JP2015032780A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2015032780A5 JP2015032780A5 JP2013163185A JP2013163185A JP2015032780A5 JP 2015032780 A5 JP2015032780 A5 JP 2015032780A5 JP 2013163185 A JP2013163185 A JP 2013163185A JP 2013163185 A JP2013163185 A JP 2013163185A JP 2015032780 A5 JP2015032780 A5 JP 2015032780A5
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- gas
- processing
- discharge
- cleaning discharge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 claims description 46
- 238000005530 etching Methods 0.000 claims description 13
- 239000007795 chemical reaction product Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 229910052593 corundum Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 7
- 229910015844 BCl3 Inorganic materials 0.000 claims description 4
- 150000002500 ions Chemical class 0.000 claims description 4
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims 34
- 239000002184 metal Substances 0.000 claims 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 3
- 239000001301 oxygen Substances 0.000 claims 3
- 229910052760 oxygen Inorganic materials 0.000 claims 3
- 238000003672 processing method Methods 0.000 claims 3
- 238000007599 discharging Methods 0.000 claims 1
- 238000009832 plasma treatment Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013163185A JP2015032780A (ja) | 2013-08-06 | 2013-08-06 | プラズマ処理装置及びプラズマ処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013163185A JP2015032780A (ja) | 2013-08-06 | 2013-08-06 | プラズマ処理装置及びプラズマ処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015032780A JP2015032780A (ja) | 2015-02-16 |
| JP2015032780A5 true JP2015032780A5 (enExample) | 2016-09-23 |
Family
ID=52517836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013163185A Pending JP2015032780A (ja) | 2013-08-06 | 2013-08-06 | プラズマ処理装置及びプラズマ処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2015032780A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6609535B2 (ja) | 2016-09-21 | 2019-11-20 | 株式会社日立ハイテクノロジーズ | プラズマ処理方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001257197A (ja) * | 2000-03-10 | 2001-09-21 | Hitachi Ltd | 半導体デバイスの製造方法および製造装置 |
| JP2003332304A (ja) * | 2002-05-17 | 2003-11-21 | Sony Corp | ドライエッチング装置のクリーニング方法 |
| JP4464631B2 (ja) * | 2003-06-30 | 2010-05-19 | 株式会社日立製作所 | 半導体素子の製造方法 |
| JP2005056925A (ja) * | 2003-08-06 | 2005-03-03 | Hitachi Ltd | プラズマ処理装置および処理室内壁面安定化方法 |
| JP2008153365A (ja) * | 2006-12-15 | 2008-07-03 | Renesas Technology Corp | 半導体装置の製造方法 |
| JP5110987B2 (ja) * | 2007-07-05 | 2012-12-26 | 株式会社日立ハイテクノロジーズ | プラズマ処理方法およびコンピュータ読み取り可能な記録媒体 |
| JP5528391B2 (ja) * | 2011-05-02 | 2014-06-25 | パナソニック株式会社 | 基板のプラズマ処理方法 |
-
2013
- 2013-08-06 JP JP2013163185A patent/JP2015032780A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201614883A (en) | Method for treating workpieces | |
| EA201692408A1 (ru) | Способ обработки сапфирового материала пучком одно- и/или многозарядных ионов газа для получения антибликового материала | |
| TW201612977A (en) | Method for treating workpieces | |
| MX2018004893A (es) | Sistema de generacion de gas reactivo y metodo de tratamiento mediante el uso de gas reactivo. | |
| JP2011192872A5 (enExample) | ||
| SG10201908213VA (en) | Method and system for graphene formation | |
| WO2011006018A3 (en) | Apparatus and method for plasma processing | |
| JP2016092342A5 (enExample) | ||
| MX2015014996A (es) | Sistema y metodo para tratar sistemas de agua con descarga de alto voltaje y ozono. | |
| TW200608489A (en) | Plasma treatment method and plasma etching method | |
| JP2017208387A5 (enExample) | ||
| MX2015014659A (es) | Proceso y aparato para endurecer termoquimicamente piezas a trabajar. | |
| TW200718802A (en) | Method of using NF3 for removing surface deposits | |
| MX2016013268A (es) | Dispositivo y metodo para tratar material organico que contiene agua. | |
| MY197365A (en) | Apparatus and method for the plasma treatment of wafers | |
| JP2015201618A5 (enExample) | ||
| JP2012172208A5 (enExample) | ||
| JP2013201300A5 (ja) | 半導体装置の製造方法、基板処理装置、及びプログラム | |
| JP2008091409A5 (enExample) | ||
| TW200718479A (en) | Method of using sulfur fluoride for removing surface deposits | |
| TW201614757A (en) | Film forming method and film forming apparatus | |
| JP2007080850A5 (enExample) | ||
| MX2015014529A (es) | Aparato para el tratamiento por plasma de superficies y metodo para el tratamiento de superficies con plasma. | |
| US20150348760A1 (en) | Plasma equipment for treating powder | |
| MX2019006415A (es) | Dispisicion y proceso para tratar una superficie. |