JP2015042419A5 - - Google Patents

Download PDF

Info

Publication number
JP2015042419A5
JP2015042419A5 JP2014102808A JP2014102808A JP2015042419A5 JP 2015042419 A5 JP2015042419 A5 JP 2015042419A5 JP 2014102808 A JP2014102808 A JP 2014102808A JP 2014102808 A JP2014102808 A JP 2014102808A JP 2015042419 A5 JP2015042419 A5 JP 2015042419A5
Authority
JP
Japan
Prior art keywords
acid value
resin
alkali
dry film
unsaturated fatty
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014102808A
Other languages
English (en)
Japanese (ja)
Other versions
JP5915956B2 (ja
JP2015042419A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2014102808A external-priority patent/JP5915956B2/ja
Priority to JP2014102808A priority Critical patent/JP5915956B2/ja
Priority to TW103124886A priority patent/TWI542622B/zh
Priority to DE102014010775.2A priority patent/DE102014010775B4/de
Priority to KR1020140092404A priority patent/KR101709633B1/ko
Priority to CN201410359511.2A priority patent/CN104345555B/zh
Priority to US14/340,850 priority patent/US9415469B2/en
Publication of JP2015042419A publication Critical patent/JP2015042419A/ja
Publication of JP2015042419A5 publication Critical patent/JP2015042419A5/ja
Publication of JP5915956B2 publication Critical patent/JP5915956B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014102808A 2013-07-25 2014-04-25 半田バンプ形成用樹脂組成物、及び半田バンプ形成方法 Active JP5915956B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2014102808A JP5915956B2 (ja) 2013-07-25 2014-04-25 半田バンプ形成用樹脂組成物、及び半田バンプ形成方法
TW103124886A TWI542622B (zh) 2013-07-25 2014-07-21 銲料凸塊形成用樹脂組成物、銲料凸塊形成方法及具備銲料凸塊的構件
DE102014010775.2A DE102014010775B4 (de) 2013-07-25 2014-07-21 Harzzusammensetzung zur Lötpunktbildung, Lötpunkt-Bildungsverfahren und Bauelement mit Lötpunkten
KR1020140092404A KR101709633B1 (ko) 2013-07-25 2014-07-22 땜납 범프 형성용 수지 조성물, 땜납 범프 형성 방법, 및 땜납 범프를 구비한 부재
CN201410359511.2A CN104345555B (zh) 2013-07-25 2014-07-25 焊料凸点形成用树脂组合物、焊料凸点形成方法和具备焊料凸点的构件
US14/340,850 US9415469B2 (en) 2013-07-25 2014-07-25 Resin composition for solder bump formation, solder bump formation method, and member having solder bumps

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013154949 2013-07-25
JP2013154949 2013-07-25
JP2014102808A JP5915956B2 (ja) 2013-07-25 2014-04-25 半田バンプ形成用樹脂組成物、及び半田バンプ形成方法

Publications (3)

Publication Number Publication Date
JP2015042419A JP2015042419A (ja) 2015-03-05
JP2015042419A5 true JP2015042419A5 (enExample) 2015-04-16
JP5915956B2 JP5915956B2 (ja) 2016-05-11

Family

ID=52389525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014102808A Active JP5915956B2 (ja) 2013-07-25 2014-04-25 半田バンプ形成用樹脂組成物、及び半田バンプ形成方法

Country Status (6)

Country Link
US (1) US9415469B2 (enExample)
JP (1) JP5915956B2 (enExample)
KR (1) KR101709633B1 (enExample)
CN (1) CN104345555B (enExample)
DE (1) DE102014010775B4 (enExample)
TW (1) TWI542622B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102140523B1 (ko) * 2018-11-07 2020-08-04 주식회사 켐트로닉스 솔더 페이스트 조성물 및 솔더 범프 제조 방법
WO2020241687A1 (ja) * 2019-05-27 2020-12-03 千住金属工業株式会社 マレイン酸変性ロジンエステル又はマレイン酸変性ロジンアミドを含むフラックス用組成物、及びそれを含むフラックス、並びにはんだペースト
JP7529977B2 (ja) * 2019-05-27 2024-08-07 千住金属工業株式会社 マレイン酸変性ロジンエステル又はマレイン酸変性ロジンアミドを含むフラックス用組成物、及びそれを含むフラックス、並びにはんだペースト
JP7529976B2 (ja) * 2019-05-27 2024-08-07 千住金属工業株式会社 マレイン酸変性ロジンエステル又はマレイン酸変性ロジンアミドを含むフラックス用組成物、及びそれを含むフラックス、並びにはんだペースト
CN113811420B (zh) * 2019-05-27 2023-05-05 千住金属工业株式会社 包含马来酸改性松香酯或马来酸改性松香酰胺的助焊剂用组合物、和包含其的助焊剂、焊膏
EP4494803A1 (de) * 2023-07-20 2025-01-22 Heraeus Electronics GmbH & Co. KG Flussmittel und dieses umfassende lotpaste

