JP2015026817A - セラミック電子部品およびその製造方法 - Google Patents
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- 239000000919 ceramic Substances 0.000 title claims abstract description 113
- 238000000034 method Methods 0.000 title claims description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 150
- 239000002184 metal Substances 0.000 claims abstract description 150
- 229920005989 resin Polymers 0.000 claims abstract description 58
- 239000011347 resin Substances 0.000 claims abstract description 58
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 32
- 239000000956 alloy Substances 0.000 claims abstract description 32
- 239000000203 mixture Substances 0.000 claims abstract description 16
- 238000002844 melting Methods 0.000 claims abstract description 10
- 230000008018 melting Effects 0.000 claims abstract description 10
- 239000002344 surface layer Substances 0.000 claims description 27
- 239000010410 layer Substances 0.000 claims description 23
- 238000005498 polishing Methods 0.000 claims description 17
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 29
- 238000004880 explosion Methods 0.000 abstract description 23
- 239000000945 filler Substances 0.000 description 27
- 230000000052 comparative effect Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- 229910052718 tin Inorganic materials 0.000 description 6
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000010304 firing Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000004455 differential thermal analysis Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/00—Metal working
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- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49085—Thermally variable
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- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
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Abstract
【解決手段】セラミック層と内部電極とが交互に積層された直方体状の積層体と、積層体の表面の一部に設けられて内部電極と電気的に接続された外部電極とを備える。外部電極は、積層体の表面の一部を覆って樹脂成分と金属成分との混合物からなる内側外部電極と、この内側外部電極を覆って金属成分からなる外側外部電極とを含む。内側外部電極は、金属成分として、一部が内部電極と合金を形成して内部電極と内側外部電極とを接続する第1の金属成分と、この第1の金属成分より融点が高く、一部が第1の金属成分と合金を形成して内側外部電極と外側外部電極とを接続する第2の金属成分とを含む。内側外部電極の表層金属濃度が17%以上である。
【選択図】図9
Description
本発明の一形態においては、第1の金属成分がSnである。
本発明の一形態においては、上記混合物において、第1の金属成分の含有率は、20重量%以上40重量%以下である。
各セラミック層150の厚さは、0.5μm以上10μm以下であることが好ましい。セラミック層150を構成する材料としては、BaTiO3、CaTiO3、SrTiO3またはCaZrO3などを主成分とする誘電体セラミックスを用いることができる。また、これらの主成分に、副成分として、Mn化合物、Fe化合物、Cr化合物、Co化合物またはNi化合物などが添加された材料を用いてもよい。
0.95mm以上1.20mm以下の長さ、0.45mm以上0.70mm以下の幅、および、0.45mm以上0.70mm以下の厚さの外形寸法を有する500個のセラミック電子部品を作製して実験を行なった。
Claims (12)
- セラミック層と内部電極とが交互に積層された直方体状の積層体と、
前記積層体の表面の一部に設けられて前記内部電極と電気的に接続された外部電極と
を備え、
前記外部電極は、前記積層体の前記表面の一部を覆って樹脂成分と金属成分との混合物からなる内側外部電極と、該内側外部電極を覆って金属成分からなる外側外部電極とを含み、
前記内側外部電極は、金属成分として、一部が前記内部電極と合金を形成して前記内部電極と前記内側外部電極とを接続する第1の金属成分と、該第1の金属成分より融点が高く、一部が前記第1の金属成分と合金を形成して前記内側外部電極と前記外側外部電極とを接続する第2の金属成分とを含み、
