja) * 2009-08-05 2014-05-21 シャープ株式会社 発光装置
JP5251788B2 (ja) * 2009-08-25 2013-07-31 豊田合成株式会社 サイドビュータイプの発光装置及びその製造方法
JP5482098B2 (ja) * 2009-10-26 2014-04-23 日亜化学工業株式会社 発光装置
US8581287B2 (en) 2011-01-24 2013-11-12 Stanley Electric Co., Ltd. Semiconductor light emitting device having a reflective material, wavelength converting layer and optical plate with rough and plane surface regions, and method of manufacturing
JP5744643B2 (ja) 2011-06-28 2015-07-08 シチズン電子株式会社 発光装置の製造方法
JP2013077679A (ja) 2011-09-30 2013-04-25 Citizen Electronics Co Ltd 半導体発光装置とその製造方法
CN103975451B (zh) * 2012-07-18 2016-10-12 世迈克琉明有限公司 制造半导体发光器件的方法

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