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3787857B2 (ja) * 1995-03-10 2006-06-21 タムラ化研株式会社 回路基板はんだ付け用フラックス及び回路基板
JP3378139B2 (ja) * 1996-03-19 2003-02-17 株式会社デンソー はんだ付け用のフラックス
JP3390822B2 (ja) * 1996-08-29 2003-03-31 トヨタ自動車株式会社 回路基板はんだ付け用フラックス及び回路基板
JP3490225B2 (ja) * 1996-09-03 2004-01-26 三菱レイヨン株式会社 フラックス組成物
JP3056192B1 (ja) 1999-01-18 2000-06-26 富山日本電気株式会社 電極パッド上にバンプを形成したソルダーレジスト層付実装基板の製造方法
JP3423930B2 (ja) * 1999-12-27 2003-07-07 富士通株式会社 バンプ形成方法、電子部品、および半田ペースト
JP2008062252A (ja) 2006-09-05 2008-03-21 Denso Corp はんだ付け用フラックスおよびはんだペースト組成物
KR101473511B1 (ko) * 2007-10-09 2014-12-16 쇼와 덴코 가부시키가이샤 감광성 그래프트 폴리머 및 그것을 함유하는 감광성 수지 조성물
JP5387844B2 (ja) * 2008-11-13 2014-01-15 荒川化学工業株式会社 鉛フリーはんだ用フラックス組成物及び鉛フリーはんだペースト
JP5224550B2 (ja) * 2010-03-24 2013-07-03 ルネサスエレクトロニクス株式会社 半導体装置
JP2012004347A (ja) * 2010-06-17 2012-01-05 Harima Chem Inc はんだバンプ形成方法
TWI507400B (zh) * 2010-09-24 2015-11-11 Arakawa Chem Ind Solder rosin flux and solder paste for welding

Similar Documents

Publication Publication Date Title
JP2015042419A5 (enExample)
WO2016014648A3 (en) Polyimides as laser release materials for 3-d ic applications
PH12017500372B1 (en) Conductive adhesive composition
JP2017531471A5 (enExample)
WO2015187675A3 (en) Anti-reflective coating cleaning and post-etch residue removal composition having metal, dielectric and nitride compatibility
JP2018190491A5 (enExample)
JP2016537478A5 (enExample)
MX2016013504A (es) Composiciones de adhesion a base de agua de alto rendimiento y aplicaciones.
PH12017500879B1 (en) Solder paste and solder joint
JP2011212748A5 (enExample)
JP2016527342A5 (enExample)
WO2016118464A3 (en) Multiphasic particles fabricated by wettability engendered templated self-assembly (wets) methods
MY176799A (en) Photosensitive resin element
WO2017112453A3 (en) Acrylic polyvinyl acetal films comprising a second layer
JP2017177679A5 (enExample)
PH12015502734A1 (en) Adhesive sheet and method of manufacturing electronic component using the same
WO2014124272A3 (en) Removal of electronic chips and other components from printed wire boards using liquid heat media
SG11201804463WA (en) Antifouling coating composition, antifouling coating film, antifouling substrate, and method for producing antifouling substrate
WO2016204882A3 (en) Biodegradable microwave electronic devices
JP2014507538A5 (enExample)
JP2016221968A5 (enExample)
CN104694029B (zh) 一种smt贴片工艺
JP2012167160A5 (enExample)
PH12019501915A1 (en) Epoxy resin composition
PH12017500832A1 (en) Adhesive composition, semiconductor device containing cured product thereof, and method for manufacturing semiconductor device using same