JP2015040323A - 断熱壁体の製造方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 238000012545 processing Methods 0.000 claims abstract description 34
- 238000009413 insulation Methods 0.000 claims description 53
- 230000002093 peripheral effect Effects 0.000 claims description 29
- 238000005304 joining Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 29
- 239000011295 pitch Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 10
- 239000000463 material Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000010453 quartz Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- 230000011218 segmentation Effects 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000012736 aqueous medium Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011553 magnetic fluid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D11/00—Arrangement of elements for electric heating in or on furnaces
- F27D11/08—Heating by electric discharge, e.g. arc discharge
- F27D11/10—Disposition of electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/022—Mechanical pre-treatments, e.g. reshaping
- B29C66/0224—Mechanical pre-treatments, e.g. reshaping with removal of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/43—Joining a relatively small portion of the surface of said articles
- B29C66/432—Joining a relatively small portion of the surface of said articles for making tubular articles or closed loops, e.g. by joining several sheets ; for making hollow articles or hollow preforms
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D1/00—Casings; Linings; Walls; Roofs
- F27D1/0003—Linings or walls
- F27D1/0036—Linings or walls comprising means for supporting electric resistances in the furnace
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/62—Heating elements specially adapted for furnaces
- H05B3/66—Supports or mountings for heaters on or in the wall or roof
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Thermal Insulation (AREA)
- Chemical Vapour Deposition (AREA)
- Fluid Mechanics (AREA)
Abstract
【解決手段】内周面側にヒータエレメントの保持部が形成された筒状の断熱壁体の製造方法であって、板状の断熱部材を、一の表面から該一の表面の反対側の面である二の表面へと伸びる溝部が、所定のピッチで形成されるように加工する、第1工程と、前記断熱部材を、前記一の表面及び前記二の表面と、前記溝部が形成される面であって、前記溝部の深さ方向に垂直な三の表面と、が為す角度を、nが3以上の自然数である90+180/n度となるように加工する、第2工程と、前記断熱部材を分割断熱部材として複数個接合して筒状の前記断熱壁体を作成する工程であって、複数の前記分割断熱部材は、隣り合う前記分割断熱部材の前記溝部が対応すると共に、前記溝部によって筒状の前記断熱壁体の内周面側に前記保持部が形成されるように接合される、第3工程と、を含む、断熱壁体の製造方法。
【選択図】図1
Description
板状の断熱部材を、一の表面から該一の表面の反対側の面である二の表面へと伸びる溝部が、所定のピッチで形成されるように加工する、第1工程と、
前記断熱部材を、前記一の表面及び前記二の表面と、前記溝部が形成される面であって、前記溝部の深さ方向に垂直な三の表面と、が為す角度を、nが3以上の自然数である90+180/n度となるように加工する、第2工程と、
前記断熱部材を分割断熱部材として複数個接合して筒状の前記断熱壁体を作成する工程であって、複数の前記分割断熱部材は、隣り合う前記分割断熱部材の前記溝部が対応すると共に、前記溝部によって筒状の前記断熱壁体の内周面側に前記保持部が形成されるように接合される、第3工程と、
