JP2018176238A5 - - Google Patents
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- Publication number
- JP2018176238A5 JP2018176238A5 JP2017081369A JP2017081369A JP2018176238A5 JP 2018176238 A5 JP2018176238 A5 JP 2018176238A5 JP 2017081369 A JP2017081369 A JP 2017081369A JP 2017081369 A JP2017081369 A JP 2017081369A JP 2018176238 A5 JP2018176238 A5 JP 2018176238A5
- Authority
- JP
- Japan
- Prior art keywords
- flux composition
- solder
- flux
- solder paste
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 6
- 230000004907 flux Effects 0.000 claims 4
- 229910000679 solder Inorganic materials 0.000 claims 4
- PHXLONCQBNATSL-UHFFFAOYSA-N 2-[[2-hydroxy-5-methyl-3-(1-methylcyclohexyl)phenyl]methyl]-4-methyl-6-(1-methylcyclohexyl)phenol Chemical compound OC=1C(C2(C)CCCCC2)=CC(C)=CC=1CC(C=1O)=CC(C)=CC=1C1(C)CCCCC1 PHXLONCQBNATSL-UHFFFAOYSA-N 0.000 claims 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims 1
- 239000012190 activator Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 239000013008 thixotropic agent Substances 0.000 claims 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (16)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017081369A JP6531958B2 (ja) | 2017-04-17 | 2017-04-17 | フラックス組成物及びソルダペースト組成物 |
| PT187875570T PT3603879T (pt) | 2017-04-17 | 2018-04-12 | Composição de fundente e composição de pasta para soldar |
| US16/605,459 US11370069B2 (en) | 2017-04-17 | 2018-04-12 | Flux composition, solder paste composition, and solder joint |
| MYPI2019006101A MY181237A (en) | 2017-04-17 | 2018-04-12 | Flux composition, solder paste composition, and solder joint |
| PCT/JP2018/015366 WO2018193960A1 (ja) | 2017-04-17 | 2018-04-12 | フラックス組成物、ソルダペースト組成物、及びはんだ継手 |
| MX2019012366A MX376330B (es) | 2017-04-17 | 2018-04-12 | Composicion de fundente, composicion de pasta para soldar, y junta para soldar |
| PL18787557T PL3603879T3 (pl) | 2017-04-17 | 2018-04-12 | Kompozycja topnika i kompozycja pasty lutowniczej |
| KR1020197033671A KR102109667B1 (ko) | 2017-04-17 | 2018-04-12 | 플럭스 조성물, 솔더 페이스트 조성물, 및 납땜 이음 |
| EP18787557.0A EP3603879B1 (en) | 2017-04-17 | 2018-04-12 | Flux composition and solder paste composition |
| ES18787557T ES2844193T3 (es) | 2017-04-17 | 2018-04-12 | Composición de fundente y composición de pasta de soldadura |
| CN201880025625.XA CN110536771B (zh) | 2017-04-17 | 2018-04-12 | 助焊剂组合物、焊膏组合物 |
| BR112019020302-8A BR112019020302B1 (pt) | 2017-04-17 | 2018-04-12 | composições de fluxo e de pasta de solda |
| CA3060036A CA3060036C (en) | 2017-04-17 | 2018-04-12 | Flux composition, solder paste composition, and solder joint |
| HUE18787557A HUE054047T2 (hu) | 2017-04-17 | 2018-04-12 | Folyasztószer és forrasztópaszta készítmény |
| TW107112745A TWI704024B (zh) | 2017-04-17 | 2018-04-13 | 助焊劑組成物及焊料膏組成物 |
| PH12019502350A PH12019502350B1 (en) | 2017-04-17 | 2019-10-16 | Flux composition, solder paste composition, and solder joint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017081369A JP6531958B2 (ja) | 2017-04-17 | 2017-04-17 | フラックス組成物及びソルダペースト組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018176238A JP2018176238A (ja) | 2018-11-15 |
| JP2018176238A5 true JP2018176238A5 (enExample) | 2019-04-04 |
| JP6531958B2 JP6531958B2 (ja) | 2019-06-19 |
Family
ID=63856966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017081369A Active JP6531958B2 (ja) | 2017-04-17 | 2017-04-17 | フラックス組成物及びソルダペースト組成物 |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US11370069B2 (enExample) |
