JP2015018049A5 - - Google Patents
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- Publication number
- JP2015018049A5 JP2015018049A5 JP2013144034A JP2013144034A JP2015018049A5 JP 2015018049 A5 JP2015018049 A5 JP 2015018049A5 JP 2013144034 A JP2013144034 A JP 2013144034A JP 2013144034 A JP2013144034 A JP 2013144034A JP 2015018049 A5 JP2015018049 A5 JP 2015018049A5
- Authority
- JP
- Japan
- Prior art keywords
- diisocyanate
- diisocyanates
- isomers
- aromatic
- multimers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000005442 diisocyanate group Chemical group 0.000 description 5
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- LUYHWJKHJNFYGV-UHFFFAOYSA-N 1,2-diisocyanato-3-phenylbenzene Chemical compound O=C=NC1=CC=CC(C=2C=CC=CC=2)=C1N=C=O LUYHWJKHJNFYGV-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- WMTLVUCMBWBYSO-UHFFFAOYSA-N N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 WMTLVUCMBWBYSO-UHFFFAOYSA-N 0.000 description 1
- AXCSBFRIHQXBSG-UHFFFAOYSA-N N=C=O.N=C=O.C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 AXCSBFRIHQXBSG-UHFFFAOYSA-N 0.000 description 1
- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical compound C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013144034A JP6306296B2 (ja) | 2013-07-09 | 2013-07-09 | 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板 |
| CN201480039321.0A CN105378564B (zh) | 2013-07-09 | 2014-06-17 | 感光性热固性树脂组合物和柔性印刷电路板 |
| KR1020167003054A KR102372561B1 (ko) | 2013-07-09 | 2014-06-17 | 감광성 열경화성 수지 조성물 및 플렉시블 프린트 배선판 |
| PCT/JP2014/066078 WO2015005077A1 (ja) | 2013-07-09 | 2014-06-17 | 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板 |
| TW103122978A TWI637665B (zh) | 2013-07-09 | 2014-07-03 | Photosensitive thermosetting resin composition and flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013144034A JP6306296B2 (ja) | 2013-07-09 | 2013-07-09 | 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018041156A Division JP6547025B2 (ja) | 2018-03-07 | 2018-03-07 | 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015018049A JP2015018049A (ja) | 2015-01-29 |
| JP2015018049A5 true JP2015018049A5 (https=) | 2016-07-28 |
| JP6306296B2 JP6306296B2 (ja) | 2018-04-04 |
Family
ID=52279763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013144034A Active JP6306296B2 (ja) | 2013-07-09 | 2013-07-09 | 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6306296B2 (https=) |
| KR (1) | KR102372561B1 (https=) |
| CN (1) | CN105378564B (https=) |
| TW (1) | TWI637665B (https=) |
| WO (1) | WO2015005077A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6363861B2 (ja) * | 2014-03-31 | 2018-07-25 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにそれらを用いて形成された硬化被膜を有するプリント配線板 |
| TWI652281B (zh) * | 2015-02-18 | 2019-03-01 | 日商住友電木股份有限公司 | 含有光產鹼劑的光可成像聚烯烴組成物 |
| KR102040224B1 (ko) * | 2016-08-09 | 2019-11-06 | 주식회사 엘지화학 | 절연층 제조방법 및 다층인쇄회로기판 제조방법 |
| WO2018030761A1 (ko) * | 2016-08-09 | 2018-02-15 | 주식회사 엘지화학 | 절연층 제조방법 및 다층인쇄회로기판 제조방법 |
| WO2018043262A1 (ja) * | 2016-08-31 | 2018-03-08 | 富士フイルム株式会社 | パターン形成方法、積層体の製造方法および電子デバイスの製造方法 |
| WO2018088754A1 (ko) * | 2016-11-11 | 2018-05-17 | 주식회사 엘지화학 | 절연층 제조방법 및 다층인쇄회로기판 제조방법 |
| KR102040225B1 (ko) * | 2016-11-11 | 2019-11-06 | 주식회사 엘지화학 | 절연층 제조방법 및 다층인쇄회로기판 제조방법 |
| KR102207604B1 (ko) * | 2018-11-06 | 2021-01-26 | (주)이녹스첨단소재 | Fpic 필름 및 이의 제조방법 |
| CN110239163B (zh) * | 2019-06-13 | 2021-01-08 | 东莞市政潮电子科技有限公司 | 一种提高PI膜与Cu箔间粘结性能的柔性印刷电路板基材 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62263692A (ja) | 1986-05-12 | 1987-11-16 | ニツポン高度紙工業株式会社 | 耐熱性フレキシブルプリント配線板 |
| JPS63110224A (ja) | 1986-10-27 | 1988-05-14 | Dainippon Printing Co Ltd | フレキシブルオ−バ−レイフイルム |
| TW436491B (en) * | 1997-08-22 | 2001-05-28 | Ciba Sc Holding Ag | Compositions for use in base-catalysed reactions, a process for curing said compostions and a process for photochemically generating bases in base catalysed polymeriaztion reactions |
| JP4191956B2 (ja) * | 2002-05-24 | 2008-12-03 | サンノプコ株式会社 | 感光性樹脂組成物 |
| TWI398724B (zh) * | 2005-03-15 | 2013-06-11 | 東麗股份有限公司 | 感光性樹脂組成物 |
| WO2007004345A1 (ja) * | 2005-06-30 | 2007-01-11 | Toray Industries, Inc. | 感光性樹脂組成物および接着改良剤 |
| CN101466777A (zh) * | 2006-07-11 | 2009-06-24 | 日本化药株式会社 | 感光性碱水溶液可溶性聚酰亚胺树脂及含有该树脂的感光性树脂组合物 |
| JP5125747B2 (ja) * | 2007-05-25 | 2013-01-23 | 東レ株式会社 | 感光性樹脂組成物 |
| TW200908839A (en) * | 2007-08-09 | 2009-02-16 | Nichigo Morton Co Ltd | Solder mask, photoresist pattern forming method and the light-emitting device thereof |
| JP2009258471A (ja) * | 2008-04-18 | 2009-11-05 | Toray Ind Inc | 感光性樹脂組成物フィルムおよびそれを用いたレジスト形成方法 |
| JP5402332B2 (ja) * | 2009-07-09 | 2014-01-29 | 東レ株式会社 | 感光性樹脂組成物、感光性樹脂組成物フィルムおよびそれを用いた多層配線基板 |
| CN102985505B (zh) * | 2010-07-09 | 2014-08-20 | 东丽株式会社 | 感光性粘合剂组合物、感光性粘合剂膜和使用它们的半导体装置 |
| JP5740915B2 (ja) * | 2010-10-28 | 2015-07-01 | 東レ株式会社 | フィルム積層体 |
| WO2013171888A1 (ja) * | 2012-05-17 | 2013-11-21 | 太陽インキ製造株式会社 | アルカリ現像型の熱硬化性樹脂組成物、プリント配線板 |
-
2013
- 2013-07-09 JP JP2013144034A patent/JP6306296B2/ja active Active
-
2014
- 2014-06-17 WO PCT/JP2014/066078 patent/WO2015005077A1/ja not_active Ceased
- 2014-06-17 KR KR1020167003054A patent/KR102372561B1/ko active Active
- 2014-06-17 CN CN201480039321.0A patent/CN105378564B/zh active Active
- 2014-07-03 TW TW103122978A patent/TWI637665B/zh active
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