前記内側外部電極の表層金属濃度が17%以上である、セラミック電子部品。 - 前記外側外部電極の前記金属成分がNiである、請求項1に記載のセラミック電子部品。
- 前記第1の金属成分がSnである、請求項1または2に記載のセラミック電子部品。
- 前記第2の金属成分がAgまたはCuである、請求項1から3のいずれか1項に記載のセラミック電子部品。
- セラミック層と内部電極とが交互に積層された直方体状の積層体を準備する工程と、
前記内部電極と電気的に接続されるように前記積層体の表面の一部に外部電極を設ける工程と
を備え、
前記外部電極を設ける工程は、樹脂成分と金属成分との混合物を前記積層体の前記表面の一部を覆うように塗布し、前記混合物を塗布した前記積層体を加熱することにより内側外部電極を設ける工程と、該内側外部電極の表層をバレル研磨する工程と、該バレル研磨する工程後の前記内側外部電極を覆うように金属成分をめっきして外側外部電極を設ける工程とを含み、
前記内側外部電極の金属成分は、一部が前記内部電極と合金を形成して前記内部電極と前記内側外部電極とを接続する第1の金属成分と、該第1の金属成分より融点が高く、一部が前記第1の金属成分と合金を形成して前記内側外部電極と前記外側外部電極とを接続する第2の金属成分とを含み、
前記バレル研磨する工程後において、前記内側外部電極の表層金属濃度が17%以上である、セラミック電子部品の製造方法。 - 前記外側外部電極の前記金属成分がNiである、請求項5に記載のセラミック電子部品の製造方法。
- 前記第1の金属成分がSnである、請求項5または6に記載のセラミック電子部品の製造方法。
- 前記第2の金属成分がAgまたはCuである、請求項5から7のいずれか1項に記載のセラミック電子部品の製造方法。
- 前記混合物において、前記第1の金属成分の含有率は、20重量%以上40重量%以下である、請求項5から8のいずれか1項に記載のセラミック電子部品の製造方法。
- 前記混合物において、前記第2の金属成分の含有率は、30重量%以上70重量%以下である、請求項5から9のいずれか1項に記載のセラミック電子部品の製造方法。
- 前記内側外部電極を設ける工程において、前記積層体を加熱する温度が450℃以上である、請求項5から10のいずれか1項に記載のセラミック電子部品の製造方法。
- 前記内側外部電極を設ける工程において、100ppm以下の酸素濃度の雰囲気下にて前記積層体を加熱する、請求項5から11のいずれか1項に記載のセラミック電子部品の製造方法。
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JP2014089244A JP6112060B2 (ja) | 2013-06-19 | 2014-04-23 | セラミック電子部品およびその製造方法 |
CN201410252705.2A CN104240949B (zh) | 2013-06-19 | 2014-06-09 | 陶瓷电子部件及其制造方法 |
KR1020140070900A KR101647321B1 (ko) | 2013-06-19 | 2014-06-11 | 세라믹 전자부품 및 그 제조방법 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019021902A (ja) * | 2017-07-18 | 2019-02-07 | 太陽誘電株式会社 | 積層圧電素子、圧電振動装置、及び電子機器 |
JP2019220602A (ja) * | 2018-06-21 | 2019-12-26 | 株式会社村田製作所 | 電子部品および電子部品の製造方法 |
JP2020126896A (ja) * | 2019-02-01 | 2020-08-20 | Tdk株式会社 | セラミック電子部品 |
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US9202640B2 (en) * | 2011-10-31 | 2015-12-01 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and manufacturing method thereof |
JP2015026816A (ja) * | 2013-06-19 | 2015-02-05 | 株式会社村田製作所 | セラミック電子部品およびその製造方法 |
JP6112060B2 (ja) * | 2013-06-19 | 2017-04-12 | 株式会社村田製作所 | セラミック電子部品およびその製造方法 |
WO2014208376A1 (ja) * | 2013-06-24 | 2014-12-31 | 日本碍子株式会社 | セラミックスデバイス、及び圧電デバイス |
WO2016158743A1 (ja) * | 2015-03-30 | 2016-10-06 | 株式会社村田製作所 | マザーの圧電素子及び積層型圧電素子並びに積層型圧電素子の製造方法 |
JP6429027B2 (ja) * | 2015-09-15 | 2018-11-28 | Tdk株式会社 | 積層電子部品 |
TWM527148U (zh) * | 2016-03-29 | 2016-08-11 | Yageo Corp | 具有多個端電極的積層電容器 |
JP6465068B2 (ja) * | 2016-04-28 | 2019-02-06 | 株式会社村田製作所 | コイル部品 |
JP6984212B2 (ja) * | 2017-07-28 | 2021-12-17 | Tdk株式会社 | コイル部品 |
KR102463330B1 (ko) * | 2017-10-17 | 2022-11-04 | 삼성전기주식회사 | 코일 전자 부품 |
CN113728406B (zh) * | 2019-04-26 | 2023-05-23 | 株式会社村田制作所 | 电子部件和安装结构体 |
CN117074131A (zh) * | 2023-08-15 | 2023-11-17 | 广东微容电子科技有限公司 | 一种检测片式多层陶瓷电容器端部角裂的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004053901A1 (ja) * | 2002-12-09 | 2004-06-24 | Matsushita Electric Industrial Co., Ltd. | 外部電極を備えた電子部品 |