を含む、断熱壁体の製造方法。
先ず、本実施形態に係る断熱壁体を有する縦型熱処理装置の基本構成の一例について、説明する。なお、本明細書においては、一例として半導体装置を製造するための縦型熱処理装置の例について説明する。しかしながら、本発明はこの点において限定されず、他の種々のタイプの熱処理装置であっても良い。
前述した通り、ヒータ装置48は、筒体の断熱壁体50を有する。断熱壁体50は、例えば、熱伝導性が低く、柔らかい無定形のシリカ及びアルミナの混合物から形成することができる。なお、以後、本明細書において、「軸方向」、「周方向」及び「径方向」とは、各々、この筒体の断熱壁体50の軸方向、周方向及び径方向を指す。
次に、上述した本実施形態に係る断熱壁体の製造方法について、説明する。図3に、本実施形態に係る断熱壁体の製造方法の一例のフロー図を示す。また、図4に、本実施形態に係る断熱壁体の製造方法を説明するための概略図を示す。
内周面側にヒータエレメントの保持部が形成された筒状の断熱壁体の製造方法であって、
板状の断熱部材を、一の表面から該一の表面の反対側の面である二の表面へと伸びる溝部が所定のピッチで形成されるように加工する、第1工程(S100)と、
前記断熱部材を、前記一の表面及び前記二の表面と、前記溝部が形成される面であって、前記溝部の深さ方向に垂直な三の表面と、が為す角度を、90+180/n度となるように加工する、第2工程(S110)と、
前記第1工程及び前記第2工程を経て得られた分割断熱部材を複数個接合して筒状の前記断熱壁体を作成する工程であって、複数の前記分割断熱部材は、隣り合う前記分割断熱部材の前記溝部が対応すると共に、前記溝部によって筒状の前記断熱壁体の内周面側に前記保持部が形成されるように接合される、第3工程(S120)と、
を有する。
4 処理容器
6 外筒
8 内筒
28 ウエハボート
48 ヒータ装置
50 断熱壁体
51 保護カバー
52 分割断熱部材
54 ヒータエレメント
56 溝部
60 断熱部材
62 表面
W ウエハ
Claims (6)
- 内周面側にヒータエレメントの保持部が形成された筒状の断熱壁体の製造方法であって、
板状の断熱部材を、一の表面から該一の表面の反対側の面である二の表面へと伸びる溝部が、所定のピッチで形成されるように加工する、第1工程と、
前記断熱部材を、前記一の表面及び前記二の表面と、前記溝部が形成される面であって、前記溝部の深さ方向に垂直な三の表面と、が為す角度を、nが3以上の自然数である90+180/n度となるように加工する、第2工程と、
前記断熱部材を分割断熱部材として複数個接合して筒状の前記断熱壁体を作成する工程であって、複数の前記分割断熱部材は、隣り合う前記分割断熱部材の前記溝部が対応すると共に、前記溝部によって筒状の前記断熱壁体の内周面側に前記保持部が形成されるように接合される、第3工程と、
を含む、断熱壁体の製造方法。 - 前記第3工程における接合は、接着剤を利用して接着する工程、前記断熱壁体の外周面、頂面又は底面を、隣り合う前記分割断熱部材に亘ってピン状部材により固定する工程、隣り合う前記分割断熱部材の一方に凸部を形成し、他方に前記凸部に係合する凹部を形成する工程、又は、バンド部材によって前記断熱壁体の外周を覆う工程のいずれか1つの工程を含む、
請求項1に記載の断熱壁体の製造方法。 - 前記第3工程は、隣り合う前記分割断熱部材の接合面の間に、熱収縮可能な耐熱部材を配置する工程を含む、
請求項1又は2に記載の断熱壁体の製造方法。 - 前記第1工程において、前記溝部は、前記一の表面及び前記二の表面に垂直な方向に伸びるように形成される、
請求項1乃至3のいずれか一項に記載の断熱壁体の製造方法。 - 前記第1工程において、前記溝部は、前記一の表面及び前記二の表面に垂直な方向に対して、所定の角度を有して伸びるように形成される、
請求項1乃至3のいずれか一項に記載の断熱壁体の製造方法。 - 前記第3工程の前に、前記断熱壁体の内周面及び外周面の少なくとも一方に、R加工を施す工程を含む、
請求項1乃至5のいずれか一項に記載の断熱壁体の製造方法。
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JP2013171673A JP6091377B2 (ja) | 2013-08-21 | 2013-08-21 | 断熱壁体の製造方法 |
KR1020140102408A KR101833583B1 (ko) | 2013-08-21 | 2014-08-08 | 단열 벽체의 제조 방법 |
US14/458,309 US9466516B2 (en) | 2013-08-21 | 2014-08-13 | Method of manufacturing thermal insulation wall body |
TW103128377A TWI588903B (zh) | 2013-08-21 | 2014-08-19 | 隔熱壁體之製造方法 |
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JP2013171673A JP6091377B2 (ja) | 2013-08-21 | 2013-08-21 | 断熱壁体の製造方法 |
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JP6091377B2 JP6091377B2 (ja) | 2017-03-08 |
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US20150376789A1 (en) * | 2014-03-11 | 2015-12-31 | Tokyo Electron Limited | Vertical heat treatment apparatus and method of operating vertical heat treatment apparatus |
JP6952595B2 (ja) * | 2017-12-20 | 2021-10-20 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