| EP (1) | EP3603879B1 (enExample) |
| JP (1) | JP6531958B2 (enExample) |
| KR (1) | KR102109667B1 (enExample) |
| CN (1) | CN110536771B (enExample) |
| BR (1) | BR112019020302B1 (enExample) |
| CA (1) | CA3060036C (enExample) |
| ES (1) | ES2844193T3 (enExample) |
| HU (1) | HUE054047T2 (enExample) |
| MX (1) | MX376330B (enExample) |
| MY (1) | MY181237A (enExample) |
| PH (1) | PH12019502350B1 (enExample) |
| PL (1) | PL3603879T3 (enExample) |
| PT (1) | PT3603879T (enExample) |
| TW (1) | TWI704024B (enExample) |
| WO (1) | WO2018193960A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6721850B1 (ja) * | 2019-05-27 | 2020-07-15 | 千住金属工業株式会社 | ソルダペースト |
| TWI733301B (zh) * | 2020-01-09 | 2021-07-11 | 廣化科技股份有限公司 | 焊料膏組成物及包含其之焊接方法 |
| JP6993594B2 (ja) * | 2020-03-27 | 2022-02-04 | 千住金属工業株式会社 | フラックス及びソルダペースト |
| JP6845452B1 (ja) * | 2020-03-30 | 2021-03-17 | 千住金属工業株式会社 | はんだ接合不良抑制剤、フラックスおよびソルダペースト |
| EP4144476A1 (de) | 2021-09-07 | 2023-03-08 | Heraeus Deutschland GmbH & Co. KG | Lotpaste |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4745037A (en) * | 1976-12-15 | 1988-05-17 | Allied Corporation | Homogeneous, ductile brazing foils |
| JP3066090B2 (ja) * | 1991-01-22 | 2000-07-17 | 山栄化学株式会社 | 液状プリフラックス組成物及びプリント配線板 |
| JP3061449B2 (ja) | 1991-06-19 | 2000-07-10 | 勝田化工株式会社 | はんだ付け用フラックス |
| JPH05185283A (ja) * | 1991-11-05 | 1993-07-27 | Metsuku Kk | はんだ付け用フラックス及びクリームはんだ |
| JPH0649272A (ja) * | 1992-07-31 | 1994-02-22 | Nippon Oil & Fats Co Ltd | 導電性組成物 |
| JPH1039453A (ja) * | 1996-07-18 | 1998-02-13 | Fuji Photo Film Co Ltd | 易開封性感光材料包装体及びその製造方法 |
| JP4447798B2 (ja) | 2001-03-23 | 2010-04-07 | タムラ化研株式会社 | ソルダペースト組成物及びリフローはんだ付方法 |
| JP4971601B2 (ja) * | 2005-07-05 | 2012-07-11 | 新日鐵化学株式会社 | ビニルベンジルエーテル化合物及び該化合物を必須成分とする樹脂組成物 |
| JP2007069260A (ja) | 2005-09-09 | 2007-03-22 | Uchihashi Estec Co Ltd | ヤニ入りはんだ用フラックス組成物及びヤニ入りはんだ |
| US10160064B2 (en) | 2013-08-12 | 2018-12-25 | Senju Metal Industry Co., Ltd. | Flux, solder paste and solder joint |
| JP5490959B1 (ja) * | 2013-11-18 | 2014-05-14 | ハリマ化成株式会社 | はんだフラックス用ロジンおよびそれを用いたはんだフラックス |
| CN108655610A (zh) * | 2018-04-17 | 2018-10-16 | 苏州捷德瑞精密机械有限公司 | 一种水基免洗抗菌防霉助焊剂及其制备方法 |
-
2017
- 2017-04-17 JP JP2017081369A patent/JP6531958B2/ja active Active
-
2018
- 2018-04-12 HU HUE18787557A patent/HUE054047T2/hu unknown
- 2018-04-12 PT PT187875570T patent/PT3603879T/pt unknown
- 2018-04-12 EP EP18787557.0A patent/EP3603879B1/en active Active
- 2018-04-12 MY MYPI2019006101A patent/MY181237A/en unknown
- 2018-04-12 CA CA3060036A patent/CA3060036C/en active Active
- 2018-04-12 KR KR1020197033671A patent/KR102109667B1/ko active Active
- 2018-04-12 ES ES18787557T patent/ES2844193T3/es active Active
- 2018-04-12 WO PCT/JP2018/015366 patent/WO2018193960A1/ja not_active Ceased
- 2018-04-12 US US16/605,459 patent/US11370069B2/en active Active
- 2018-04-12 CN CN201880025625.XA patent/CN110536771B/zh active Active
- 2018-04-12 MX MX2019012366A patent/MX376330B/es active IP Right Grant
- 2018-04-12 PL PL18787557T patent/PL3603879T3/pl unknown
- 2018-04-12 BR BR112019020302-8A patent/BR112019020302B1/pt active IP Right Grant
- 2018-04-13 TW TW107112745A patent/TWI704024B/zh active
-
2019
- 2019-10-16 PH PH12019502350A patent/PH12019502350B1/en unknown
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