JP2008053488A (ja) * | 2006-08-25 | 2008-03-06 | Tdk Corp | 導電性ペースト、電子部品、積層セラミックコンデンサおよびその製造方法 |
JP2009200421A (ja) * | 2008-02-25 | 2009-09-03 | Tdk Corp | 電子部品の実装構造 |
JP2013118358A (ja) * | 2011-10-31 | 2013-06-13 | Murata Mfg Co Ltd | セラミック電子部品及びその製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007234800A (ja) * | 2006-02-28 | 2007-09-13 | Tdk Corp | 電子部品及びその製造方法 |
JP2008085280A (ja) * | 2006-09-26 | 2008-04-10 | Taiyo Yuden Co Ltd | 表面実装型電子部品とその製造方法 |
JP2012160586A (ja) * | 2011-02-01 | 2012-08-23 | Murata Mfg Co Ltd | 積層セラミック電子部品およびその製造方法 |
JP5664574B2 (ja) * | 2011-03-18 | 2015-02-04 | 株式会社村田製作所 | 積層セラミックコンデンサ |
US9202640B2 (en) * | 2011-10-31 | 2015-12-01 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and manufacturing method thereof |
US8988855B2 (en) * | 2011-10-31 | 2015-03-24 | Murata Manufacturing Co., Ltd. | Method of manufacturing ceramic electronic component including heating an electrode layer to form a conductive layer including an alloy particle |
KR101761936B1 (ko) * | 2012-03-13 | 2017-07-26 | 삼성전기주식회사 | 적층 세라믹 전자 부품 |
CN104246930B (zh) * | 2012-03-19 | 2018-04-06 | 株式会社村田制作所 | 陶瓷电子部件 |
KR102004759B1 (ko) * | 2012-06-11 | 2019-07-29 | 삼성전기주식회사 | 외부 전극용 도전성 페이스트 조성물 및 이를 이용한 적층 세라믹 전자부품. |
CN104823252B (zh) * | 2012-12-18 | 2018-04-06 | 株式会社村田制作所 | 层叠陶瓷电子部件 |
JP6112060B2 (ja) * | 2013-06-19 | 2017-04-12 | 株式会社村田製作所 | セラミック電子部品およびその製造方法 |
KR102007295B1 (ko) * | 2013-12-12 | 2019-08-05 | 삼성전기주식회사 | 적층 세라믹 커패시터, 그 제조방법 및 적층 세라믹 커패시터의 실장 기판 |
JP5958479B2 (ja) * | 2014-01-31 | 2016-08-02 | 株式会社村田製作所 | 電子部品の実装構造体 |
-
2014
- 2014-04-23 JP JP2014089244A patent/JP6112060B2/ja active Active
- 2014-06-09 CN CN201410252705.2A patent/CN104240949B/zh active Active
- 2014-06-11 KR KR1020140070900A patent/KR101647321B1/ko active IP Right Grant
- 2014-06-16 US US14/305,103 patent/US9672963B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004053901A1 (ja) * | 2002-12-09 | 2004-06-24 | Matsushita Electric Industrial Co., Ltd. | 外部電極を備えた電子部品 |
JP2008053488A (ja) * | 2006-08-25 | 2008-03-06 | Tdk Corp | 導電性ペースト、電子部品、積層セラミックコンデンサおよびその製造方法 |
JP2009200421A (ja) * | 2008-02-25 | 2009-09-03 | Tdk Corp | 電子部品の実装構造 |
JP2013118358A (ja) * | 2011-10-31 | 2013-06-13 | Murata Mfg Co Ltd | セラミック電子部品及びその製造方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019021902A (ja) * | 2017-07-18 | 2019-02-07 | 太陽誘電株式会社 | 積層圧電素子、圧電振動装置、及び電子機器 |
JP7125031B2 (ja) | 2017-07-18 | 2022-08-24 | 太陽誘電株式会社 | 積層圧電素子、圧電振動装置、及び電子機器 |
JP2019220602A (ja) * | 2018-06-21 | 2019-12-26 | 株式会社村田製作所 | 電子部品および電子部品の製造方法 |
JP2020126896A (ja) * | 2019-02-01 | 2020-08-20 | Tdk株式会社 | セラミック電子部品 |
JP7276646B2 (ja) | 2019-02-01 | 2023-05-18 | Tdk株式会社 | セラミック電子部品 |
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