WO2023055664A1 (en) * | 2021-09-29 | 2023-04-06 | The Florida State University Research Foundation, Inc. | High pressure furnace and methods of use |
Citations (7)
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US4489920A (en) * | 1983-05-20 | 1984-12-25 | Jones William R | Hot zone chamber wall arrangement for use in vacuum furnaces |
JPS63199414A (ja) * | 1987-02-14 | 1988-08-17 | Dainippon Screen Mfg Co Ltd | 基板の熱処理装置 |
JPS6448022U (ja) * | 1987-09-18 | 1989-03-24 | ||
JP2002270529A (ja) * | 2001-03-06 | 2002-09-20 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2004071619A (ja) * | 2002-08-01 | 2004-03-04 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2005209937A (ja) * | 2004-01-23 | 2005-08-04 | Koyo Thermo System Kk | 熱処理装置 |
JP2013007549A (ja) * | 2011-06-27 | 2013-01-10 | Tokyo Electron Ltd | 熱処理炉及び熱処理装置 |
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US5506389A (en) | 1993-11-10 | 1996-04-09 | Tokyo Electron Kabushiki Kaisha | Thermal processing furnace and fabrication method thereof |
SE9603965D0 (sv) * | 1996-10-30 | 1996-10-30 | Kanthal Ab | Electric furnace assembly |
JP2000182979A (ja) | 1998-12-11 | 2000-06-30 | Tokyo Electron Ltd | 被処理体支持具 |
SE528334C2 (sv) * | 2004-09-16 | 2006-10-24 | Sandvik Intellectual Property | Ugnsisolering samt ugn försedd med nämnda islering |
KR100817400B1 (ko) * | 2006-11-09 | 2008-03-27 | 권상환 | 열처리 장치 |
JP4331768B2 (ja) * | 2007-02-28 | 2009-09-16 | 東京エレクトロン株式会社 | 熱処理炉及び縦型熱処理装置 |
JP5104875B2 (ja) * | 2007-11-14 | 2012-12-19 | 株式会社村田製作所 | 熱電変換モジュール片、熱電変換モジュールおよびこれらの製造方法 |
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- 2014-08-13 US US14/458,309 patent/US9466516B2/en active Active
- 2014-08-19 TW TW103128377A patent/TWI588903B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4489920A (en) * | 1983-05-20 | 1984-12-25 | Jones William R | Hot zone chamber wall arrangement for use in vacuum furnaces |
JPS63199414A (ja) * | 1987-02-14 | 1988-08-17 | Dainippon Screen Mfg Co Ltd | 基板の熱処理装置 |
JPS6448022U (ja) * | 1987-09-18 | 1989-03-24 | ||
JP2002270529A (ja) * | 2001-03-06 | 2002-09-20 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2004071619A (ja) * | 2002-08-01 | 2004-03-04 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2005209937A (ja) * | 2004-01-23 | 2005-08-04 | Koyo Thermo System Kk | 熱処理装置 |
JP2013007549A (ja) * | 2011-06-27 | 2013-01-10 | Tokyo Electron Ltd | 熱処理炉及び熱処理装置 |
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TW201511134A (zh) | 2015-03-16 |
US9466516B2 (en) | 2016-10-11 |
KR20150021886A (ko) | 2015-03-03 |
KR101833583B1 (ko) | 2018-02-28 |
TWI588903B (zh) | 2017-06-21 |
JP6091377B2 (ja) | 2017-03-08 |
US20150053329A1 (en) | 2015-02-26 |
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